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Infineon Technologies CY7C1470BV25-200BZCT

Part No.:
CY7C1470BV25-200BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1470BV25-200BZCT.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,501

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Product details

Overview

CY7C1470BV25-200BZCT from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 200 MHz with zero wait states, supports 2.5V core and I/O supply, delivers 3.0 ns clock-to-output delay, and implements fully registered inputs/outputs for deterministic timing in back-to-back read/write sequences.

For engineers reviewing the CY7C1470BV25-200BZCT datasheet, CY7C1470BV25-200BZCT pinout, CY7C1470BV25-200BZCT application, or CY7C1470BV25-200BZCT equivalent, this device enables true burst-mode memory interfacing in FPGA-ASIC co-processor subsystems where deterministic latency, byte-write granularity, and JTAG-debuggable memory control are required.

Technical Context

The CY7C1470BV25-200BZCT uses a synchronous pipelined architecture with rising-edge-triggered input and output registers, eliminating bus latency via on-chip NoBL™ logic. Its three-level chip enable hierarchy (CE1 active-low, CE2 active-high, CE3 active-low) enables flexible bank selection in multi-SRAM systems without external glue logic.

Burst operation is controlled by the ADV/LD pin and MODE strap: linear or interleaved burst order is selected at power-up and locked during operation. Write operations are self-timed synchronously using WE and four byte-write selects (BWa–BWd), with automatic tri-state control of DQ/DQP pins during write data phases to prevent bus contention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization), enabling single-chip replacement of multiple x18/x9 SRAMs in legacy bus architectures.
Max Clock Frequency 200 MHz - supports sustained 200 MT/s throughput with no wait states in pipelined read/write cycles.
Access Time (tCO) 3.0 ns - guaranteed clock-to-output delay ensures sub-5 ns timing closure in 200 MHz DDR-adjacent interfaces.
Supply Voltage 2.5 V core (VDD) and 2.5 V I/O (VDDQ) - compatible with 2.5 V logic families and eliminates level-shifting in mixed-voltage systems.
Byte Write Control Four independent BWa–BWd signals - allows selective 9-bit writes to each 36-bit word segment without masking logic or extra cycle overhead.
Power Management ZZ Sleep Mode and CEN-controlled clock gating - reduces standby current to 120 mA while preserving data and state across low-power intervals.
JTAG Support IEEE 1149.1 compliant boundary scan - enables in-system testability and debug visibility of memory interface signal integrity.

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant Pb-free construction per JEDEC MO-145.

Pin Circuit Role Design Meaning
A0–A18 Synchronous Address Input Latched on rising CLK edge; selects one of 2M addresses in 2M × 36 configuration.
BWa–BWd Synchronous Byte Write Select Active-low controls 9-bit segments: BWa→DQa/DQPa, BWb→DQb/DQPb, etc., enabling partial-word writes.
CLK Primary Clock Input Rising-edge-triggered master clock; qualified by CEN - disabled when CEN = HIGH, preserving internal state.
CEN Clock Enable Active-low gate for CLK; suspends all synchronous operations without deselecting device or losing address context.
DQa–DQd / DQPa–DQPd Bidirectional Data I/O 36-bit data + 4-bit parity; automatically tri-stated during write data phase regardless of OE state to prevent bus conflict.
OE Asynchronous Output Enable Active-low; overrides synchronous control to force DQ/DQP drivers into high-Z, but masked during write data window.
ADV/LD Address Counter Control HIGH advances internal burst counter; LOW loads new address - must be LOW after deselect to initiate next access.
MODE Burst Order Strap Static input: HIGH = interleaved burst, LOW = linear burst; floating defaults to HIGH; must remain stable during operation.

Key Features

Feature Design Value
No Bus Latency™ Architecture Enables unlimited back-to-back reads/writes with zero wait states - eliminates pipeline stalls in burst-intensive traffic shaping.
Fully Registered Interface All inputs and outputs synchronized to CLK rising edge - simplifies timing analysis and eliminates setup/hold violations in FPGA-based controllers.
Synchronous Self-Timed Writes On-chip write timing logic removes external write-pulse generation - reduces controller complexity and guarantees write completion within one clock cycle.
Flexible Chip Enable Scheme Three CE inputs (CE1/CE2/CE3) with mixed polarity support depth expansion across multiple banks without address decoding logic.
Configurable Burst Order MODE pin selects linear or interleaved burst sequence - matches legacy ZBT or modern DDR-style addressing requirements in same footprint.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: High-speed dual-port buffer between ingress parser and egress scheduler, operating in pipelined burst mode at 200 MHz.

Use Value: Eliminates frame drop due to bus arbitration delays by sustaining 200 MT/s back-to-back reads/writes with deterministic 3.0 ns tCO.

Use Scenario: Frame assembly/disassembly in SONET/SDH OC-192 line interface units requiring jitter-free memory access.

IC Role / Device Role / Timing Role: Synchronous SRAM used as descriptor table and payload buffer in TI DSP + FPGA co-processing architecture.

Use Value: Fully registered interface ensures timing closure with TI C64x+ DSP EMIF at 200 MHz, avoiding external latch logic.

FPGA-Based Protocol Accelerator High-Speed Test Equipment Memory

Use Scenario: Offloading TCP/IP checksum, encryption, and header modification in PCIe-based NIC accelerators.

IC Role / Device Role / Timing Role: Local memory for FPGA soft-core processor executing real-time packet processing firmware.

Use Value: Byte-write capability (BWa–BWd) enables efficient 9-bit-aligned updates to protocol headers without full-word overwrite overhead.

Use Scenario: Capturing high-fidelity analog waveform samples at 200 MS/s in automated test equipment front-ends.

IC Role / Device Role / Timing Role: Deep buffer memory interfaced directly to high-speed ADC output bus and FPGA capture engine.

Use Value: ZZ Sleep Mode reduces power during idle acquisition windows while retaining captured data - critical for portable ATE battery life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L10PF 36-Mbit (1M × 36), 10 ns access, 133 MHz max clock, 3.3 V only - lacks byte-write and ZZ sleep mode. Lower density and voltage inflexibility limit use in 200 MHz, 2.5 V, low-power designs. Select when legacy 3.3 V system compatibility outweighs performance and power requirements.
ISSI IS61WV102436B 36-Mbit (1M × 36), 2.5 V, 167 MHz max, no NoBL™ - requires wait states for back-to-back accesses. Cannot sustain zero-wait-state burst throughput; unsuitable for packet buffer applications demanding 200 MT/s. Choose only for cost-sensitive, non-burst-intensive control-plane memory where latency is not critical.

Compared with IDT72V2115L10PF and IS61WV102436B, the CY7C1470BV25-200BZCT uniquely delivers 72-Mbit density, 200 MHz zero-wait-state operation, and 2.5 V/byte-write capability in a single 100-pin TQFP - making it irreplaceable for high-throughput, low-latency memory subsystems.

Availability

CY7C1470BV25-200BZCT is available at Aetrix Electronics and suitable for network packet processors, telecom line cards, FPGA-based protocol accelerators, and high-speed test equipment requiring stable component supply across extended production lifecycles.

Supply support for CY7C1470BV25-200BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

The CY7C1470BV25 series belongs to Cypress's NoBL™ SRAM product line, engineered specifically to replace asynchronous and ZBT SRAMs in bandwidth-constrained, low-latency infrastructure applications where deterministic pipelined access is mandatory.

FAQ

What is the function of the MODE pin, and can it be changed dynamically?

The MODE pin selects burst order: HIGH enables interleaved burst, LOW enables linear burst. It is a static strap pin - must be set at power-up and held stable during operation. Changing MODE mid-operation violates timing and may cause undefined burst address sequencing or data corruption. Floating defaults to HIGH (interleaved).

How does the CY7C1470BV25-200BZCT handle bus contention during write cycles?

During the data portion of a write sequence, DQa–DQd and DQPa–DQPd outputs are automatically forced into high-impedance state regardless of OE status. This hardware-enforced tri-state prevents bus contention without requiring external control logic or precise OE timing alignment.

Is the ZZ Sleep Mode compatible with JTAG boundary scan operation?

Yes - ZZ Sleep Mode places the core memory array and I/O buffers into low-power state while preserving JTAG TAP controller functionality. Boundary scan tests (IDCODE, SAMPLE/PRELOAD, EXTEST) remain fully operational, enabling in-system verification even during sleep intervals.

What is the role of ADV/LD after a device deselect, and why must it be driven LOW?

After deselection (e.g., CE1 deasserted), the internal address counter retains its last value. To load a new starting address for the next access, ADV/LD must be driven LOW before the next valid clock edge. If ADV/LD remains HIGH, the device resumes bursting from the prior address - causing incorrect data fetches or overruns.

CY7C1470BV25-200BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1470BV25-200BZCT FAQ

1.How can I place an order for CY7C1470BV25-200BZCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1470BV25-200BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1470BV25-200BZCT reliable?

The price and inventory of CY7C1470BV25-200BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV25-200BZCT is usually 5 days.

3.What payment methods are accepted for CY7C1470BV25-200BZCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV25-200BZCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1470BV25-200BZCT?

CY7C1470BV25-200BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1470BV25-200BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1470BV25-200BZCT?

For technical support, including CY7C1470BV25-200BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV25-200BZCT requirements.

6.How does Aetrix verify that CY7C1470BV25-200BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1470BV25-200BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV25-200BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1470BV25-200BZCT?

All CY7C1470BV25-200BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV25-200BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1470BV25-200BZCT part is unused and in its original packaging.

Return procedure for CY7C1470BV25-200BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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