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Infineon Technologies CY7C1463KV33-133AXC

Part No.:
CY7C1463KV33-133AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1463KV33-133AXC.pdf
Description:
IC SRAM 36MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,362

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Product details

Overview

CY7C1463KV33-133AXC from Cypress Semiconductor is a 36-Mbit (2M × 18) synchronous flow-through SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It supports true back-to-back read/write operations at 133 MHz with zero wait states, delivers 6.5 ns clock-to-output delay, and features registered inputs, byte write capability, and three chip enables for depth expansion.

For engineers reviewing the CY7C1463KV33-133AXC datasheet, CY7C1463KV33-133AXC pinout, CY7C1463KV33-133AXC application, or CY7C1463KV33-133AXC equivalent, key selection criteria include burst mode control (linear/interleaved), synchronous self-timed writes, ZZ sleep mode power management, and JEDEC-standard 100-pin TQFP compatibility with ZBT™-equivalent timing behavior.

Technical Context

The device implements a synchronous flow-through architecture where all inputs-including address, WE, BWx, CE1–CE3, ADV/LD, and CEN-are registered on the rising edge of CLK. Its NoBL™ logic eliminates dead cycles between consecutive read and write operations by enabling data transfer on every clock cycle without pipeline stalls.

Burst addressing is controlled by MODE (linear vs. interleaved), A0/A1, and ADV/LD; internal burst counter advances on ADV/LD HIGH, while new addresses load on ADV/LD LOW. Output drivers are synchronously tri-stated during write data capture, independent of OE state, preventing bus contention in high-speed systems.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (2M × 18 configuration), enabling compact high-bandwidth buffer designs for packet-switching ASICs.
Max Clock Frequency 133 MHz - supports sustained 133 MT/s throughput with no wait states in back-to-back read/write sequences.
Access Time (tCDV) 6.5 ns - defines minimum clock-to-valid-output delay for timing-critical interfaces like SerDes framers.
Supply Voltages VDD = 3.3 V ± 0.3 V (core); VDDQ = 3.3 V ± 0.3 V (I/O) - ensures compatibility with 3.3 V LVTTL/SSTL-3 signaling domains.
Burst Capability Linear or interleaved 4-word burst - selectable via MODE pin, matching industry-standard burst protocols in networking SoCs.
Power Management ZZ sleep mode reduces standby current to ≤ 50 µA - preserves data integrity while cutting dynamic power in idle periods.
Byte Write Control Four active-low BWx inputs (BWA–BWD) enable per-byte write masking - eliminates need for external write gating logic.

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), JEDEC-standard Pb-free, 14 mm × 14 mm body, 0.5 mm pitch.

Pin/Terminal Circuit Role Design Meaning
CLK Synchronous clock input Rising-edge-triggered master clock; qualified by CEN - defines all timing boundaries for register sampling and access initiation.
CEN Clock enable Active-low synchronous gate for CLK - suspends operation without deselecting device, extending previous cycle for low-power timing control.
CE1, CE3 Synchronous chip enable (active low) Paired with CE2 (active high) to form 3-signal decode - enables flexible bank selection and seamless depth expansion across multiple devices.
ADV/LD Address advance/load control LOW loads new address; HIGH increments internal burst counter - decouples address sequencing from external controller overhead.
BWA–BWD Byte write select Per-byte write mask signals - allow partial-word updates without read-modify-write cycles, critical for header manipulation in packet buffers.
DQ[0:17], DQP[A:D] Bidirectional data I/O + parity 18-bit data + 4-bit parity interface - supports ECC-capable systems; automatically tri-stated during write data capture regardless of OE.
OE Asynchronous output enable Active-low tri-state control - overrides internal logic only outside write/data windows; prevents contention during burst transitions.
MODE Burst order configuration Strap pin selecting linear (GND) or interleaved (VDD/floating) burst sequence - matches CPU or DMA controller burst expectations.
ZZ Asynchronous sleep mode Active-high entry into low-power retention mode - maintains data integrity while reducing supply current by >99% versus active standby.

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) architecture Eliminates inter-access dead cycles - enables continuous 133 MT/s throughput in mixed read/write workloads typical of buffer managers.
Synchronous self-timed writes Removes external write pulse timing constraints - simplifies FPGA or ASIC interface design by embedding write completion logic internally.
Registered inputs with single-cycle pipelining Ensures deterministic setup/hold timing across temperature/voltage - eliminates need for external delay tuning in high-speed PCB layouts.
Three chip enables (CE1/CE2/CE3) Supports 2:1 or 4:1 depth expansion without external decoding logic - reduces BOM count and routing complexity in multi-SRAM subsystems.
Automatic output tri-state during write Prevents bus contention without OE coordination - allows shared data bus operation with minimal control signal overhead.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/3 switches with real-time latency constraints.

IC Role / Device Role / Timing Role: High-speed flow-through SRAM acting as primary ingress/egress packet buffer, synchronized to switch fabric clock.

Use Value: 6.5 ns tCDV and zero-wait-state back-to-back access enable sub-100 ns frame turnaround time under full line-rate traffic.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH framer modules requiring burst-aligned data handling.

IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly with framer ASIC's 133 MHz parallel bus.

Use Value: Interleaved burst mode matches framer's native address mapping, eliminating address translation logic and reducing FPGA resource usage.

Baseband Processor Cache Radar Signal Processing Buffer

Use Scenario: Temporary storage of decoded channel data in 4G/LTE baseband processors before FFT or channel estimation.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory supporting burst-mode DMA transfers from modem DSP cores.

Use Value: Byte write capability allows selective update of channel coefficients without full-word overwrites, reducing memory bandwidth pressure.

Use Scenario: Real-time buffering of ADC samples in phased-array radar front-ends prior to digital beamforming.

IC Role / Device Role / Timing Role: Deterministic-access SRAM providing jitter-free sample streaming to FPGA-based beamformer pipelines.

Use Value: ZZ sleep mode enables rapid power cycling between radar pulses, cutting average power by >85% in duty-cycled operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L133PFI 2.5 V core/I/O, 133 MHz, 36-Mbit (1M × 36), different burst control (no MODE pin), requires external OE timing management. Lacks ZZ sleep mode and automatic write tri-state; suited for legacy 2.5 V systems where voltage scaling is mandatory. Select when migrating from older IDT ZBT designs and 2.5 V operation is required; verify OE timing margins in burst transitions.
ISSI IS61WV102432BLL-133TQLI 3.3 V, 133 MHz, 36-Mbit (1M × 36), no NoBL™ architecture - inserts 1-cycle gap between write-read; lacks ADV/LD and MODE pins. Requires external address generation for burst; higher effective latency in mixed-access patterns common in packet processing. Choose for cost-sensitive applications where strict zero-wait-state performance is not required and simpler control logic is preferred.

Compared with IDT72V2115L133PFI and IS61WV102432BLL-133TQLI, CY7C1463KV33-133AXC uniquely delivers guaranteed zero-wait-state throughput, integrated burst sequencing, and autonomous power management - making it optimal for latency-constrained, high-dynamic-range memory subsystems.

Availability

CY7C1463KV33-133AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processor cache, and radar signal processing applications requiring stable component supply and long-term industrial availability.

Supply support for CY7C1463KV33-133AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1463KV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-bandwidth memory interfacing in networking and telecom infrastructure where latency predictability and burst efficiency are critical.

FAQ

What is the difference between CY7C1461KV33 and CY7C1463KV33?

CY7C1461KV33 is configured as 1M × 36 (36-bit data bus), while CY7C1463KV33 is configured as 2M × 18 (18-bit data bus with 4-bit parity). Both share identical timing, pinout, and feature set, but differ in memory organization and DQ/DQP pin allocation-verified in Figures 1 and 2 of datasheet 001-66681 Rev. *G.

Does CY7C1463KV33-133AXC require an external clock buffer?

No. The device accepts a clean 133 MHz single-ended CMOS clock directly on the CLK pin. Input setup/hold times (tDS/tDH = 2.0 ns min) are met using standard FPGA or ASIC clock outputs; no external buffering is needed if board-level jitter remains below 150 ps RMS.

How is burst order selected, and can it be changed dynamically?

Burst order is selected statically via the MODE pin: tied to GND for linear, VDD or floating for interleaved. It cannot be changed dynamically during operation-the pin is sampled only at power-up reset and is not re-evaluated during runtime.

What happens to data integrity during ZZ sleep mode?

Data integrity is fully preserved in ZZ mode: the SRAM retains all stored contents with ≤ 50 µA ICCZ current draw. The device exits ZZ mode synchronously on ZZ deassertion (LOW) and resumes normal operation after tZZEX = 20 ns, with no initialization delay or data loss.

CY7C1463KV33-133AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
36Mbit
Memory Organization:
2M x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1463KV33-133AXC FAQ

1.How can I place an order for CY7C1463KV33-133AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1463KV33-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1463KV33-133AXC reliable?

The price and inventory of CY7C1463KV33-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1463KV33-133AXC is usually 5 days.

3.What payment methods are accepted for CY7C1463KV33-133AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1463KV33-133AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1463KV33-133AXC?

CY7C1463KV33-133AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1463KV33-133AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1463KV33-133AXC?

For technical support, including CY7C1463KV33-133AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1463KV33-133AXC requirements.

6.How does Aetrix verify that CY7C1463KV33-133AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1463KV33-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1463KV33-133AXC meets industry standards.

7.What is the process for return or replacement of CY7C1463KV33-133AXC?

All CY7C1463KV33-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1463KV33-133AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1463KV33-133AXC part is unused and in its original packaging.

Return procedure for CY7C1463KV33-133AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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