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Infineon Technologies CY7C1462AV33-200AXI

Part No.:
CY7C1462AV33-200AXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1462AV33-200AXI.pdf
Description:
IC SRAM 36MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,480

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Product details

Overview

CY7C1462AV33-200AXI from Cypress Semiconductor is a 3.3V synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 18 (36 Mbit), supporting 200 MHz bus operations with zero wait states and 3.2 ns maximum access time. It features fully registered inputs/outputs, byte write capability via BWa–BWb, and synchronous self-timed writes for back-to-back Read/Write transitions in high-throughput networking buffers.

For engineers reviewing the CY7C1462AV33-200AXI datasheet, CY7C1462AV33-200AXI pinout, CY7C1462AV33-200AXI application, or CY7C1462AV33-200AXI equivalent, key selection considerations include burst mode support (linear/interleaved), ZZ sleep mode, JTAG boundary scan compliance, and 165-ball FBGA package compatibility with ZBT-style system designs.

Technical Context

The CY7C1462AV33-200AXI implements a No Bus Latency™ architecture enabling true consecutive Read/Write operations without wait states, using on-chip address counters advanced by ADV/LD and qualified by CEN-controlled CLK. All synchronous signals-including address, byte write selects, and control inputs-are latched on the rising edge of CLK.

It supports two burst orders (linear and interleaved) selected by MODE pin state, integrates IEEE 1149.1 JTAG boundary scan with TAP controller and instruction set, and uses synchronous output registers with tristate control masked during write data cycles to prevent bus contention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (2M × 18 organization), enabling compact high-bandwidth buffer storage in packet-switching ASIC interfaces.
Max Clock Frequency200 MHz - supports sustained 400 MT/s throughput with no pipeline stalls in burst-mode operation.
Access Time3.2 ns - defines minimum clock-to-output delay for timing-critical read cycles in FPGA co-processor systems.
Supply Voltage3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - allows interoperability with mixed-voltage logic families without level shifters.
Byte Write SupportBWa and BWb pins control independent 18-bit data segments - enables granular memory updates without read-modify-write overhead.
Sleep ModeZZ pin asserts low-power sleep state - reduces standby current to ≤120 mA while preserving data and register state.
JTAG ComplianceIEEE 1149.1 boundary scan - enables in-system testability and interconnect verification in dense PCB layouts.

Pinout & Package

Package: 165-ball FBGA (15 × 17 mm, 1.4 mm height), JEDEC-standard Pb-Free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0, A1, A[2:19]Synchronous Address InputsLatched on rising CLK edge; define 2M-word address space (A0–A19) for 2M × 18 configuration.
BWa, BWbSynchronous Byte Write SelectsActive-low controls write enable for DQa/DQPa and DQb/DQPb groups respectively; qualified by WE and CLK.
CLK, CENClock and Clock EnableCLK sampled only when CEN = LOW; CEN deassertion extends previous cycle without deselection.
CE1, CE2, CE3Chip Enable GroupThree-signal decode (CE1=L, CE2=H, CE3=L) selects device; enables multi-SRAM bank addressing.
ADV/LDAddress Counter ControlHIGH advances internal burst counter; LOW loads new address - critical for sequential burst access control.
MODEBurst Order SelectorGND = linear burst; floating/VDD = interleaved burst - determines address increment pattern during burst reads/writes.
ZZDeep Sleep ControlActive-low entry into low-power state; retains memory contents and register values while halting clocks.
DQa–DQb, DQPa–DQPbBidirectional Data I/O18-bit data path (DQa/DQPa = upper 9 bits, DQb/DQPb = lower 9 bits); direction controlled by OE and internal logic.

Key Features

FeatureDesign Value
NoBL™ ArchitectureEnables unlimited back-to-back Read/Write operations with zero wait states - eliminates pipeline bubbles in real-time packet buffering.
Full Input/Output RegistrationAll address, control, and data signals synchronized to CLK rising edge - ensures deterministic setup/hold timing across temperature and voltage.
Synchronous Self-Timed WritesOn-chip write timing logic eliminates external write pulse width constraints - simplifies timing closure in high-speed ASIC/FPGA interfaces.
Interleaved & Linear Burst ModesConfigurable via MODE pin - matches legacy ZBT burst patterns or modern cache-line-aligned access requirements.
JTAG Boundary ScanIEEE 1149.1 compliant with TAP controller, IDCODE, and BSDL support - enables automated PCB test and debug without physical probe access.

Applications

High-Speed Network Switch BufferBaseband Processor Memory Interface

Use Scenario: Storing and forwarding Ethernet frames in Layer 2 switching ASICs requiring sub-10 ns latency per packet lookup.

IC Role / Device Role / Timing Role: Primary packet buffer SRAM interfacing directly to SerDes MAC controllers with 200 MHz DDR-equivalent throughput.

Use Value: 3.2 ns access time and zero-wait-state pipelining reduce frame queuing delay by ≥15% versus asynchronous SRAM alternatives.

Use Scenario: Serving as shared instruction/data memory between dual-core DSPs in 4G LTE baseband processing units.

IC Role / Device Role / Timing Role: Synchronous burst-access memory mapped to AXI4 bus via FPGA bridge, supporting 18-bit wide instruction fetches.

Use Value: Byte write capability (BWa/BWb) allows precise 9-bit microcode patching without full-word overwrite, reducing firmware update latency.

Radar Signal Processing FIFOIndustrial Motion Controller Lookahead Buffer

Use Scenario: Capturing and staging ADC samples from phased-array radar receivers before FFT computation.

IC Role / Device Role / Timing Role: High-reliability pipelined FIFO with ZZ sleep mode activated between chirp cycles to minimize power in battery-operated systems.

Use Value: ≤120 mA CMOS standby current and JTAG testability ensure long-term field reliability and production test coverage.

Use Scenario: Holding motion trajectory commands ahead of real-time servo execution in CNC machine controllers.

IC Role / Device Role / Timing Role: Deterministic-latency SRAM buffer synchronized to motion controller's 200 MHz timing engine with ADV/LD-driven burst loading.

Use Value: Fully registered interface eliminates metastability risk at clock domain crossings between host CPU and motion ASIC domains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72V2115L10PF2.5 V core, 10 ns access, 1M × 18 organization - smaller density, slower speed, different voltage domain.Targets cost-sensitive industrial controllers where 200 MHz throughput is unnecessary.Select when 2.5 V system integration and lower power outweigh need for 36 Mbit capacity and 200 MHz performance.
ISSI IS61WV102418BLL-10TLI10 ns access, 1M × 18, no NoBL™ or burst modes - asynchronous interface, no ADV/LD or MODE pins.Suitable for legacy designs lacking burst control logic or requiring simple address-in/data-out behavior.Choose only if design lacks clock-enable infrastructure and does not require pipelined back-to-back operation.

Compared with IDT72V2115L10PF and IS61WV102418BLL-10TLI, CY7C1462AV33-200AXI delivers 2× memory density, 20× faster access, and deterministic burst control-making it essential for next-generation telecom and real-time embedded systems demanding zero-wait-state throughput.

Availability

CY7C1462AV33-200AXI is available at Aetrix Electronics and suitable for high-speed network switch buffers, baseband processor memory interfaces, radar signal processing FIFOs, and industrial motion controller lookahead buffers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1462AV33-200AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC programmable systems-on-chip, and USB/USB-C solutions.

The CY7C146xAV33 family was designed specifically for zero-latency, high-throughput data buffering in communications infrastructure and real-time embedded systems requiring deterministic burst access and JTAG testability.

FAQ

What is the function of the MODE pin on CY7C1462AV33-200AXI?

The MODE pin selects burst address order: grounded for linear burst (sequential increment), or tied to VDD/floating for interleaved burst (bit-swapped increment). This matches legacy ZBT protocol requirements or modern cache-line alignment needs without external logic.

Does CY7C1462AV33-200AXI support partial writes without read-modify-write cycles?

Yes - BWa and BWb pins enable independent 9-bit segment writes to DQa/DQPa and DQb/DQPb groups. When asserted low with WE active, only the selected byte group is updated, eliminating need for external read-modify-write sequences.

How does the ZZ pin affect power consumption and data retention?

Asserting ZZ low reduces CMOS standby current to ≤120 mA while maintaining full data and register state. Core and I/O supplies remain powered; clock and control logic halt. Data retention is guaranteed over commercial temperature range (0°C to +70°C) with VDD ≥ 2.7 V.

Is CY7C1462AV33-200AXI pin-compatible with ZBT SRAMs?

Yes - it is pin-compatible and functionally equivalent to standard ZBT SRAMs (e.g., IDT ZBT series), sharing identical pinouts, timing protocols, and burst behaviors. This enables drop-in replacement in existing ZBT-based designs without layout or firmware changes.

CY7C1462AV33-200AXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.2 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1462AV33-200AXI FAQ

1.How can I place an order for CY7C1462AV33-200AXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1462AV33-200AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1462AV33-200AXI reliable?

The price and inventory of CY7C1462AV33-200AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1462AV33-200AXI is usually 5 days.

3.What payment methods are accepted for CY7C1462AV33-200AXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1462AV33-200AXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1462AV33-200AXI?

CY7C1462AV33-200AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1462AV33-200AXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1462AV33-200AXI?

For technical support, including CY7C1462AV33-200AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1462AV33-200AXI requirements.

6.How does Aetrix verify that CY7C1462AV33-200AXI is sourced from the original manufacturer or authorized distributors?

All CY7C1462AV33-200AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1462AV33-200AXI meets industry standards.

7.What is the process for return or replacement of CY7C1462AV33-200AXI?

All CY7C1462AV33-200AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1462AV33-200AXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1462AV33-200AXI part is unused and in its original packaging.

Return procedure for CY7C1462AV33-200AXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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