Infineon Technologies CY7C1470BV25-167BZCT

Overview

CY7C1470BV25-167BZCT from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with No Bus Latency™ (NoBL™) architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 167 MHz with 3.4 ns clock-to-output delay, supports zero-wait-state back-to-back read/write operations, and uses single 2.5V VDD with separate 2.5V VDDQ I/O supply.

For engineers reviewing the CY7C1470BV25-167BZCT datasheet, CY7C1470BV25-167BZCT pinout, CY7C1470BV25-167BZCT application, or CY7C1470BV25-167BZCT equivalent, this device delivers deterministic pipelined timing, byte-write granularity via four BW inputs, JTAG boundary-scan testability, and JEDEC-standard 100-pin TQFP packaging for board-level signal integrity in burst-mode data path systems.

Technical Context

This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs pass through output registers synchronized to CLK. The internal NoBL logic eliminates bus latency by enabling consecutive read/write cycles without inter-cycle gaps.

Burst operation is controlled by ADV/LD and MODE pins-linear or interleaved burst order is selected at power-up-and self-timed write circuitry ensures consistent write completion independent of system timing margins. Three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) provide flexible bank selection in multi-SRAM configurations.

Key Specifications

Pinout & Package

Package: 100-pin Thin Quad Flat Package (TQFP), RoHS-compliant, body size 14 mm × 14 mm, lead pitch 0.5 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with CY7C1470BV25-167BZCT, the -250BZCT variant trades higher power (450 mA vs. 400 mA) for 17% faster throughput, while the IS61WV102436BLL offers lower BOM cost at the expense of I/O noise resilience and JTAG diagnostics capability.

Availability

CY7C1470BV25-167BZCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and radar signal processing FIFOs requiring stable component supply across extended production lifecycles.

Supply support for CY7C1470BV25-167BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial systems, with emphasis on signal integrity and real-time determinism.

CY7C1470BV25 belongs to the NoBL™ SRAM product line, engineered specifically for zero-wait-state burst-mode data buffering in high-speed digital signal paths where pipeline efficiency and timing predictability are non-negotiable.

FAQ

What is the function of the MODE pin, and how does it affect burst behavior?

The MODE pin selects burst order: pulled HIGH enables interleaved burst (e.g., 0,2,1,3), pulled LOW enables linear burst (0,1,2,3). It must be set at power-up and held static during operation. Floating defaults to HIGH, so default behavior is interleaved-matching ZBT-compatible systems without external strapping.

Can CY7C1470BV25-167BZCT operate with only VDD applied, or is VDDQ mandatory?

VDDQ is mandatory. The device requires both 2.5V VDD (core logic) and 2.5V VDDQ (I/O drivers) to function. Omitting VDDQ leaves DQ/DQP pins unpowered and causes undefined output states, bus contention, or latch-up risk. Both supplies must be ramped monotonically during power-up.

How does the ZZ (Sleep) mode interact with ongoing read/write operations?

Asserting ZZ LOW while an operation is in progress completes the current cycle before entering deep sleep. No new accesses are accepted, and internal clocks halt. Outputs go high-impedance after the final data transfer. Exiting ZZ requires releasing ZZ and waiting tZZH (100 ns min) before re-enabling CEN/CLK.

Is the 100-pin TQFP package of CY7C1470BV25-167BZCT pin-compatible with CY7C1472BV25 or CY7C1474BV25?

No. Although all three share NoBL architecture and functional equivalence, CY7C1470BV25 uses 100-pin TQFP for 2M×36, while CY7C1472BV25 (4M×18) and CY7C1474BV25 (1M×72) use 165-ball and 209-ball FBGA packages respectively-different pin counts, layouts, and signal allocations preclude physical compatibility.