Infineon Technologies CY7C1470BV25-200BZC
- Part No.:
- CY7C1470BV25-200BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470BV25-200BZC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1470BV25-200BZC from Cypress Semiconductor is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36, operating at 200 MHz with zero wait states, 3.0 ns clock-to-output delay, single 2.5V core supply, and 2.5V I/O supply (VDDQ), used in high-throughput memory subsystems of network packet buffers and telecom line cards.
For engineers reviewing the CY7C1470BV25-200BZC datasheet, CY7C1470BV25-200BZC pinout, CY7C1470BV25-200BZC application, or CY7C1470BV25-200BZC equivalent, this device supports back-to-back read/write operations, byte-write control via BWa–BWd, synchronous self-timed writes, JTAG boundary scan, and burst modes (linear/interleaved) - critical for deterministic latency in real-time switching fabric designs.
Technical Context
The CY7C1470BV25-200BZC implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without inter-cycle gaps.
It uses three synchronous chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for bank selection, asynchronous OE for output tri-state control, and CEN to suspend clock recognition while preserving internal state. Burst addressing is controlled by ADV/LD and MODE strap, supporting linear or interleaved sequences up to four words per burst.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization), enabling compact 36-bit wide data paths in packet buffering applications. |
| Max Clock Frequency | 200 MHz - guarantees sustained 200 million transfers per second with no wait states in pipelined mode. |
| Access Time (tCO) | 3.0 ns - defines maximum clock-to-output delay, critical for meeting setup timing in 200 MHz system interfaces. |
| Supply Voltages | VDD = 2.5 V ± 0.2 V (core), VDDQ = 2.5 V ± 0.2 V (I/O) - mandates separate low-noise 2.5V rails for signal integrity. |
| Byte Write Control | BWa–BWd (active-low) - enables independent write masking of four 9-bit data groups (DQa/DQPa through DQd/DQPd). |
| Burst Capability | Linear or interleaved 4-word burst - reduces address bus traffic and improves bandwidth efficiency in sequential access patterns. |
| JTAG Support | IEEE 1149.1 compliant - provides boundary-scan testability for PCB assembly validation and in-system diagnostics. |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant Pb-free, JEDEC-standard footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Input | Latched on rising CLK edge; selects one of 2M addresses in 2M × 36 configuration. |
| BWa–BWd | Synchronous Byte Write Select | Active-low signals qualifying write to corresponding 9-bit data groups (e.g., BWa controls DQa/DQPa). |
| CE1, CE3 | Synchronous Chip Enable (active-low) | Combined with CE2 (active-high) to enable/disable device access synchronously on CLK edge. |
| CLK, CEN | Clock & Clock Enable | CLK qualified by CEN: when CEN = HIGH, clock is masked and internal state held; no power-down effect. |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O (36-bit + 4 parity) | Registered inputs/outputs; automatically tri-stated during write data phase regardless of OE state. |
| OE | Asynchronous Output Enable | Active-low; overrides internal logic to force output drivers into high-Z, but masked during write cycles. |
| ADV/LD, MODE | Burst Control & Burst Order Strap | ADV/LD loads new address or advances burst counter; MODE (strapped HIGH/LOW) selects interleaved/linear burst order. |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL) Architecture | Enables true back-to-back read/write operations with zero wait states, increasing effective bandwidth by eliminating pipeline stalls. |
| Fully Registered Pipelined Interface | All inputs and outputs synchronized to CLK rising edge, simplifying timing closure in high-speed FPGA/ASIC memory interfaces. |
| Synchronous Self-Timed Writes | On-chip write timing control eliminates external write pulse width constraints and ensures reliable data capture at 200 MHz. |
| Flexible Burst & Byte Write | 4-word burst (linear/interleaved) plus per-byte write enable allows efficient partial-word updates without read-modify-write overhead. |
| Low-Power Sleep Modes | "ZZ" sleep mode and stop-clock option reduce standby current to ≤120 mA, supporting power-gated subsystems in telecom equipment. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to switch fabric ASICs via 36-bit parallel bus. Use Value: 200 MHz pipelined operation delivers 7.2 GB/s peak throughput (36-bit × 200 MHz), eliminating packet drop due to memory contention. |
Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line interface cards requiring deterministic access timing. IC Role / Device Role / Timing Role: Synchronous burst-access memory for ATM cell or SONET frame storage, tightly coupled to framer and mapper logic. Use Value: 3.0 ns tCO and zero-wait-state reads ensure sub-15 ns round-trip latency for pointer-based buffer management in real-time traffic shaping. |
| High-Speed Test Equipment Memory | Radar Signal Processing Buffer |
|
Use Scenario: Capturing high-sample-rate digital waveforms in automated test systems with deep pattern memory requirements. IC Role / Device Role / Timing Role: Burst-capable memory for FIFO-style acquisition, accepting data from high-speed ADCs or logic analyzers. Use Value: Linear burst mode enables continuous streaming at 200 MHz, supporting >100 MS/s sustained capture over multi-megabit depths. |
Use Scenario: Intermediate storage for digitized RF samples in pulsed-Doppler radar front-ends before FFT processing. IC Role / Device Role / Timing Role: Low-jitter, registered memory buffer synchronizing sample acquisition with DSP clock domain. Use Value: Fully registered I/O and 2.5V VDDQ minimize timing skew across 36-bit data bus, preserving phase coherence of sampled signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1470BV25-250BZC | Same 2M × 36 organization and pinout, rated for 250 MHz (2.6 ns tCO vs. 3.0 ns); higher ICC active current (450 mA vs. 450 mA at 200 MHz). | Required where system clock exceeds 200 MHz and sub-3 ns access is mandatory; otherwise over-spec'd for 200 MHz designs. | Select only if timing margin analysis confirms need for <3.0 ns tCO; otherwise CY7C1470BV25-200BZC offers optimal power/performance balance. |
| IDT72V2115L10PF | 2M × 36 QDR-II+ SRAM (1.8V core/VDDQ), 250 MHz double-data-rate interface, different pinout and control protocol (K/K# clocks, RW, BWS). | Used in newer designs targeting lower voltage and DDR bandwidth; not pin- or function-compatible with CY7C1470BV25. | Consider for greenfield designs prioritizing power efficiency and DDR bandwidth; migration requires PCB and logic redesign. |
Compared with CY7C1470BV25-250BZC, the -200BZC trades 50 MHz speed headroom for identical power draw at target frequency and relaxed timing closure; versus IDT72V2115L10PF, it retains legacy single-data-rate simplicity and 2.5V compatibility but lacks DDR throughput scaling.
Availability
CY7C1470BV25-200BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment, and radar signal processing applications requiring stable component supply and long-term industrial availability.
Supply support for CY7C1470BV25-200BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.
The CY7C1470BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically to replace asynchronous and ZBT SRAMs in systems demanding deterministic, zero-wait-state memory access for real-time packet and signal processing.
FAQ
What is the function of the MODE pin on CY7C1470BV25-200BZC?
The MODE pin is a static strap input that selects burst order: tied HIGH for interleaved burst, LOW for linear burst. It must remain stable during operation and defaults to HIGH (interleaved) if left floating. This setting determines how the internal burst counter increments address offsets during multi-word accesses.
Can CY7C1470BV25-200BZC operate with only two chip enables asserted?
No. The device requires all three chip enables - CE1 (active-low), CE2 (active-high), and CE3 (active-low) - to be simultaneously asserted at the rising edge of CLK to initiate any access. Partial enable assertion results in deselection and high-impedance outputs, as defined in the functional description and timing diagrams.
How does the "ZZ" sleep mode reduce power consumption?
The ZZ pin, when driven LOW, places the device in deep sleep mode, reducing CMOS standby current to ≤120 mA. Unlike CEN suspension, ZZ disables internal clocks and memory array biasing, cutting dynamic and leakage current. Exit time from ZZ is specified as 100 ns max, enabling rapid wake-up for burst-oriented workloads.
Is the CY7C1470BV25-200BZC compatible with ZBT SRAMs in existing designs?
Yes - it is pin-compatible and functionally equivalent to ZBT SRAMs per Cypress documentation, supporting identical control protocols, timing models, and burst behavior. Migration requires no PCB change and minimal firmware update, primarily to verify ADV/LD and MODE strap configurations match legacy ZBT timing expectations.
CY7C1470BV25-200BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470BV25-200BZC FAQ
1.How can I place an order for CY7C1470BV25-200BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV25-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV25-200BZC reliable?
The price and inventory of CY7C1470BV25-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV25-200BZC is usually 5 days.
3.What payment methods are accepted for CY7C1470BV25-200BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV25-200BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470BV25-200BZC?
CY7C1470BV25-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470BV25-200BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470BV25-200BZC?
For technical support, including CY7C1470BV25-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV25-200BZC requirements.
6.How does Aetrix verify that CY7C1470BV25-200BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV25-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV25-200BZC meets industry standards.
7.What is the process for return or replacement of CY7C1470BV25-200BZC?
All CY7C1470BV25-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV25-200BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV25-200BZC part is unused and in its original packaging.
Return procedure for CY7C1470BV25-200BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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