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Infineon Technologies CY7C1462AV33-167AXC
- Part No.:
- CY7C1462AV33-167AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1462AV33-167AXC.pdf
- Description:
- IC SRAM 36MBIT PAR 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,178
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Product details
Overview
CY7C1462AV33-167AXC from Cypress Semiconductor is a 3.3V synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 18 (36 Mbit), supporting 167 MHz bus operation with zero wait states and 3.4 ns maximum access time. It features fully registered inputs/outputs, byte write capability via BWa–BWb, and synchronous self-timed writes for deterministic timing in high-throughput memory subsystems used in network packet buffering and telecom line cards.
For engineers reviewing the CY7C1462AV33-167AXC datasheet, CY7C1462AV33-167AXC pinout, CY7C1462AV33-167AXC application, or CY7C1462AV33-167AXC equivalent, key selection considerations include its 165-ball FBGA package, dual-voltage I/O (3.3V/2.5V), JTAG boundary scan compliance, and burst mode support (linear/interleaved) for cache-coherent interconnects.
Technical Context
The CY7C1462AV33-167AXC implements a No Bus Latency™ architecture enabling true back-to-back read/write operations without wait states, using pipelined address and data registers clocked on the rising edge of CLK. Its internal burst logic supports both linear and interleaved addressing modes controlled by the MODE pin.
Synchronous control is enforced via three chip enables (CE1 active-low, CE2 active-high, CE3 active-low), Clock Enable (CEN), and Write Enable (WE), all sampled on CLK's rising edge. Output drivers are synchronously tristated during write data cycles to prevent bus contention, and OE remains asynchronous for fast output disable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2M × 18 organization), enabling compact high-bandwidth buffer designs for 18-bit parallel buses. |
| Max Clock Frequency | 167 MHz - guarantees 6 ns clock period for deterministic pipeline staging in real-time systems. |
| Access Time | 3.4 ns - defines minimum clock-to-output delay for first valid read data after address setup. |
| I/O Voltage Support | 3.3V core / 3.3V or 2.5V I/O - allows interoperability with both legacy 3.3V and low-power 2.5V logic families. |
| Byte Write Control | BWa and BWb inputs - enable independent write masking of two 18-bit data groups, critical for partial-word updates without read-modify-write overhead. |
| Power Consumption | 375 mA max operating current, 120 mA CMOS standby - supports thermal management in dense PCB layouts. |
| JTAG Compliance | IEEE 1149.1 boundary scan - provides production testability and board-level debug visibility without additional test points. |
Pinout & Package
Package: 165-ball FBGA (15 mm × 17 mm × 1.4 mm), RoHS-compliant, with ball pitch of 0.8 mm and standard JEDEC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Input clock | Rising-edge-triggered master timing reference; qualified by CEN to extend cycles without clock gating. |
| CEN | Sync clock enable | Active-low input that masks CLK when deasserted-preserves previous cycle state without deselection. |
| CE1, CE3 | Sync chip enable | Active-low enables; CE2 is active-high-three-signal decode allows flexible bank partitioning in multi-SRAM systems. |
| BWa, BWb | Sync byte write select | Active-low controls write enable per 18-bit data group (DQa/DQPa and DQb/DQPb), enabling granular memory updates. |
| ADV/LD | Sync address advance/load | High = increment internal burst counter; Low = load new address-enables seamless sequential and random access modes. |
| OE | Async output enable | Asynchronous low enables outputs; masked during write data phase to prevent bus contention. |
| ZZ | Async sleep mode | Active-low entry into low-power sleep state (<100 µA), reducing system idle power without clock stop coordination. |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Eliminates bus latency by enabling consecutive read/write operations on every clock cycle-no wait-state insertion required. |
| Full Input/Output Registration | All address, control, and data signals pass through clocked registers-ensures precise setup/hold timing across PVT variations. |
| Synchronous Self-Timed Writes | Internal write timing logic eliminates external write pulse width constraints-simplifies controller design and improves reliability. |
| Burst Mode Flexibility | MODE pin selects linear or interleaved burst order-matches CPU/cache burst patterns without firmware reconfiguration. |
| 3.3V Core + Dual-Voltage I/O | Supports mixed-voltage system integration-3.3V core ensures compatibility with legacy logic while 2.5V I/O reduces switching noise and power. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer interfacing directly to MAC controllers and traffic managers. Use Value: 167 MHz zero-wait-state operation sustains 3 Gbps sustained throughput (18-bit × 167 MHz), eliminating frame drop under bursty traffic. |
Use Scenario: Holding voice channel samples and signaling data in TDM-based access gateways. IC Role / Device Role / Timing Role: Synchronous dual-port buffer synchronized to T1/E1 framing clocks for jitter-free sample transfer. Use Value: Fully registered interface ensures sub-nanosecond skew control across 18-bit data paths, meeting GR-1089 EMI and jitter specs. |
| Baseband Processing Cache | Radar Signal Processing FIFO |
|
Use Scenario: Acting as instruction/data cache between DSP cores and external DDR in wireless baseband units. IC Role / Device Role / Timing Role: Pipelined SRAM providing deterministic access latency to accelerate FFT and channel estimation routines. Use Value: NoBL™ architecture delivers consistent 3.4 ns access time across read/write transitions-critical for real-time loop timing closure. |
Use Scenario: Capturing and staging digitized IF samples from ADCs prior to FPGA-based pulse compression. IC Role / Device Role / Timing Role: High-reliability burst-mode FIFO with JTAG testability for aerospace-grade radar front ends. Use Value: IEEE 1149.1 boundary scan enables in-system verification of all 165 balls-reducing test escape risk in safety-critical deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L10PFI | 2M × 18, 10 ns access, 100 MHz max clock, 100-pin TQFP only - slower timing, no ZZ sleep mode. | Lacks burst mode flexibility and JTAG scan; suited for cost-sensitive industrial controllers where speed <100 MHz suffices. | Select when footprint compatibility with legacy TQFP designs is mandatory and 167 MHz performance is unnecessary. |
| ISSI IS61WV102418BLL-10TLI | 1M × 18, 10 ns access, 100 MHz, 100-pin TQFP - half density, no NoBL™, no burst mode, no JTAG. | Targeted at simple buffer applications without pipelining requirements; lacks ADV/LD and MODE functionality. | Choose only for non-pipelined, low-complexity systems where memory bandwidth demand is ≤1.8 Gbps and testability is not required. |
Compared with IDT72V2115L10PFI and IS61WV102418BLL-10TLI, the CY7C1462AV33-167AXC uniquely delivers 167 MHz zero-wait-state operation, NoBL™ back-to-back throughput, and JTAG testability in a 165-ball FBGA-making it the sole option for high-reliability, high-bandwidth telecom and defense signal processing.
Availability
CY7C1462AV33-167AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and radar signal processing FIFO requiring stable component supply across extended product lifecycles.
Supply support for CY7C1462AV33-167AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
The CY7C146xAV33 family was designed specifically for zero-latency, high-throughput memory subsystems in telecom infrastructure and real-time signal processing-emphasizing deterministic timing, burst efficiency, and system-level testability.
FAQ
What is the function of the MODE pin on CY7C1462AV33-167AXC?
The MODE pin selects burst address sequencing: when tied to VDD, it enables interleaved burst order; when tied to GND, it enables linear burst order. This matches host processor burst patterns without software intervention and is sampled at initialization-no runtime reconfiguration is supported.
Does CY7C1462AV33-167AXC support 2.5V-only I/O operation?
Yes-the device supports 2.5V I/O voltage (VDDQ = 2.5V) while maintaining 3.3V core supply (VDD = 3.3V). I/O voltage level must be stable before and during operation; mixing 2.5V and 3.3V I/O on the same device is not permitted per datasheet specifications.
How does the ZZ (sleep) mode reduce power consumption?
In ZZ mode (pin driven LOW), the device enters ultra-low-power sleep with typical current draw below 100 µA. All internal clocks and registers halt, but data retention is maintained. Exit requires ZZ HIGH followed by a valid clock edge-no reset sequence is needed.
Can CE2 be left unconnected in a single-SRAM system?
No-CE2 is an active-high synchronous input and must be held at a defined logic level. Leaving it floating risks metastability and unpredictable chip enable behavior. For single-device operation, tie CE2 to VDD (logic HIGH) and use CE1/CE3 for active control per design intent.
CY7C1462AV33-167AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1462AV33-167AXC FAQ
1.How can I place an order for CY7C1462AV33-167AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1462AV33-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1462AV33-167AXC reliable?
The price and inventory of CY7C1462AV33-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1462AV33-167AXC is usually 5 days.
3.What payment methods are accepted for CY7C1462AV33-167AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1462AV33-167AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1462AV33-167AXC?
CY7C1462AV33-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1462AV33-167AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1462AV33-167AXC?
For technical support, including CY7C1462AV33-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1462AV33-167AXC requirements.
6.How does Aetrix verify that CY7C1462AV33-167AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1462AV33-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1462AV33-167AXC meets industry standards.
7.What is the process for return or replacement of CY7C1462AV33-167AXC?
All CY7C1462AV33-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1462AV33-167AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1462AV33-167AXC part is unused and in its original packaging.
Return procedure for CY7C1462AV33-167AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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