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Infineon Technologies CY7C1470BV25-200AXC

Part No.:
CY7C1470BV25-200AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1470BV25-200AXC.pdf
Description:
IC SRAM 72MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,772

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Product details

Overview

CY7C1470BV25-200AXC from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom ASIC/FPGA interfaces. It operates at 200 MHz with zero wait states, supports 2.5 V core and I/O supply, features fully registered inputs/outputs, and delivers 3.0 ns clock-to-output delay. Used in packet buffering and cache coherency circuits where back-to-back read/write transitions are critical.

For engineers reviewing the CY7C1470BV25-200AXC datasheet, CY7C1470BV25-200AXC pinout, CY7C1470BV25-200AXC application, or CY7C1470BV25-200AXC equivalent, key selection criteria include burst order configuration (linear/interleaved), byte write granularity (four 9-bit groups), synchronous self-timed write control, JTAG boundary scan support, and TQFP/FBGA package compatibility for board-level timing closure.

Technical Context

This SRAM implements a fully synchronous, pipelined architecture with all inputs and outputs registered to the rising edge of CLK, qualified by CEN. Internal address latching, burst counter advancement (via ADV/LD), and on-chip self-timed write logic eliminate external timing constraints for consecutive operations.

Burst capability supports both linear and interleaved orders via MODE pin strap; byte write control uses four independent BWa–BWd signals active-low, each enabling 9-bit data/parity pairs (DQa/DQPa through DQd/DQPd). OE is asynchronous but masked during write data cycles to prevent bus contention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization), enabling 9-byte aligned data transfers per cycle
Max Clock Frequency 200 MHz - guarantees full-speed operation without wait states in synchronous bus systems
Access Time (tCO) 3.0 ns - defines minimum clock-to-valid-output delay for timing budgeting in FPGA-attached designs
Supply Voltages 2.5 V VDD (core) and 2.5 V VDDQ (I/O) - eliminates level-shifting requirements in 2.5 V system environments
Burst Modes Linear or interleaved via MODE pin - determines address increment pattern for sequential accesses in cache line fills
Byte Write Groups Four independent 9-bit groups (BWa–BWd) - allows partial-word writes without read-modify-write overhead
JTAG Support IEEE 1149.1 compliant - enables boundary scan testing of SRAM interconnects on dense PCBs

Pinout & Package

Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 165-ball FBGA (15 × 17 × 1.4 mm) packages. Pin functions validated per Cypress Document 001-15032 Rev. *O.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Synchronous Address Input Latched on rising CLK edge; selects one of 2M addresses in 2M × 36 mode
BWa–BWd Synchronous Byte Write Select Active-low controls 9-bit data/parity groups (e.g., BWa enables DQa/DQPa); qualified by WE
CE1, CE2, CE3 Synchronous Chip Enable Three-input decode (CE1/CE3 active-low, CE2 active-high) enables depth expansion without glue logic
ADV/LD Synchronous Address Control HIGH advances internal burst counter; LOW loads new address - required after deselect to restart sequence
MODE Strap Input Static configuration of burst order: HIGH = interleaved, LOW = linear; must remain stable during operation
DQa–DQd / DQPa–DQPd Synchronous Bidirectional Data I/O 36 data + 4 parity bits; direction controlled by OE and internal state; tri-stated automatically during write data phase
CLK, CEN Clock & Enable CLK qualified by CEN (active-low); deasserting CEN extends previous cycle without losing state
OE Asynchronous Output Enable Active-low enables output drivers; masked during write data window to prevent bus conflicts

Key Features

Feature Design Value
No Bus Latency™ Architecture Enables unlimited true back-to-back reads/writes with zero wait states - eliminates pipeline stalls in burst-intensive traffic
On-chip Self-timed Write Logic Removes external write pulse width constraints - simplifies timing closure versus asynchronous SRAMs
Four Independent Byte Write Enables Supports 9-bit granular writes without read-modify-write - reduces bandwidth overhead in partial updates
Synchronous Burst Ordering Configurable linear/interleaved via MODE pin - matches CPU or DMA controller burst patterns without software intervention
JTAG Boundary Scan (IEEE 1149.1) Validates interconnect integrity on high-density boards - critical for signal integrity verification in multi-SRAM systems

Applications

Packet Buffering in Switch ASICs Cache Coherency Directory Storage

Use Scenario: High-speed Ethernet switch fabric buffers ingress/egress packets across multiple ports with deterministic latency.

IC Role / Device Role / Timing Role: Primary burst-accessed SRAM storing packet headers and metadata; synchronized to switch fabric clock domain.

Use Value: 200 MHz zero-wait-state operation sustains 1.44 Gbps sustained throughput (36-bit × 200 MHz), matching 10G MAC interface rates.

Use Scenario: Multi-core processor cluster maintains shared cache coherency state using directory-based protocols.

IC Role / Device Role / Timing Role: Dedicated directory RAM holding tag/state entries; accessed concurrently by snoop controllers and L2 caches.

Use Value: Fully registered interface ensures setup/hold compliance across clock domains; byte write capability updates individual cache line states without full-line writes.

FPGA-Based Protocol Accelerators Telecom Line Card Payload Buffers

Use Scenario: FPGA implements TCP offload engine requiring low-latency access to connection state tables and reassembly buffers.

IC Role / Device Role / Timing Role: Off-chip memory extension tightly coupled to FPGA fabric via dedicated high-speed parallel bus.

Use Value: Pipelined NoBL architecture eliminates FPGA logic delays in address generation - enables single-cycle access predictability.

Use Scenario: SONET/SDH line cards buffer ATM cells or IP packets across OC-48/192 interfaces with strict jitter tolerance.

IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via burst reads/writes synchronized to line rate clock.

Use Value: 3.0 ns tCO and 2.5 V signaling meet sub-5 ns timing windows required for OC-192 (9.953 Gbps) payload alignment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1470BV25-250AXC 250 MHz speed grade; identical pinout, timing, and feature set except faster tCO (3.0 ns vs same spec) Required where system clock exceeds 200 MHz but board layout supports tighter timing margins Select when design targets >200 MHz bus frequency and power budget permits higher operating current (450 mA vs 450 mA max)
AS7C3256B-20TIN Asynchronous 256K × 16 SRAM; no pipelining, no burst, no JTAG, 3.3 V only, 15 ns access Suitable only for non-burst, low-frequency control plane storage - not interchangeable in data path Consider only for cost-sensitive, low-bandwidth management microcontroller interfaces where timing flexibility exists

Compared with CY7C1470BV25-200AXC, the -250AXC offers higher throughput at identical voltage and pin compatibility, while the AS7C3256B-20TIN lacks pipelining, burst, and JTAG - making it unsuitable for high-speed data path replacement without architectural redesign.

Availability

CY7C1470BV25-200AXC is available at Aetrix Electronics and suitable for packet buffering in network switches, cache coherency directory storage in multi-core processors, and FPGA-based protocol acceleration requiring stable component supply across production lifecycles.

Supply support for CY7C1470BV25-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in programmable system-on-chip solutions, memory, and USB-C/USB-PD controllers.

CY7C1470BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth memory interfacing in ASIC, FPGA, and network processor subsystems.

FAQ

What is the function of the MODE pin on CY7C1470BV25-200AXC?

The MODE pin is a static strap input that configures burst address order: pulled HIGH (or left floating) selects interleaved burst mode; pulled LOW selects linear burst mode. It must be held stable during device operation, as dynamic switching causes undefined address sequencing and potential data corruption during burst accesses.

Can CY7C1470BV25-200AXC operate with only two Chip Enables asserted?

No. All three Chip Enables (CE1 active-low, CE2 active-high, CE3 active-low) must be simultaneously asserted at the rising edge of CLK to initiate any access. Partial enable assertion results in deselection - the device ignores address, data, and control inputs and places outputs in high-impedance state.

How does the device handle byte write operations during a burst write sequence?

Each BWa–BWd signal independently enables its associated 9-bit data/parity group (e.g., BWa controls DQa/DQPa) during every clock cycle of the burst. The write is qualified by WE and occurs synchronously on the rising CLK edge; no external write pulse width control is needed due to on-chip self-timed write circuitry.

Is the ZZ Sleep Mode supported in the CY7C1470BV25-200AXC variant?

Yes. The ZZ pin provides asynchronous deep-sleep control: driving ZZ LOW reduces standby current to ≤120 mA while retaining data. This mode is independent of CEN and CLK, and exit latency is specified as ≤20 ns - enabling rapid wake-up for burst-oriented traffic patterns in power-constrained line cards.

CY7C1470BV25-200AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1470BV25-200AXC FAQ

1.How can I place an order for CY7C1470BV25-200AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1470BV25-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1470BV25-200AXC reliable?

The price and inventory of CY7C1470BV25-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV25-200AXC is usually 5 days.

3.What payment methods are accepted for CY7C1470BV25-200AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV25-200AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1470BV25-200AXC?

CY7C1470BV25-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1470BV25-200AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1470BV25-200AXC?

For technical support, including CY7C1470BV25-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV25-200AXC requirements.

6.How does Aetrix verify that CY7C1470BV25-200AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1470BV25-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV25-200AXC meets industry standards.

7.What is the process for return or replacement of CY7C1470BV25-200AXC?

All CY7C1470BV25-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV25-200AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1470BV25-200AXC part is unused and in its original packaging.

Return procedure for CY7C1470BV25-200AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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