Infineon Technologies CY7C1460KVE33-167BZC

Overview

CY7C1460KVE33-167BZC from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, ECC support, and 167 MHz maximum bus operation. It delivers zero wait-state back-to-back read/write capability, 3.3-V core supply with 3.3-V/2.5-V I/O compatibility, and 3.4 ns max access time - deployed in high-throughput network packet buffers and telecom line card control memory.

For engineers reviewing the CY7C1460KVE33-167BZC datasheet, CY7C1460KVE33-167BZC pinout, CY7C1460KVE33-167BZC application, or CY7C1460KVE33-167BZC equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write select mapping to DQ/DQP groups, synchronous self-timed write timing, JTAG boundary-scan testability, and ECC correction latency impact on system-level error recovery.

Technical Context

This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK (qualified by CEN), and all outputs pass through output registers synchronized to the same clock edge. The internal NoBL™ logic eliminates bus turnaround latency by enabling consecutive read/write operations without pipeline stalls.

Burst addressing is configurable via the MODE strap pin (interleaved or linear), and writes are controlled by four independent byte-write enables (BWa–BWd) paired with WE, each governing one 9-bit data/parity group (DQa/DQPa through DQd/DQPd). On-chip ECC encodes/decodes 36-bit data + 8-bit parity per access, correcting single-bit errors and detecting double-bit errors in real time.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (JEDEC-standard Pb-free), body size 14 mm × 14 mm, 0.5 mm pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with AS7C362000B-167BIN and IS61WV102436B-167TQLI, the CY7C1460KVE33-167BZC uniquely combines ECC, dual-voltage I/O, JTAG, and TQFP packaging - making it optimal for telecom and industrial systems demanding concurrent reliability, testability, and voltage interoperability.

Availability

CY7C1460KVE33-167BZC is available at Aetrix Electronics and suitable for telecom line card buffering, network packet processing, and industrial PLC control memory requiring stable component supply across extended product lifecycles.

Supply support for CY7C1460KVE33-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.

The CY7C1460KVE33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput memory subsystems in networking and real-time control applications.

FAQ

What is the function of the MODE pin, and how does it affect burst addressing?

The MODE pin is a static strap input that configures burst order: HIGH selects interleaved burst (e.g., 0, 8, 4, 12…), LOW selects linear burst (e.g., 0, 1, 2, 3…). It must be stable before device initialization and cannot change during operation. Interleaved mode aligns with cache-line fetch patterns in many processors, while linear mode suits sequential DMA transfers.

How does the on-chip ECC operate, and what error conditions does it handle?

The ECC logic generates and checks 8-bit parity over each 36-bit word. It corrects any single-bit error (SEC) and detects any double-bit error (DED) within the same word. Correction occurs transparently during read cycles; detected double-bit errors assert no valid data - requiring system-level error handling. ECC is always active and cannot be disabled.

Can CY7C1460KVE33-167BZC operate with 2.5-V I/O while maintaining 3.3-V core supply?

Yes - VDD is fixed at 3.3 V ± 0.3 V for core logic, while VDDQ accepts either 3.3 V or 2.5 V ± 0.2 V for I/O buffers. This allows direct interfacing with 2.5-V FPGAs or ASICs without level shifters, reducing BOM count and signal integrity risk. I/O voltage must be set before initialization and remain stable.

What is the role of ADV/LD during burst operations, and how does it interact with CE signals?

ADV/LD controls the internal burst counter: HIGH advances the counter for next-address auto-increment; LOW loads a new starting address. It functions only when the device is selected (CE1/CE3 = LOW, CE2 = HIGH) and CEN = LOW. During deselection, ADV/LD must be driven LOW to prepare for next access - ensuring deterministic address loading after chip enable reassertion.