Infineon Technologies CY7C1460KVE33-167AXI
- Part No.:
- CY7C1460KVE33-167AXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1460KVE33-167AXI.pdf
- Description:
- IC SRAM 36MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1460KVE33 from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, on-chip ECC, and 167 MHz operation (3.4 ns access time). It supports zero-wait-state back-to-back read/write cycles in high-throughput networking and telecom data-path buffers, featuring fully registered I/O, byte-write capability, and 3.3-V core / 3.3-V or 2.5-V I/O supply.
For engineers reviewing the CY7C1460KVE33 datasheet, CY7C1460KVE33 pinout, CY7C1460KVE33 application, or CY7C1460KVE33 equivalent, key selection criteria include burst order configuration (linear/interleaved), ECC-enabled soft-error resilience, synchronous self-timed write timing, and TQFP-100 or FBGA-165 package compatibility for space-constrained routing.
Technical Context
The device implements a fully synchronous, rising-edge-triggered pipeline with input and output registers clocked by CLK (qualified by CEN), enabling deterministic timing across all operations. Address, control, and data inputs are latched on CLK's rising edge; outputs are registered and driven synchronously, eliminating asynchronous OE dependency.
NoBL™ logic enables true back-to-back read/write transitions without bus turnaround latency, while on-chip ECC encoder/decoder corrects single-bit errors and detects double-bit errors per 36-bit word. Burst addressing supports both linear and interleaved orders via the MODE strap pin, configurable at power-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) |
| Max Clock Frequency | 167 MHz - defines maximum sustained burst throughput of 600 MB/s (36-bit bus) |
| Access Time | 3.4 ns - guaranteed clock-to-output delay under worst-case 167 MHz conditions |
| VDD Supply | 3.3 V ±0.3 V - core voltage requirement; separate VDDQ pins support 3.3 V or 2.5 V I/O interface |
| ECC Function | On-chip SEC-DED - corrects single-bit errors and detects double-bit errors per 36-bit word |
| Burst Capability | Linear or interleaved - selected by MODE pin; determines address increment pattern during burst reads/writes |
| Power Dissipation | 190 mA (max operating current at 167 MHz, ×36 mode) - sets thermal budget for dense memory subsystems |
Pinout & Package
Package: 100-pin JEDEC-standard Pb-free TQFP (14 mm × 14 mm, 0.5 mm pitch) and 165-ball FBGA (13 mm × 15 mm, 0.8 mm ball pitch).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Input | 20-bit synchronous address bus; sampled on rising CLK edge to select one of 1M locations |
| DQa–DQd, DQPa–DQPd | Data I/O (36-bit + 4-bit parity) | 36-bit bidirectional data bus plus 4 parity bits; each byte group (DQa/DQPa etc.) controlled by dedicated BWx signal |
| BWa–BWd | Byte Write Select | Active-low synchronous controls for 8-bit sub-word writes; enables partial writes without read-modify-write overhead |
| CLK, CEN | Clock & Enable | CLK qualified by CEN; CEN deassertion extends previous cycle without losing state or requiring re-synchronization |
| CE1, CE2, CE3 | Chip Enable Group | Three-level synchronous chip select (active LOW/HIGH/LOW); enables bank isolation in multi-SRAM systems |
| MODE | Burst Order Strap | Static configuration pin: HIGH = interleaved burst, LOW = linear burst; must be stable before initialization |
| ADV/LD | Burst Counter Control | Advances internal address counter when HIGH; loads new address when LOW - critical for burst sequence management |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables consecutive read/write operations with no wait states - eliminates pipeline stalls in burst-intensive data buffering |
| Synchronous Self-Timed Writes | Internal write timing control ensures reliable data capture without external write-strobe coordination or setup/hold tuning |
| IEEE 1149.1 JTAG Boundary Scan | Supports production test and board-level diagnostics via TCK/TMS/TDI/TDO pins - no additional test pads required |
| "ZZ" Sleep Mode | Low-power standby state reducing ICC to <50 µA - preserves data while cutting dynamic power during idle periods |
| Output Enable Masking | OE is automatically overridden during write-data phase and chip deselection - prevents bus contention without external logic |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
Use Scenario: High-speed packet buffering in 10G/40G Ethernet line cards where deterministic latency and error resilience are mandatory. IC Role / Device Role / Timing Role: Primary data-path SRAM serving as ingress/egress FIFO with ECC-protected storage and zero-turnaround burst transfers. Use Value: Eliminates bus turnaround delays between successive packet writes/reads, sustaining full 167 MHz throughput while correcting cosmic-ray-induced bit flips. | Use Scenario: Deep buffer storage in enterprise switch ASIC co-processors handling variable-length packet bursts. IC Role / Device Role / Timing Role: Pipelined burst SRAM interfacing directly to switch fabric controller with synchronous clock domain alignment. Use Value: Fully registered I/O and self-timed writes guarantee timing closure at 167 MHz, avoiding external latch logic and simplifying PCB layout. |
| Radar Signal Processing | Industrial PLC Data Logging |
Use Scenario: Real-time intermediate storage of digitized RF samples in phased-array radar front-ends operating in harsh EMI environments. IC Role / Device Role / Timing Role: ECC-protected SRAM capturing ADC output streams with strict jitter tolerance and deterministic access timing. Use Value: On-chip SEC-DED reduces uncorrectable errors by >99% versus non-ECC SRAM, meeting DO-254 reliability targets for avionics-adjacent systems. | Use Scenario: Non-volatile event logging buffer in programmable logic controllers requiring long-term data integrity without battery backup. IC Role / Device Role / Timing Role: High-reliability SRAM used as circular buffer for alarm timestamps and sensor snapshots with periodic flash offload. Use Value: "ZZ" sleep mode cuts quiescent current to microamps during idle intervals, extending system uptime in energy-constrained industrial deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-167BLI | No on-chip ECC; 167 MHz speed grade but lacks SEC-DED encoding/decoding logic | Suitable for cost-sensitive applications where soft-error rate is not mission-critical | Select if ECC is unnecessary and BGA-165 footprint compatibility is required |
| CY7C1462KVE33-167AXI | 2M × 18 organization (same density, different width); only two byte-write enables (BWa/BWb) instead of four | Better suited for 18-bit datapath systems (e.g., legacy DSP interfaces) rather than 36-bit wide buses | Choose when narrower bus width and reduced pin count are prioritized over byte-granular 36-bit writes |
Compared with IS61WV102436BLL-167BLI and CY7C1462KVE33-167AXI, the CY7C1460KVE33 uniquely delivers 36-bit-wide ECC protection and full four-byte write select granularity - essential for high-integrity, wide-bus telecom and defense applications where data corruption risk must be minimized at the silicon level.
Availability
CY7C1460KVE33 is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, and radar signal processing systems requiring stable component supply, long-lifecycle support, and traceable sourcing of ECC-enabled SRAMs.
Supply support for CY7C1460KVE33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets.
The CY7C1460KVE33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth data-path buffering in systems demanding deterministic timing and radiation-hardened reliability.
FAQ
What is the function of the MODE pin, and how should it be configured?
The MODE pin selects burst address order: HIGH enables interleaved burst, LOW enables linear burst. It is a strap pin sampled at power-up and must remain static during operation. Floating defaults to HIGH (interleaved). Configuration is fixed per power cycle and cannot be changed dynamically without reset.
Does CY7C1460KVE33 require external termination or impedance matching on DQ lines?
No external termination is required. The device integrates programmable drive strength and on-die termination (ODT) support via internal calibration circuitry. Layout guidelines recommend controlled-impedance traces (50 Ω single-ended) and proper VDDQ decoupling, but no discrete resistors are needed for signal integrity at 167 MHz.
How does the "ZZ" sleep mode interact with data retention and wake-up timing?
In ZZ mode, the device retains all stored data with ICC reduced to ≤50 µA. Wake-up is synchronous: the first valid CLK edge after ZZ deassertion initiates internal recovery, and full functionality resumes within one clock cycle - no additional stabilization delay is required before issuing commands.
Can the CY7C1460KVE33 operate with mixed VDDQ voltages (e.g., 3.3 V on DQa/DQb, 2.5 V on DQc/DQd)?
No. VDDQ is a single-supply rail shared across all DQ groups. The device supports either 3.3 V or 2.5 V I/O operation globally - not per-byte-group. Voltage selection is determined by the VDDQ supply applied to the designated VDDQ pins; mixing voltages violates absolute maximum ratings and risks latch-up.
CY7C1460KVE33-167AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1460KVE33-167AXI FAQ
1.How can I place an order for CY7C1460KVE33-167AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1460KVE33-167AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1460KVE33-167AXI reliable?
The price and inventory of CY7C1460KVE33-167AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KVE33-167AXI is usually 5 days.
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5.How can I obtain technical support or documentation for CY7C1460KVE33-167AXI?
For technical support, including CY7C1460KVE33-167AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KVE33-167AXI requirements.
6.How does Aetrix verify that CY7C1460KVE33-167AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1460KVE33-167AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KVE33-167AXI meets industry standards.
7.What is the process for return or replacement of CY7C1460KVE33-167AXI?
All CY7C1460KVE33-167AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KVE33-167AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1460KVE33-167AXI part is unused and in its original packaging.
Return procedure for CY7C1460KVE33-167AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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