Infineon Technologies CY7C1462KV25-200AXC
- Part No.:
- CY7C1462KV25-200AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1462KV25-200AXC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,615
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1462KV25-200AXC from Cypress Semiconductor is a 36-Mbit (2M × 18) synchronous pipelined SRAM with NoBL™ architecture and on-chip ECC, designed for high-throughput memory subsystems in networking and telecom infrastructure. It operates at 200 MHz with zero wait states, supports synchronous self-timed writes, features byte-write capability via BWa–BWb, and uses 2.5 V core/I/O supplies.
For engineers reviewing the CY7C1462KV25-200AXC datasheet, CY7C1462KV25-200AXC pinout, CY7C1462KV25-200AXC application, or CY7C1462KV25-200AXC equivalent, this device is selected for systems requiring deterministic latency, burst read/write coherency, ECC-enabled data integrity, and JEDEC-standard 100-pin TQFP packaging with JTAG boundary scan support.
Technical Context
This SRAM implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven through output registers synchronized to CLK. The internal NoBL™ logic eliminates bus latency by enabling true back-to-back read/write cycles without wait states.
It integrates on-chip ECC encoding/decoding for single-bit error correction and double-bit error detection, reducing soft error rate in radiation-sensitive environments. Burst capability supports both linear and interleaved orders, and the ZZ sleep mode reduces power during idle periods while preserving data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2M × 18 configuration) |
| Max Clock Frequency | 200 MHz - enables 200 million transfers per second with zero wait states |
| Access Time | 3.2 ns - clock-to-output delay for read operations at 200 MHz |
| Core/I/O Voltage | 2.5 V - single supply simplifies power delivery and matches 2.5 V logic families |
| ECC Support | On-chip SEC-DED - corrects single-bit errors and detects double-bit errors in real time |
| Burst Capability | Linear or interleaved - configurable burst order for cache-line or packet-aligned access |
| Package | 100-pin TQFP (JEDEC standard, Pb-free) - compatible with automated SMT assembly |
Pinout & Package
Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard, Pb-free, 14 mm × 14 mm body, 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0, A1, A[2:18] | Address Input | Synchronous address bus sampled on rising CLK edge; selects one of 2M locations in 2M × 18 mode |
| BWa, BWb | Byte Write Select | Active-low controls write enable for DQa/DQPa and DQb/DQPb groups respectively |
| CLK | Clock Input | Rising-edge-triggered master clock; qualified by CEN to gate timing domain entry |
| CEN | Clock Enable | Active-low; suspends clock recognition without deselecting device, extending previous cycle |
| CE1, CE2, CE3 | Chip Enable | Three-level synchronous bank select (CE1/CE3 active low, CE2 active high) for multi-SRAM systems |
| OE | Output Enable | Asynchronous, active-low; tristates outputs during write data phase regardless of state |
| DQa–DQb, DQPa–DQPb | Data I/O + Parity | 18-bit bidirectional data bus plus 4-bit parity (22 pins total); direction controlled by OE and internal logic |
| ADV/LD | Address Counter Control | High = advance internal burst counter; Low = load new address - enables burst vs. random access mode |
| ZZ | Deep Sleep | Active-low; places device in low-power standby (IDD ≤ 50 µA) while retaining memory contents |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) Architecture | Enables unlimited consecutive read/write transitions with no wait states - critical for packet buffering in switch fabric |
| Synchronous Self-Timed Writes | Eliminates external write pulse timing constraints; internal logic guarantees data capture within one clock cycle |
| IEEE 1149.1 JTAG Boundary Scan | Supports in-system test and debug of PCB interconnects without requiring functional access to memory array |
| Byte-Write Capability (BWa/BWb) | Allows partial-word updates without read-modify-write cycles - reduces bus traffic in protocol stack buffers |
| 2.5 V Core & I/O Supply | Single-supply operation lowers BOM count and improves noise margin vs. mixed-voltage designs |
Applications
| Telecom Line Cards | Network Packet Buffers |
|---|---|
|
Use Scenario: High-speed line interface modules in carrier-grade routers handling OC-192/STM-64 traffic. IC Role / Device Role / Timing Role: Primary packet buffer SRAM interfacing directly with SerDes PHY and traffic manager ASIC. Use Value: 200 MHz pipelined throughput and zero-wait-state operation sustain full-duplex 10 Gbps line rates without stall cycles. |
Use Scenario: Shared memory pool for ingress/egress queuing in enterprise L3 switches. IC Role / Device Role / Timing Role: Burst-accessed SRAM providing deterministic latency for QoS-aware scheduling logic. Use Value: Linear burst mode aligns with 64-byte cache lines; ECC ensures packet header integrity across multi-day uptime. |
| Baseband Processing Units | Industrial Real-Time Controllers |
|
Use Scenario: LTE/5G baseband units performing channel coding/decoding with strict timing deadlines. IC Role / Device Role / Timing Role: Dual-port accessible SRAM used as ping-pong buffer between FFT and Viterbi engines. Use Value: ADV/LD-controlled burst addressing enables seamless address pointer handoff; ZZ mode cuts idle power by >99%. |
Use Scenario: Safety-critical motion controllers in semiconductor manufacturing equipment. IC Role / Device Role / Timing Role: Deterministic memory for servo loop lookup tables and fault history logging. Use Value: On-chip SEC-DED ECC meets IEC 61508 SIL-3 requirements for data corruption immunity in long-life deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1462KV25-250AXC | 250 MHz speed grade; 2.5 ns access time vs. 3.2 ns; higher operating current (210 mA @ 2M×18) | Required where system clock exceeds 200 MHz and sub-3 ns latency is mandatory | Select when bandwidth > 3.6 GB/s is needed and thermal/power budget allows |
| IS61WV102432BLL-10TLI | No on-chip ECC; 10 ns async access; 3.3 V core/I/O; non-pipelined ZBT-compatible interface | Lacks burst coherency and ECC - suitable only for legacy designs without SER requirements | Use only if migrating from older ZBT systems and ECC is not required |
Compared with CY7C1462KV25-250AXC, this 200 MHz variant trades 25% lower bandwidth for reduced power and thermal load; versus IS61WV102432BLL-10TLI, it delivers deterministic pipelined timing and hardware ECC - essential for modern telecom and industrial safety applications.
Availability
CY7C1462KV25-200AXC is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, baseband processing units, and industrial real-time controllers requiring stable component supply across extended production lifecycles.
Supply support for CY7C1462KV25-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable SoCs for industrial, automotive, and communications markets.
CY7C1462KV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-bandwidth memory subsystems in packet-switched infrastructure where latency predictability and data reliability are non-negotiable.
FAQ
What is the function of the ADV/LD pin in burst-mode operation?
The ADV/LD pin controls the internal address counter behavior: when HIGH and CEN is active, it advances the counter to the next sequential address for burst reads/writes; when LOW, it loads a new starting address from A[18:0]. This enables seamless switching between burst and random access without external address generation logic.
Does CY7C1462KV25-200AXC support interleaved burst addressing?
Yes - the device supports both linear and interleaved burst orders, selectable via the MODE pin. Interleaved mode maps addresses to optimize cache-line access patterns in CPU-centric systems, while linear mode suits packet-oriented streaming applications like Ethernet frame buffering.
How does the ZZ (sleep) mode affect data retention and wake-up latency?
In ZZ mode, core power drops to ≤50 µA while retaining full memory contents; wake-up requires only one CLK cycle after ZZ deassertion before valid data appears on DQ pins. No refresh or reinitialization is needed, making it ideal for low-duty-cycle control-plane buffers.
Can the ECC be disabled to use all bits as user data?
No - ECC is hardwired and always active; the 4 parity bits (DQPa–DQPb) are dedicated and cannot be repurposed. The device delivers 18-bit data width with integrated SEC-DED protection - no configuration register or pin exists to disable ECC functionality.
CY7C1462KV25-200AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 36Mbit
- Memory Organization:
- 2M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.2 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1462KV25-200AXC FAQ
1.How can I place an order for CY7C1462KV25-200AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1462KV25-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1462KV25-200AXC reliable?
The price and inventory of CY7C1462KV25-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1462KV25-200AXC is usually 5 days.
3.What payment methods are accepted for CY7C1462KV25-200AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1462KV25-200AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1462KV25-200AXC?
CY7C1462KV25-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1462KV25-200AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1462KV25-200AXC?
For technical support, including CY7C1462KV25-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1462KV25-200AXC requirements.
6.How does Aetrix verify that CY7C1462KV25-200AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1462KV25-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1462KV25-200AXC meets industry standards.
7.What is the process for return or replacement of CY7C1462KV25-200AXC?
All CY7C1462KV25-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1462KV25-200AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1462KV25-200AXC part is unused and in its original packaging.
Return procedure for CY7C1462KV25-200AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1462KV25-200AXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

