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Infineon Technologies CY7C1461KV33-133AXCT

Part No.:
CY7C1461KV33-133AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1461KV33-133AXCT.pdf
Description:
IC SRAM 36MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,602

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Product details

Overview

CY7C1461KV33-133AXCT from Cypress Semiconductor is a 36-Mbit synchronous flow-through SRAM (1M × 36 or 2M × 18 configuration) featuring NoBL™ architecture, supporting true back-to-back read/write operations at 133 MHz with zero wait states and 6.5 ns clock-to-output delay. It operates on 3.3 V core/I/O supply, includes registered inputs, byte write capability, and three chip enables for depth expansion - deployed in high-bandwidth packet buffering and network switch fabric control planes.

For engineers reviewing the CY7C1461KV33-133AXCT datasheet, CY7C1461KV33-133AXCT pinout, CY7C1461KV33-133AXCT application, or CY7C1461KV33-133AXCT equivalent, key selection criteria include burst order configurability (linear/interleaved), synchronous self-timed writes, automatic output tri-state during write data cycles, and ZZ sleep mode for low-power standby in telecom infrastructure.

Technical Context

The device implements a synchronous, pipelined flow-through architecture where all inputs (address, WE, BWx, CE, ADV/LD) are registered on the rising edge of CLK, qualified by CEN. Burst addressing is driven by a two-bit counter using A0/A1, selectable via MODE pin for linear or interleaved sequences.

Write operations use on-chip self-timed logic: data is latched on the second clock edge after address registration, eliminating external timing constraints. Output drivers are synchronously tri-stated during write data capture regardless of OE state, preventing bus contention in shared-memory systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1M × 36 or 2M × 18), enabling flexible data path width matching in 32-bit or 64-bit bus systems with parity support.
Max Clock Frequency 133 MHz - supports sustained 133 MT/s throughput with no dead cycles between consecutive read/write operations.
Access Time (tCDV) 6.5 ns - defines minimum clock-to-valid-output delay, critical for meeting setup/hold timing in high-speed FPGA or ASIC interfaces.
Supply Voltages VDD = 3.3 V ± 0.3 V (core), VDDQ = 3.3 V ± 0.3 V (I/O) - ensures compatibility with 3.3 V LVTTL and SSTL-3 signaling environments.
Burst Capability Linear or interleaved 4-word burst - reduces address bus toggling and simplifies controller logic in cache-like buffer applications.
Power Management ZZ sleep mode with automatic data retention - cuts standby current to <100 µA while preserving memory contents during idle periods.
Byte Write Control Four independent BWx (BWA–BWD) signals - enables selective 8-bit updates within 36-bit words without read-modify-write overhead.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), JEDEC-standard Pb-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
CLK, CEN Synchronous clock input and enable CLK sampled only when CEN = LOW; deasserting CEN extends previous cycle without disrupting internal state - essential for dynamic clock gating.
A[0:1], ADV/LD, MODE Burst address control A0/A1 feed two-bit burst counter; ADV/LD selects load vs. increment; MODE sets linear/interleaved sequence - fully configurable burst behavior.
CE1, CE2, CE3 Chip select hierarchy CE1/CE3 active LOW, CE2 active HIGH - enables 3-signal decoding for multi-SRAM depth expansion without external logic.
BWA–BWD, WE Write qualification WE + any BWx initiates byte-aligned write; all four BWx allow full 36-bit word or partial 8/16/24-bit updates - eliminates masking overhead.
DQs, DQP[A:D] Data I/O and parity lines 36 data + 4 parity bits (DQP A–D); bidirectional, registered I/O - supports ECC-capable systems and matches x36 memory bus standards.
OE, ZZ Output control and sleep OE is asynchronous but masked during writes; ZZ is asynchronous sleep - enables independent output gating and ultra-low-power idle states.

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) architecture Eliminates dead cycles between write and read operations - delivers continuous 133 MT/s throughput without pipeline stalls.
Internally self-timed output buffer control Removes need for external OE timing management - simplifies interface design and improves signal integrity in dense PCB layouts.
Registered synchronous inputs All address, control, and data inputs captured on CLK rising edge - ensures deterministic timing closure with FPGA/ASIC clock domains.
Three chip enables with mixed polarity CE1/CE3 (active LOW) + CE2 (active HIGH) - allows direct connection to standard address decoders without inverters or glue logic.
Asynchronous ZZ sleep mode Reduces ICC to <100 µA while retaining data - enables rapid wake-up (<5 ns) for burst-oriented traffic shaping in packet processors.

Applications

Network Packet Buffering Telecom Line Card Control Memory

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM serving as dual-port-accessible buffer memory with deterministic 6.5 ns read access.

Use Value: Enables zero-wait-state header processing pipelines, reducing per-packet latency by >12 ns versus ZBT SRAMs in burst-intensive forwarding engines.

Use Scenario: Holding real-time configuration tables and statistics counters in carrier-grade DSLAM and OLT line cards.

IC Role / Device Role / Timing Role: Synchronous flow-through memory interfaced to ARM Cortex-A9-based control processors via AMBA AXI bus.

Use Value: Supports concurrent CPU reads and DMA writes without arbitration logic, improving control-plane responsiveness under 100% traffic load.

Baseband Processing Cache Radar Signal Processing FIFO

Use Scenario: Acting as L2 cache for digital predistortion (DPD) coefficient updates in 5G massive MIMO RF units.

IC Role / Device Role / Timing Role: Burst-capable SRAM providing 4-word linear bursts to match DSP vector width and reduce address bus activity.

Use Value: Cuts coefficient update latency by 33% compared to discrete register-file implementations, improving DPD convergence speed.

Use Scenario: Buffering time-domain ADC samples prior to FFT processing in phased-array radar front ends.

IC Role / Device Role / Timing Role: Flow-through SRAM with ZZ sleep mode synchronized to pulse repetition interval (PRI) timing.

Use Value: Achieves 92% power reduction during inter-pulse intervals while maintaining sub-10 ns wake-up readiness for next chirp capture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L133PF Same density (36 Mbit), 133 MHz, but uses QDR-II+ architecture with separate read/write ports - requires dual-clock domain handling. Preferred in applications requiring simultaneous read/write (e.g., video frame buffers), not flow-through write-read transitions. Select when true dual-port concurrency is required; avoid if system relies on NoBL™'s single-clock simplicity and back-to-back latency.
ISSI IS61WV102436BLL-133TQLI Pin-compatible replacement with identical NoBL™ flow-through behavior, but rated for industrial temperature (−40°C to +85°C) vs. commercial (0°C to +70°C). Suitable for extended-temperature deployments (e.g., outdoor base stations, rail signaling), with same timing and command set. Choose for harsh-environment designs needing guaranteed operation beyond commercial grade - no firmware or layout changes needed.

Compared with IDT72V2115L133PF and IS61WV102436BLL-133TQLI, CY7C1461KV33-133AXCT offers superior timing predictability in write-read turnaround scenarios due to its dedicated NoBL™ control logic, while the ISSI part extends thermal reliability without altering interface behavior.

Availability

CY7C1461KV33-133AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card control memory, baseband processing cache, and radar signal processing FIFO applications requiring stable component supply and long-term obsolescence planning.

Supply support for CY7C1461KV33-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.

This device belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-wait-state, high-throughput buffering in networking and real-time signal processing systems where deterministic latency and burst efficiency are critical.

FAQ

What is the function of the MODE pin, and how does it affect burst behavior?

The MODE pin configures burst order: tied LOW for linear burst (0,1,2,3), HIGH or floating for interleaved burst (0,2,1,3). This setting directly controls the internal two-bit counter fed by A0/A1 and determines address sequencing during burst reads/writes - no software or register programming is required.

How does the device handle output tri-state during write operations?

Outputs (DQs/DQP) are automatically tri-stated during the data portion of a write sequence, regardless of OE state. This hardware-enforced behavior prevents bus contention and eliminates the need for precise OE timing control - OE remains effective only during read cycles and deselect states.

Can CY7C1461KV33-133AXCT operate with 2.5 V I/O voltage?

No - this variant is specified exclusively for 3.3 V I/O (VDDQ = 3.3 V ± 0.3 V). While earlier CY7C146xK series parts supported dual 3.3 V/2.5 V I/O, the -133AXCT suffix denotes the 3.3 V-only version; using 2.5 V on VDDQ violates absolute maximum ratings and risks functional failure.

What is the role of ADV/LD during address loading and burst advancement?

ADV/LD is a dual-function synchronous input: driven LOW to load a new address into the address register; driven HIGH to advance the internal burst counter. After any chip deselect, ADV/LD must be asserted LOW before the next access to ensure correct address initialization - failure causes undefined burst starting point.

CY7C1461KV33-133AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1461KV33-133AXCT FAQ

1.How can I place an order for CY7C1461KV33-133AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1461KV33-133AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1461KV33-133AXCT reliable?

The price and inventory of CY7C1461KV33-133AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1461KV33-133AXCT is usually 5 days.

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CY7C1461KV33-133AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1461KV33-133AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1461KV33-133AXCT?

For technical support, including CY7C1461KV33-133AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1461KV33-133AXCT requirements.

6.How does Aetrix verify that CY7C1461KV33-133AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1461KV33-133AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1461KV33-133AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1461KV33-133AXCT?

All CY7C1461KV33-133AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1461KV33-133AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1461KV33-133AXCT part is unused and in its original packaging.

Return procedure for CY7C1461KV33-133AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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