Infineon Technologies CY7C1470BV25-200AXC
- Part No.:
- CY7C1470BV25-200AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1470BV25-200AXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1470BV25-200AXC from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom ASIC/FPGA interfaces. It operates at 200 MHz with zero wait states, supports 2.5 V core and I/O supply, features fully registered inputs/outputs, and delivers 3.0 ns clock-to-output delay. Used in packet buffering and cache coherency circuits where back-to-back read/write transitions are critical.
For engineers reviewing the CY7C1470BV25-200AXC datasheet, CY7C1470BV25-200AXC pinout, CY7C1470BV25-200AXC application, or CY7C1470BV25-200AXC equivalent, key selection criteria include burst order configuration (linear/interleaved), byte write granularity (four 9-bit groups), synchronous self-timed write control, JTAG boundary scan support, and TQFP/FBGA package compatibility for board-level timing closure.
Technical Context
This SRAM implements a fully synchronous, pipelined architecture with all inputs and outputs registered to the rising edge of CLK, qualified by CEN. Internal address latching, burst counter advancement (via ADV/LD), and on-chip self-timed write logic eliminate external timing constraints for consecutive operations.
Burst capability supports both linear and interleaved orders via MODE pin strap; byte write control uses four independent BWa–BWd signals active-low, each enabling 9-bit data/parity pairs (DQa/DQPa through DQd/DQPd). OE is asynchronous but masked during write data cycles to prevent bus contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization), enabling 9-byte aligned data transfers per cycle |
| Max Clock Frequency | 200 MHz - guarantees full-speed operation without wait states in synchronous bus systems |
| Access Time (tCO) | 3.0 ns - defines minimum clock-to-valid-output delay for timing budgeting in FPGA-attached designs |
| Supply Voltages | 2.5 V VDD (core) and 2.5 V VDDQ (I/O) - eliminates level-shifting requirements in 2.5 V system environments |
| Burst Modes | Linear or interleaved via MODE pin - determines address increment pattern for sequential accesses in cache line fills |
| Byte Write Groups | Four independent 9-bit groups (BWa–BWd) - allows partial-word writes without read-modify-write overhead |
| JTAG Support | IEEE 1149.1 compliant - enables boundary scan testing of SRAM interconnects on dense PCBs |
Pinout & Package
Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 165-ball FBGA (15 × 17 × 1.4 mm) packages. Pin functions validated per Cypress Document 001-15032 Rev. *O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Input | Latched on rising CLK edge; selects one of 2M addresses in 2M × 36 mode |
| BWa–BWd | Synchronous Byte Write Select | Active-low controls 9-bit data/parity groups (e.g., BWa enables DQa/DQPa); qualified by WE |
| CE1, CE2, CE3 | Synchronous Chip Enable | Three-input decode (CE1/CE3 active-low, CE2 active-high) enables depth expansion without glue logic |
| ADV/LD | Synchronous Address Control | HIGH advances internal burst counter; LOW loads new address - required after deselect to restart sequence |
| MODE | Strap Input | Static configuration of burst order: HIGH = interleaved, LOW = linear; must remain stable during operation |
| DQa–DQd / DQPa–DQPd | Synchronous Bidirectional Data I/O | 36 data + 4 parity bits; direction controlled by OE and internal state; tri-stated automatically during write data phase |
| CLK, CEN | Clock & Enable | CLK qualified by CEN (active-low); deasserting CEN extends previous cycle without losing state |
| OE | Asynchronous Output Enable | Active-low enables output drivers; masked during write data window to prevent bus conflicts |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables unlimited true back-to-back reads/writes with zero wait states - eliminates pipeline stalls in burst-intensive traffic |
| On-chip Self-timed Write Logic | Removes external write pulse width constraints - simplifies timing closure versus asynchronous SRAMs |
| Four Independent Byte Write Enables | Supports 9-bit granular writes without read-modify-write - reduces bandwidth overhead in partial updates |
| Synchronous Burst Ordering | Configurable linear/interleaved via MODE pin - matches CPU or DMA controller burst patterns without software intervention |
| JTAG Boundary Scan (IEEE 1149.1) | Validates interconnect integrity on high-density boards - critical for signal integrity verification in multi-SRAM systems |
Applications
| Packet Buffering in Switch ASICs | Cache Coherency Directory Storage |
|---|---|
|
Use Scenario: High-speed Ethernet switch fabric buffers ingress/egress packets across multiple ports with deterministic latency. IC Role / Device Role / Timing Role: Primary burst-accessed SRAM storing packet headers and metadata; synchronized to switch fabric clock domain. Use Value: 200 MHz zero-wait-state operation sustains 1.44 Gbps sustained throughput (36-bit × 200 MHz), matching 10G MAC interface rates. |
Use Scenario: Multi-core processor cluster maintains shared cache coherency state using directory-based protocols. IC Role / Device Role / Timing Role: Dedicated directory RAM holding tag/state entries; accessed concurrently by snoop controllers and L2 caches. Use Value: Fully registered interface ensures setup/hold compliance across clock domains; byte write capability updates individual cache line states without full-line writes. |
| FPGA-Based Protocol Accelerators | Telecom Line Card Payload Buffers |
|
Use Scenario: FPGA implements TCP offload engine requiring low-latency access to connection state tables and reassembly buffers. IC Role / Device Role / Timing Role: Off-chip memory extension tightly coupled to FPGA fabric via dedicated high-speed parallel bus. Use Value: Pipelined NoBL architecture eliminates FPGA logic delays in address generation - enables single-cycle access predictability. |
Use Scenario: SONET/SDH line cards buffer ATM cells or IP packets across OC-48/192 interfaces with strict jitter tolerance. IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via burst reads/writes synchronized to line rate clock. Use Value: 3.0 ns tCO and 2.5 V signaling meet sub-5 ns timing windows required for OC-192 (9.953 Gbps) payload alignment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1470BV25-250AXC | 250 MHz speed grade; identical pinout, timing, and feature set except faster tCO (3.0 ns vs same spec) | Required where system clock exceeds 200 MHz but board layout supports tighter timing margins | Select when design targets >200 MHz bus frequency and power budget permits higher operating current (450 mA vs 450 mA max) |
| AS7C3256B-20TIN | Asynchronous 256K × 16 SRAM; no pipelining, no burst, no JTAG, 3.3 V only, 15 ns access | Suitable only for non-burst, low-frequency control plane storage - not interchangeable in data path | Consider only for cost-sensitive, low-bandwidth management microcontroller interfaces where timing flexibility exists |
Compared with CY7C1470BV25-200AXC, the -250AXC offers higher throughput at identical voltage and pin compatibility, while the AS7C3256B-20TIN lacks pipelining, burst, and JTAG - making it unsuitable for high-speed data path replacement without architectural redesign.
Availability
CY7C1470BV25-200AXC is available at Aetrix Electronics and suitable for packet buffering in network switches, cache coherency directory storage in multi-core processors, and FPGA-based protocol acceleration requiring stable component supply across production lifecycles.
Supply support for CY7C1470BV25-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in programmable system-on-chip solutions, memory, and USB-C/USB-PD controllers.
CY7C1470BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth memory interfacing in ASIC, FPGA, and network processor subsystems.
FAQ
What is the function of the MODE pin on CY7C1470BV25-200AXC?
The MODE pin is a static strap input that configures burst address order: pulled HIGH (or left floating) selects interleaved burst mode; pulled LOW selects linear burst mode. It must be held stable during device operation, as dynamic switching causes undefined address sequencing and potential data corruption during burst accesses.
Can CY7C1470BV25-200AXC operate with only two Chip Enables asserted?
No. All three Chip Enables (CE1 active-low, CE2 active-high, CE3 active-low) must be simultaneously asserted at the rising edge of CLK to initiate any access. Partial enable assertion results in deselection - the device ignores address, data, and control inputs and places outputs in high-impedance state.
How does the device handle byte write operations during a burst write sequence?
Each BWa–BWd signal independently enables its associated 9-bit data/parity group (e.g., BWa controls DQa/DQPa) during every clock cycle of the burst. The write is qualified by WE and occurs synchronously on the rising CLK edge; no external write pulse width control is needed due to on-chip self-timed write circuitry.
Is the ZZ Sleep Mode supported in the CY7C1470BV25-200AXC variant?
Yes. The ZZ pin provides asynchronous deep-sleep control: driving ZZ LOW reduces standby current to ≤120 mA while retaining data. This mode is independent of CEN and CLK, and exit latency is specified as ≤20 ns - enabling rapid wake-up for burst-oriented traffic patterns in power-constrained line cards.
CY7C1470BV25-200AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1470BV25-200AXC FAQ
1.How can I place an order for CY7C1470BV25-200AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV25-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV25-200AXC reliable?
The price and inventory of CY7C1470BV25-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV25-200AXC is usually 5 days.
3.What payment methods are accepted for CY7C1470BV25-200AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV25-200AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470BV25-200AXC?
CY7C1470BV25-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470BV25-200AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470BV25-200AXC?
For technical support, including CY7C1470BV25-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV25-200AXC requirements.
6.How does Aetrix verify that CY7C1470BV25-200AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV25-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV25-200AXC meets industry standards.
7.What is the process for return or replacement of CY7C1470BV25-200AXC?
All CY7C1470BV25-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV25-200AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV25-200AXC part is unused and in its original packaging.
Return procedure for CY7C1470BV25-200AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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