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Infineon Technologies CY7C1460KVE33-200AXC

Part No.:
CY7C1460KVE33-200AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1460KVE33-200AXC.pdf
Description:
IC SRAM 36MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,218

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Product details

Overview

CY7C1460KVE33 from Cypress Semiconductor is a 36-Mbit (1M × 36) synchronous pipelined SRAM with NoBL™ architecture, integrated ECC, 3.3-V core supply, 2.5/3.3-V I/O support, and 200-MHz operation (3.2-ns access time). It serves as a high-throughput memory buffer in network packet processors requiring zero-wait-state back-to-back read/write transitions.

For engineers reviewing the CY7C1460KVE33 datasheet, CY7C1460KVE33 pinout, CY7C1460KVE33 application, or CY7C1460KVE33 equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write granularity (BWa–BWd), synchronous self-timed write timing, JTAG boundary-scan capability, and ECC-enabled soft-error resilience in telecom infrastructure.

Technical Context

This SRAM implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK (qualified by CEN), and all outputs are driven from output registers synchronized to the same clock edge. The internal NoBL logic eliminates bus turnaround latency between consecutive reads and writes.

Burst addressing is configurable via MODE pin (interleaved or linear), and on-chip ECC encodes/decodes parity across DQa–DQd and corresponding DQPa–DQPd lines to detect and correct single-bit errors. Write operations are self-timed and qualified by WE and four independent byte-write enables.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (1M × 36 organization)
Max Clock Frequency200 MHz - supports sustained 200-MHz bus cycles with zero wait states
Access Time3.2 ns - defines minimum clock-to-output delay for read operations at 200 MHz
Supply VoltagesVDD = 3.3 V ± 0.3 V (core); VDDQ = 2.5 V or 3.3 V (I/O) - enables mixed-voltage system interfacing
ECC SupportOn-chip encoder/decoder for single-bit error correction - reduces SER in radiation-prone telecom environments
Burst CapabilityLinear or interleaved burst order - selected by MODE pin; determines address increment pattern during burst accesses
Byte Write ControlFour independent BWa–BWd signals - enable selective 8-bit writes to each DQx/DQPx byte lane without masking

Pinout & Package

Package: 100-pin TQFP (JEDEC-standard Pb-free), 14 × 14 mm body, 0.5-mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
A0–A19Address Input20-bit synchronous address bus sampled on rising CLK edge; selects one of 1M locations
BWa–BWdByte Write SelectActive-low synchronous controls for DQa/DQPa, DQb/DQPb, DQc/DQPc, DQd/DQPd - enables granular 8-bit writes
CLK, CENClock & EnableCLK qualified by active-low CEN; deasserting CEN extends previous cycle without deselecting device
DQa–DQd, DQPa–DQPdData I/O & Parity32-bit data + 4-bit parity bidirectional bus; parity lines mirror data lanes for ECC encoding/decoding
CE1, CE2, CE3Chip EnableThree-level synchronous chip select (CE1/CE3 active-low, CE2 active-high) - enables multi-bank memory decoding
MODEBurst ConfigurationStrap pin setting burst order: HIGH = interleaved, LOW = linear; must remain static during operation
TCK/TMS/TDI/TDOJTAG InterfaceIEEE 1149.1-compliant boundary-scan test interface - supports production testing and debug visibility

Key Features

FeatureDesign Value
NoBL™ ArchitectureEnables true back-to-back read/write operations with no bus turnaround latency - sustains full 200-MHz throughput
Synchronous Self-Timed WritesEliminates external write-strobe timing constraints - internal logic completes write within one clock cycle
Configurable Burst OrderMODE pin selects linear or interleaved burst addressing - matches CPU or DMA controller burst patterns
On-Chip ECCSingle-bit error correction with dedicated parity I/O (DQPa–DQPd) - improves reliability without external logic
Flexible I/O VoltageVDDQ supports 2.5 V or 3.3 V - allows direct interfacing with both legacy and low-voltage ASICs/FPGAs

Applications

Network Packet BufferTelecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer between ingress parser and egress scheduler, operating at 200 MHz with zero wait states.

Use Value: Enables deterministic packet buffering with guaranteed 3.2-ns read access and concurrent byte-write capability for header modification.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line cards handling 10 Gbps traffic.

IC Role / Device Role / Timing Role: Synchronous burst memory for ATM cell reassembly and payload alignment, leveraging interleaved burst mode.

Use Value: Supports continuous 200-MHz data streaming with ECC protection against cosmic-ray-induced bit flips in outdoor cabinets.

Radar Signal Processing BufferIndustrial PLC Data Log

Use Scenario: Capturing high-speed ADC samples from phased-array radar front-ends before FFT processing.

IC Role / Device Role / Timing Role: Pipelined memory staging area for real-time signal acquisition, using ADV/LD to auto-increment burst addresses.

Use Value: Delivers 36-Mbit depth with 200-MHz clocking to sustain >7 Gbps aggregate bandwidth across four 8-bit DQ lanes.

Use Scenario: Reliable event logging in safety-critical programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Nonvolatile-adjacent SRAM with ECC for storing timestamped I/O state changes and fault records.

Use Value: On-chip ECC reduces uncorrectable errors by >99% compared to standard SRAM, meeting IEC 61508 SIL-2 requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV102436BLL-200TQLINo on-chip ECC; 3.3-V only I/O (no 2.5-V support); identical 1M × 36 organization and 200-MHz speed gradeLacks hardware error correction - requires external ECC logic or software mitigation in radiation-sensitive deploymentsSelect when cost sensitivity outweighs SER requirements and system already provides external parity handling
MT28EW128AxxDS-000WD1Quad SPI NOR Flash with SRAM-like interface; 128-Mbit density but asynchronous random access; no pipelined burst or NoBL logicNonvolatile storage vs volatile high-speed buffer - used for firmware storage, not real-time packet bufferingSelect only for code shadowing or boot memory; not a functional replacement for CY7C1460KVE33's pipelined SRAM role

Compared with IS61WV102436BLL-200TQLI, CY7C1460KVE33 adds ECC and dual-voltage I/O at the cost of higher power; versus MT28EW128AxxDS-000WD1, it delivers deterministic 3.2-ns latency and true burst concurrency essential for real-time data flow.

Availability

CY7C1460KVE33 is available at Aetrix Electronics and suitable for network packet buffers, telecom line card memory, radar signal processing buffers, and industrial PLC data logs requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1460KVE33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.

CY7C1460KVE33 belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, high-frequency memory interfacing in packet-switched and real-time signal processing systems.

FAQ

What is the function of the MODE pin on CY7C1460KVE33?

The MODE pin is a strap input that configures burst addressing order: pulled HIGH (or left floating) selects interleaved burst mode; pulled LOW selects linear burst mode. It must be held static during operation and is sampled at power-up or reset. This setting directly determines how the internal address counter increments during burst reads/writes.

Does CY7C1460KVE33 support 2.5-V-only I/O operation?

Yes - VDDQ may be supplied at 2.5 V ± 0.2 V while maintaining full 200-MHz operation and compatibility with 2.5-V logic families. The device retains all timing specifications and ECC functionality under 2.5-V I/O conditions, enabling seamless integration with legacy FPGAs and ASICs.

How does the on-chip ECC interact with the DQP pins?

DQPa–DQPd are dedicated parity I/O pins paired one-to-one with DQa–DQd. During write, the ECC encoder generates 4 parity bits from 32 data bits and drives them onto DQPa–DQPd. During read, the decoder uses those parity bits to detect and correct single-bit errors in the 32-bit data word before output registration.

Can CY7C1460KVE33 operate without JTAG enabled?

Yes - JTAG is disabled by default at power-on. The TAP controller remains inactive unless the JTAG instruction register is loaded via TMS/TCK sequence. No external pull-ups or configuration fuses are required to disable boundary scan; normal memory operation proceeds independently of JTAG state.

CY7C1460KVE33-200AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.2 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1460KVE33-200AXC FAQ

1.How can I place an order for CY7C1460KVE33-200AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1460KVE33-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1460KVE33-200AXC reliable?

The price and inventory of CY7C1460KVE33-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1460KVE33-200AXC is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1460KVE33-200AXC transactions.

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4.How is shipping managed for CY7C1460KVE33-200AXC?

CY7C1460KVE33-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1460KVE33-200AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1460KVE33-200AXC?

For technical support, including CY7C1460KVE33-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1460KVE33-200AXC requirements.

6.How does Aetrix verify that CY7C1460KVE33-200AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1460KVE33-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1460KVE33-200AXC meets industry standards.

7.What is the process for return or replacement of CY7C1460KVE33-200AXC?

All CY7C1460KVE33-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1460KVE33-200AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1460KVE33-200AXC part is unused and in its original packaging.

Return procedure for CY7C1460KVE33-200AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1460KVE33-200AXC Tags

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