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Infineon Technologies CY7C1462AV25-167BZI
- Part No.:
- CY7C1462AV25-167BZI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1462AV25-167BZI.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
CY7C1462AV25-167BZI from Cypress Semiconductor is a 36-Mbit (2M × 18) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems requiring zero-wait-state back-to-back read/write operations. It operates at 167 MHz with 3.4 ns maximum access time, supports 2.5 V core and 2.5 V/1.8 V I/O supplies, and delivers fully registered inputs/outputs with byte write capability via BWa–BWb pins.
For engineers reviewing the CY7C1462AV25-167BZI datasheet, CY7C1462AV25-167BZI pinout, CY7C1462AV25-167BZI application, or CY7C1462AV25-167BZI equivalent, this device serves as a drop-in-compatible alternative to ZBT™ SRAMs in telecom line cards, network packet buffers, and FPGA co-processor memory interfaces where deterministic latency and burst efficiency are critical.
Technical Context
The CY7C1462AV25-167BZI implements a synchronous, clocked memory interface with all address, control, and data signals registered on the rising edge of CLK, qualified by CEN. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without wait states, using internal self-timed output buffer control that removes dependency on asynchronous OE timing.
Burst operation supports both linear and interleaved orders selected via the MODE strap pin; write sequencing uses synchronous self-timed circuitry with BWa/BWb enabling independent control of two 18-bit data groups (DQa/DQPa and DQb/DQPb). The device integrates IEEE 1149.1 JTAG boundary scan and offers ZZ sleep mode for low-power standby with data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2M × 18 organization), enabling compact 2-Mword memory banks with 18-bit data path |
| Max Clock Frequency | 167 MHz - guarantees full-speed operation in systems with ≤6 ns clock period |
| Access Time (tCO) | 3.4 ns - defines minimum clock-to-output delay for timing-critical read paths |
| Core Supply Voltage | 2.5 V ±0.2 V - requires dedicated low-noise 2.5 V rail for internal logic and array stability |
| I/O Supply Voltage | 2.5 V or 1.8 V - supports mixed-voltage system interfacing without level shifters |
| Byte Write Pins | BWa, BWb - independently enable writes to DQa/DQPa and DQb/DQPb groups, supporting partial-word updates |
| Power Dissipation (Active) | 335 mA max operating current - determines thermal budget for sustained 167 MHz burst traffic |
| Package | 100-pin TQFP (14 × 14 mm) or 165-ball FBGA (15 × 17 mm) - surface-mount compatible with standard reflow profiles |
Pinout & Package
CY7C1462AV25-167BZI is available in JEDEC-standard lead-free 100-pin TQFP (14 × 14 mm) and 165-ball FBGA (15 × 17 × 1.4 mm) packages. Both variants support identical pin functions and timing behavior.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[2:19] | Synchronous Address Input | Latched on rising CLK edge; selects one of 2M addresses in 2M × 18 configuration |
| BWa, BWb | Synchronous Byte Write Select | Active-low controls write enable for DQa/DQPa (BWa) and DQb/DQPb (BWb) groups |
| CE1, CE3 | Synchronous Chip Enable (active LOW) | Combined with CE2 (active HIGH) to enable/disable device access on rising CLK edge |
| CLK | Primary Clock Input | Qualified by CEN; all synchronous registers sample on rising edge |
| CEN | Clock Enable (active LOW) | When HIGH, masks CLK and holds internal state-used for cycle extension without deselection |
| DQa–DQb, DQPa–DQPb | Bidirectional Data I/O (18-bit × 2) | Registered input/output; tri-stated automatically during write data phase regardless of OE |
| OE | Asynchronous Output Enable (active LOW) | Controls output driver direction but masked during write sequences and deselect transitions |
| WE | Synchronous Write Enable (active LOW) | Qualifies BWa/BWb; must be LOW with valid CE and CEN to initiate write |
| ADV/LD | Advance/Load Control | HIGH advances internal burst counter; LOW loads new address-must be LOW after deselect |
| MODE | Burst Order Strap | HIGH = interleaved burst; LOW = linear burst; floating defaults to HIGH |
| ZZ | Asynchronous Sleep Input (active HIGH) | Places device in low-power sleep with data retention; internal pull-down ensures safe default LOW |
| VDD | Core Power Supply | 2.5 V supply for memory array and internal logic; decoupling required per datasheet layout guidelines |
| VDDQ | I/O Power Supply | 2.5 V or 1.8 V supply for DQ/DQP drivers-enables voltage translation between core and interface |
| VSS | Ground Reference | Common return for core and I/O; separate VSS pins require low-inductance PCB grounding |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) Architecture | Enables true back-to-back read/write operations with no wait states, increasing effective bandwidth by up to 2× vs. conventional sync SRAMs |
| Self-Timed Output Buffer Control | Eliminates need for precise OE timing margins-output enable is internally synchronized to CLK, simplifying PCB layout and timing closure |
| Byte Write Capability (BWa/BWb) | Allows independent 18-bit word writes to either DQa/DQPa or DQb/DQPb group, reducing bus contention and power during partial updates |
| Synchronous Self-Timed Writes | On-chip write timing logic ensures reliable data capture without external write pulse width constraints-supports variable-length burst writes |
| JTAG Boundary Scan (IEEE 1149.1) | Enables in-system testability and interconnect verification without additional test fixtures or bed-of-nails access |
| ZZ Sleep Mode with Data Retention | Reduces active current to CMOS standby level (120 mA) while preserving memory contents-ideal for power-gated subsystems |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
|
Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface units handling 10 Gbps line rates. IC Role / Device Role / Timing Role: Primary burst-access SRAM for ingress/egress FIFOs, providing deterministic 3.4 ns read latency and zero-wait-state write turnaround. Use Value: Enables full-line-rate packet queuing with sub-10 ns round-trip memory access, eliminating pipeline stalls in ASIC-based forwarding engines. |
Use Scenario: Deep packet inspection engines requiring rapid random-access storage for flow state tables and signature matching buffers. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as shared memory between classification and action engines, leveraging burst reads/writes for multi-field lookups. Use Value: Supports concurrent 167 MHz read and write bursts across two 18-bit ports, sustaining >3 Gbps aggregate throughput without arbitration overhead. |
| FPGA Co-Processor Memory | Industrial Motion Control |
|
Use Scenario: Offloading compute-intensive tasks from FPGA fabric to tightly coupled memory-resident algorithms (e.g., FFT, filtering). IC Role / Device Role / Timing Role: Low-latency scratchpad memory mapped directly into FPGA AXI or Avalon-MM address space, accessed via pipelined read/write transactions. Use Value: Delivers consistent 3.4 ns tCO and 167 MHz clocking-matching FPGA I/O timing budgets without added pipeline stages or timing closure effort. |
Use Scenario: Real-time servo loop buffers in CNC controllers storing position setpoints, encoder feedback, and PID coefficients. IC Role / Device Role / Timing Role: Deterministic-access SRAM holding time-critical motion trajectory data, synchronized to 167 MHz system clock for jitter-free update intervals. Use Value: Guarantees sub-6 ns clock period compliance and zero-wait-state writes-ensuring <100 ns worst-case update latency for closed-loop response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L16PF | 2.5 V-only I/O (no 1.8 V support); 167 MHz max; 2M × 18; lacks ZZ sleep mode and JTAG | Requires external level shifting in 1.8 V systems; no built-in test infrastructure for production test | Select when cost sensitivity outweighs power management and testability requirements |
| ISSI IS61WV204818BLL-167TQLI | 2.5 V core/I/O; 167 MHz; 2M × 18; no NoBL™-requires wait states between read/write transitions | Lower bandwidth under mixed access patterns due to mandatory 1-cycle gap between R/W cycles | Select only for non-burst-dominant workloads where latency consistency is less critical than BOM simplification |
Compared with IDT72V2115L16PF and IS61WV204818BLL-167TQLI, CY7C1462AV25-167BZI uniquely combines 1.8 V I/O compatibility, integrated ZZ sleep, JTAG testability, and true NoBL™ zero-wait-state operation-making it optimal for power-aware, high-throughput, and production-testable designs.
Availability
CY7C1462AV25-167BZI is available at Aetrix Electronics and suitable for telecom infrastructure, network packet processing, FPGA acceleration, and industrial motion control applications requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1462AV25-167BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
CY7C1462AV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for systems demanding deterministic, zero-wait-state memory access in high-speed packet, video, and real-time control applications.
FAQ
What is the function of the MODE pin on CY7C1462AV25-167BZI?
The MODE pin selects burst order: tied HIGH for interleaved burst, pulled LOW for linear burst. It is a strap pin sampled at power-up and must remain static during operation. Floating defaults to HIGH (interleaved), and changing MODE mid-operation causes undefined burst behavior per datasheet Section 6.2.
Can CY7C1462AV25-167BZI operate with 1.8 V I/O while maintaining 2.5 V core supply?
Yes-VDDQ accepts 1.8 V ±0.15 V while VDD remains at 2.5 V ±0.2 V. This dual-supply configuration enables direct interfacing with 1.8 V FPGAs or ASICs without external level shifters, provided VDDQ and VDD sequencing meets tVR/tVF specifications (min 0 V → 1.8 V before VDD reaches 1.5 V).
How does the ZZ pin interact with CEN and chip enable signals?
ZZ is asynchronous and overrides all clocked logic: when asserted HIGH, it forces the device into low-power sleep regardless of CEN, CE, or CLK state. Internal data is retained, and wake-up occurs within tZZD (max 100 ns) after ZZ returns LOW-no reset or reinitialization is required.
Is CY7C1462AV25-167BZI pin-compatible with CY7C1460AV25-167BZI?
No-CY7C1462AV25 (2M × 18) and CY7C1460AV25 (1M × 36) differ in address width (21 vs. 20 bits), byte write pin count (BWa/BWb vs. BWa–BWd), and DQ/DQP pin mapping. Though both use 100-pin TQFP, their pinouts are not interchangeable; refer to Pages 4–5 of datasheet 38-05354 Rev. *D for exact assignments.
CY7C1462AV25-167BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1462AV25-167BZI FAQ
1.How can I place an order for CY7C1462AV25-167BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1462AV25-167BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1462AV25-167BZI reliable?
The price and inventory of CY7C1462AV25-167BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1462AV25-167BZI is usually 5 days.
3.What payment methods are accepted for CY7C1462AV25-167BZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1462AV25-167BZI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1462AV25-167BZI?
CY7C1462AV25-167BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1462AV25-167BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1462AV25-167BZI?
For technical support, including CY7C1462AV25-167BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1462AV25-167BZI requirements.
6.How does Aetrix verify that CY7C1462AV25-167BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1462AV25-167BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1462AV25-167BZI meets industry standards.
7.What is the process for return or replacement of CY7C1462AV25-167BZI?
All CY7C1462AV25-167BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1462AV25-167BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1462AV25-167BZI part is unused and in its original packaging.
Return procedure for CY7C1462AV25-167BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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