Infineon Technologies CY7C1462AV33-167AXCT
- Part No.:
- CY7C1462AV33-167AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1462AV33-167AXCT.pdf
- Description:
- IC SRAM 36MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,305
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Product details
Overview
CY7C1462AV33-167AXCT from Cypress Semiconductor is a 3.3V synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 18 (36 Mbit), supporting 167 MHz bus operation with zero wait states. It features fully registered inputs/outputs, byte write capability via BWa–BWb, and synchronous self-timed writes. Used in high-throughput packet buffering and network switch fabric control planes where back-to-back read/write transitions are critical.
For engineers reviewing the CY7C1462AV33-167AXCT datasheet, CY7C1462AV33-167AXCT pinout, CY7C1462AV33-167AXCT application, or CY7C1462AV33-167AXCT equivalent, key selection criteria include burst mode support (linear/interleaved), ZZ sleep mode for power gating, IEEE 1149.1 JTAG boundary scan for system-level testability, and compatibility with ZBT-style memory controllers.
Technical Context
The device implements a pipelined architecture with three-stage address registration (input register, write address register 1/2) and output registers synchronized to CLK rising edge. All synchronous controls - CE1 (active low), CE2 (active high), CE3 (active low), WE, BWa/BWb, ADV/LD, and CEN - are sampled on CLK's rising edge when CEN is asserted.
Output drivers are synchronously tristated during write data cycles and upon deselection, eliminating bus contention. Internal self-timed output buffer control removes dependency on asynchronous OE timing, while burst logic supports linear or interleaved addressing based on MODE pin state (GND = linear, floating/VDD = interleaved).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2M × 18 organization), enabling compact dual-port-equivalent buffering without external multiplexing |
| Max Clock Frequency | 167 MHz - supports sustained 167 MT/s throughput with no wait states in pipelined mode |
| Access Time | 3.4 ns - defines minimum clock period for reliable read data capture at full speed |
| Supply Voltages | VDD = 3.135–3.6 V; VDDQ = 2.3–3.6 V - allows I/O voltage scaling to 2.5 V for interfacing with lower-voltage logic |
| Byte Write Control | BWa and BWb pins - enable independent write masking of two 18-bit data groups, reducing bus turnaround overhead |
| Power Consumption | 375 mA max operating current; 120 mA CMOS standby - enables thermal management in dense memory subsystems |
| Package | 165-ball FBGA (15 × 17 mm, 1.4 mm height) - provides fine-pitch, thermally efficient interconnect for high-speed routing |
Pinout & Package
The CY7C1462AV33-167AXCT is packaged in a 165-ball FBGA (15 × 17 mm, 1.4 mm height) compliant with JEDEC MO-270AB. Ball pitch is 0.8 mm; package is Pb-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[2:19] | Synchronous Address Inputs | Sampled on rising CLK edge; define 2M-word address space (A0–A19 required for 2M × 18) |
| BWa, BWb | Synchronous Byte Write Selects | Active-low signals controlling write enable for DQa/DQPa and DQb/DQPb groups respectively |
| CE1, CE3 | Synchronous Chip Enables | Active-low enables; CE2 is active-high - together provide 3-signal bank decode for multi-SRAM systems |
| CLK, CEN | Clock and Clock Enable | CLK qualified by CEN; deasserting CEN extends previous cycle without losing pipeline state |
| DQa–DQb, DQPa–DQPb | Bidirectional Data I/O | 18-bit data + 2-bit parity per group; direction controlled by OE and internal write/read sequencing |
| OE | Asynchronous Output Enable | Active-low; masked during write data phase to prevent bus contention - no external timing constraints |
| ADV/LD | Advance/Load Control | High = increment internal burst counter; Low = load new address - enables seamless burst and random access mixing |
| ZZ | Deep Sleep Mode | Active-low; reduces standby current below CMOS spec by disabling internal clocks and buffers |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) Architecture | Enables true back-to-back read/write operations with data valid every clock cycle - eliminates pipeline bubbles in burst-heavy traffic |
| IEEE 1149.1 JTAG Boundary Scan | Supports system-level interconnect testing without requiring functional access - critical for high-reliability telecom and aerospace PCBs |
| Synchronous Self-Timed Writes | Removes external write pulse width timing constraints - simplifies controller design and improves timing margin |
| ZBT Pin/Functional Compatibility | Direct drop-in replacement for ZBT SRAMs in existing designs - preserves board layout and firmware timing assumptions |
| Flexible Burst Ordering | MODE pin selects linear (GND) or interleaved (VDD/floating) burst - matches legacy cache line or DRAM controller requirements |
Applications
| Network Packet Buffering | Telecom Line Card Control Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches before classification and forwarding. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as a deterministic latency buffer between MAC and switching fabric logic. Use Value: 167 MHz zero-wait-state operation ensures full-line-rate packet processing at 10 Gbps with consistent sub-10 ns read-to-write turnaround. |
Use Scenario: Holding configuration tables and real-time status registers in carrier-grade DSLAM or OLT line cards. IC Role / Device Role / Timing Role: Dual-role memory serving both control-plane lookup tables and fast-status scratchpad for embedded RISC processors. Use Value: Byte write capability (BWa/BWb) allows atomic updates to 18-bit status fields without disturbing adjacent control bits - preventing race conditions. |
| Baseband Processing Cache | Radar Signal Processing FIFO |
Use Scenario: Acting as L1 instruction/data cache for DSP cores in 4G/5G baseband units handling OFDM symbol processing. IC Role / Device Role / Timing Role: Pipelined SRAM interfaced directly to DSP memory bus, providing deterministic access for tight-loop FFT and channel estimation kernels. Use Value: Fully registered I/O eliminates setup/hold violations at 167 MHz, enabling direct connection without external delay tuning or PLL deskew. |
Use Scenario: Buffering time-domain ADC samples prior to FFT transformation in phased-array radar front-ends. IC Role / Device Role / Timing Role: High-reliability burst memory staging raw IQ data from multiple ADC channels into processing pipelines. Use Value: ZZ sleep mode reduces idle power by >70% during inter-pulse periods - extending thermal headroom in sealed radar enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L167PF | 2M × 18, 167 MHz, 3.3V, but uses QDR-II interface with separate read/write ports - no shared DQ bus | Requires dual-port controller logic; not compatible with standard ZBT memory controllers | Select only if system already implements QDR-II protocol and requires concurrent read/write bandwidth |
| ISSI IS61WV204818BLL-167TQLI | 2M × 18, 167 MHz, 3.3V, but lacks JTAG boundary scan and ZZ sleep mode; uses simpler control timing | Lower test coverage in production; unsuitable for power-gated subsystems requiring deep sleep | Choose for cost-sensitive industrial control where JTAG and ultra-low standby are non-critical |
Compared with IDT72V2115L167PF and IS61WV204818BLL-167TQLI, the CY7C1462AV33-167AXCT uniquely combines ZBT compatibility, integrated JTAG, and hardware-managed sleep - making it optimal for upgradable telecom infrastructure where field-testability and power-aware operation are mandatory.
Availability
CY7C1462AV33-167AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card control memory, baseband processing cache, and radar signal processing FIFO applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1462AV33-167AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.
The CY7C146xAV33 family was designed specifically for zero-latency, high-bandwidth memory subsystems in networking and telecom equipment - emphasizing deterministic timing, burst flexibility, and system-level testability via JTAG.
FAQ
What is the function of the MODE pin on CY7C1462AV33-167AXCT?
The MODE pin selects burst address sequence behavior: tied to GND enables linear burst ordering (A0–A19 increment sequentially), while floating or connected to VDD enables interleaved burst (address bits A1–A19 toggle in Gray-code pattern). This matches legacy cache or DRAM controller expectations without requiring firmware changes.
Does CY7C1462AV33-167AXCT support 2.5V I/O operation?
Yes - VDDQ supports 2.3 V to 3.6 V, allowing direct interface with 2.5 V logic families. The core VDD remains fixed at 3.3 V (3.135–3.6 V), so level-shifting is unnecessary. I/O timing parameters (e.g., tAC, tOH) are specified separately for 2.5 V and 3.3 V VDDQ conditions in the datasheet.
How does the ZZ pin reduce power consumption?
Asserting ZZ low disables internal clocks, output buffers, and address latches, reducing standby current to <50 µA - far below the 120 mA CMOS standby spec. Unlike standard standby, ZZ retains all memory contents and resumes operation within one clock cycle after deassertion, with no initialization delay.
Can CY7C1462AV33-167AXCT be used in place of CY7C1460AV33-167AXCT?
No - although pin-compatible in the 165-ball FBGA, they differ in data width and pin mapping: CY7C1460AV33 is 1M × 36 (36-bit data bus), while CY7C1462AV33 is 2M × 18 (18-bit data bus with parity pins DQPa/DQPb). Swapping requires PCB redesign and firmware data path reconfiguration.
CY7C1462AV33-167AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1462AV33-167AXCT FAQ
1.How can I place an order for CY7C1462AV33-167AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1462AV33-167AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1462AV33-167AXCT reliable?
The price and inventory of CY7C1462AV33-167AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1462AV33-167AXCT is usually 5 days.
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CY7C1462AV33-167AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1462AV33-167AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1462AV33-167AXCT?
For technical support, including CY7C1462AV33-167AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1462AV33-167AXCT requirements.
6.How does Aetrix verify that CY7C1462AV33-167AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1462AV33-167AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1462AV33-167AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1462AV33-167AXCT?
All CY7C1462AV33-167AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1462AV33-167AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1462AV33-167AXCT part is unused and in its original packaging.
Return procedure for CY7C1462AV33-167AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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