Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1462KVE33-167AXC

Part No.:
CY7C1462KVE33-167AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1462KVE33-167AXC.pdf
Description:
IC SRAM 36MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,823

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1462KVE33 from Cypress Semiconductor is a 36-Mbit (2M × 18) synchronous pipelined SRAM with NoBL™ architecture, on-chip ECC, and 167 MHz operation. It delivers zero wait-state back-to-back read/write cycles, 3.3-V core/2.5-V I/O supply support, and JEDEC-standard 165-ball FBGA packaging. Used in high-throughput networking line cards for packet buffering with SER mitigation.

For engineers reviewing the CY7C1462KVE33 datasheet, CY7C1462KVE33 pinout, CY7C1462KVE33 application, or CY7C1462KVE33 equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write granularity (BWa–BWb only), ECC-enabled data integrity, and 167 MHz timing compliance in 2M × 18 mode.

Technical Context

This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and outputs are driven from output registers synchronized to CLK. The internal burst counter advances on ADV/LD HIGH, supporting linear or interleaved addressing per MODE strap.

Write operations are self-timed and synchronous-no external write pulse timing constraints-while OE remains asynchronous but masked during write data phases. ECC encoding/decoding occurs on-chip, correcting single-bit errors and detecting double-bit errors without CPU intervention.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (2M × 18 organization)
Max Clock Frequency167 MHz - supports sustained 167 MT/s throughput with no wait states
Access Time3.4 ns - clock-to-output delay at 167 MHz, enabling tight timing closure
Supply VoltagesVDD = 3.3 V ± 0.3 V; VDDQ = 2.5 V ± 0.2 V - dual-rail I/O for compatibility with 2.5-V logic domains
ECC SupportOn-chip SEC-DED - corrects single-bit errors and detects double-bit errors in real time
Burst ModeConfigurable linear or interleaved via MODE pin - matches processor/cache burst patterns
Byte Write ControlBWa and BWb only - enables independent 9-bit writes to DQa/DQb and DQPa/DQPb groups

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), JEDEC-standard, Pb-free, 13 mm × 15 mm footprint, 1.0 mm ball pitch.

Pin/TerminalCircuit RoleDesign Meaning
A0, A1, A[2:19]Address Input20-bit synchronous address bus sampled on rising CLK edge; selects one of 2M locations in 2M × 18 mode
BWa, BWbByte Write SelectActive-low synchronous controls for 9-bit write segments: BWa → DQa/DQPa, BWb → DQb/DQPb
CLK, CENClock & EnableCLK qualified by CEN (active LOW); CEN deassertion extends previous cycle without deselection
CE1, CE2, CE3Chip Enable GroupThree-level synchronous enable: CE1/CE3 active LOW, CE2 active HIGH - enables bank isolation in multi-SRAM systems
DQa–DQb, DQPa–DQPbData I/O + Parity18-bit bidirectional data + 2-bit parity I/O; automatically tristated during write data phase regardless of OE state
MODEBurst ConfigurationStrap pin: HIGH = interleaved burst, LOW = linear burst; must be stable during operation
ADV/LDBurst Counter ControlHIGH advances internal burst counter; LOW loads new address - enables seamless burst/non-burst transitions

Key Features

FeatureDesign Value
No Bus Latency™ ArchitectureEnables true back-to-back read/write with no turnaround cycles - eliminates pipeline stalls in burst-intensive traffic
Synchronous Self-Timed WritesRemoves external write-pulse timing constraints - simplifies timing budget and PCB layout
On-Chip SEC-DED ECCReduces soft error-induced system crashes in radiation-prone environments (e.g., telecom base stations)
Configurable Burst OrderLinear or interleaved via MODE pin - aligns with MIPS, PowerPC, or custom ASIC burst requirements
3.3-V Core / 2.5-V I/O SeparationAllows direct interfacing with 2.5-V FPGAs or processors while maintaining 3.3-V memory stability

Applications

Telecom Line Card BufferingHigh-Speed Test Equipment Memory

Use Scenario: Storing and forwarding variable-length packets in OC-192/STM-64 line interface units.

IC Role / Device Role / Timing Role: Primary packet buffer SRAM with deterministic 167 MHz access and ECC protection against cosmic-ray-induced bit flips.

Use Value: Enables >99.999% uptime by preventing uncorrectable memory errors in carrier-grade infrastructure.

Use Scenario: Capturing high-speed digital waveforms from 1+ GSPS ADCs in automated test systems.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency capture memory with pipelined reads/writes synchronized to system clock.

Use Value: Sustains 167 MT/s continuous streaming without FIFO overflow or timing violations.

Avionics Data RecorderIndustrial PLC Motion Control Buffer

Use Scenario: Recording flight-critical sensor telemetry with tamper-proof integrity verification.

IC Role / Device Role / Timing Role: ECC-protected SRAM storing timestamped sensor frames before encryption and storage.

Use Value: Guarantees single-bit error correction and double-bit error detection per 18-bit word - meeting DO-254 Level A requirements.

Use Scenario: Holding interpolated motion profiles and real-time axis position updates in multi-axis CNC controllers.

IC Role / Device Role / Timing Role: Low-latency, deterministic-access buffer synchronizing servo loop updates across 4+ axes.

Use Value: Eliminates jitter in position command delivery by removing wait states between read-modify-write sequences.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV204818BLL-167BLINo on-chip ECC; 2M × 18, 167 MHz, 3.3-V core/2.5-V I/O; 165-ball FBGALacks SEC-DED capability - requires external error handling or higher-reliability system-level redundancySelect when ECC is managed externally and cost sensitivity outweighs SER risk.
MT48LC32M16A2P-6A:GSDR SDRAM (not SRAM); 512 Mbit, 16-bit, 166 MHz; different timing model and refresh requirementRequires periodic refresh, lacks true zero-wait-state pipelining, incompatible burst protocolSelect only if system already uses SDRAM controller and latency tolerance allows refresh overhead.

Compared with IS61WV204818BLL-167BLI and MT48LC32M16A2P-6A:G, the CY7C1462KVE33 uniquely combines 167 MHz NoBL™ throughput, on-die SEC-DED ECC, and synchronous self-timed writes - making it irreplaceable where deterministic latency and radiation-hardened reliability are co-required.

Availability

CY7C1462KVE33 is available at Aetrix Electronics and suitable for telecom line card buffering, avionics data recorders, and industrial PLC motion control buffers requiring stable component supply across extended production lifecycles.

Supply support for CY7C1462KVE33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for mission-critical embedded systems.

The CY7C146x family targets high-speed, zero-latency buffering in networking, test equipment, and aerospace applications where deterministic timing and data integrity are non-negotiable.

FAQ

What is the function of the MODE pin on CY7C1462KVE33?

The MODE pin configures burst address sequencing: pulled HIGH (or left floating) selects interleaved burst order; pulled LOW selects linear burst order. It must remain static during device operation and is sampled only at power-up or reset. This setting directly determines how consecutive addresses increment during burst accesses, aligning with host processor expectations.

Does CY7C1462KVE33 support 1M × 36 organization?

No. CY7C1462KVE33 is exclusively a 2M × 18 device. The "1M × 36" configuration is supported only by CY7C1460KV33 and CY7C1460KVE33 variants. Pinout, byte-write signal count (BWs), and internal address decoding differ - CY7C1462KVE33 has only BWa and BWb, not BWc/BWd, confirming its 2M × 18 identity.

How does the on-chip ECC operate during read cycles?

During every read, the ECC decoder checks the associated parity bits (DQPa–DQPb). If a single-bit error is detected in the 18-bit data word, it is corrected transparently before output register latching; the corrected data appears at DQa–DQb on the next clock edge. A double-bit error triggers an uncorrectable error flag (not exposed externally), and uncorrected data is output - system-level error reporting must be implemented separately.

Can CE2 be used as an active-LOW enable like CE1 and CE3?

No. CE2 is defined as active HIGH per the datasheet pin definition and truth table. Using it as active LOW violates timing and functional specifications. Correct bank selection requires CE1 and CE3 asserted LOW while CE2 is asserted HIGH - this three-signal combination ensures proper device enable/disable behavior and avoids partial selection glitches.

CY7C1462KVE33-167AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1462KVE33-167AXC FAQ

1.How can I place an order for CY7C1462KVE33-167AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1462KVE33-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1462KVE33-167AXC reliable?

The price and inventory of CY7C1462KVE33-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1462KVE33-167AXC is usually 5 days.

3.What payment methods are accepted for CY7C1462KVE33-167AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1462KVE33-167AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1462KVE33-167AXC?

CY7C1462KVE33-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1462KVE33-167AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1462KVE33-167AXC?

For technical support, including CY7C1462KVE33-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1462KVE33-167AXC requirements.

6.How does Aetrix verify that CY7C1462KVE33-167AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1462KVE33-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1462KVE33-167AXC meets industry standards.

7.What is the process for return or replacement of CY7C1462KVE33-167AXC?

All CY7C1462KVE33-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1462KVE33-167AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1462KVE33-167AXC part is unused and in its original packaging.

Return procedure for CY7C1462KVE33-167AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1462KVE33-167AXC Tags

  • CY7C1462KVE33-167AXC
  • CY7C1462KVE33-167AXC PDF
  • CY7C1462KVE33-167AXC Datasheet
  • CY7C1462KVE33-167AXC Specifications
  • CY7C1462KVE33-167AXC Images
  • Infineon Technologies
  • Infineon Technologies CY7C1462KVE33-167AXC
  • Buy CY7C1462KVE33-167AXC
  • CY7C1462KVE33-167AXC Price
  • CY7C1462KVE33-167AXC Distributor
  • CY7C1462KVE33-167AXC Supplier
  • CY7C1462KVE33-167AXC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER