Infineon Technologies CY7C1470BV25-250AXC
- Part No.:
- CY7C1470BV25-250AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1470BV25-250AXC.pdf
- Description:
- IC SRAM 72MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,775
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Product details
Overview
CY7C1470BV25-250AXC from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 250 MHz with zero wait states, delivers 3.0 ns clock-to-output delay, supports byte-write via four BW inputs, and uses single 2.5 V core and I/O supplies.
For engineers reviewing the CY7C1470BV25-250AXC datasheet, CY7C1470BV25-250AXC pinout, CY7C1470BV25-250AXC application, or CY7C1470BV25-250AXC equivalent, key selection criteria include burst mode configuration (linear/interleaved), synchronous self-timed write timing, JTAG boundary-scan support, and TQFP/FBGA package compatibility for PCB layout and thermal management.
Technical Context
This SRAM implements fully registered pipelined operation: all address, control, and data signals are latched on the rising edge of CLK, with CEN qualifying clock recognition and ADV/LD controlling burst counter advance or new address load. Internal self-timed output buffer control eliminates asynchronous OE dependency for read timing.
The device supports both linear and interleaved burst orders via the MODE strap pin, provides IEEE 1149.1 JTAG boundary scan for board-level test, and enables depth expansion using three synchronous chip enables (CE1–CE3) plus asynchronous OE for output tri-state control during writes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 or 4M × 18 configuration) |
| Max Clock Frequency | 250 MHz - enables back-to-back read/write cycles without wait states |
| Access Time (tCO) | 3.0 ns - defines minimum clock-to-valid-data delay for timing closure |
| Supply Voltage | 2.5 V core (VDD) and I/O (VDDQ) - matches industry-standard low-voltage memory interfaces |
| Burst Capability | Linear or interleaved - selected by MODE pin; determines address increment pattern during burst access |
| Byte Write Control | Four independent BWa–BWd inputs - enable selective 9-bit writes to DQa/DQPa through DQd/DQPd groups |
| JTAG Support | IEEE 1149.1 compliant - provides boundary-scan testability for PCB assembly validation |
Pinout & Package
Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 165-ball FBGA (15 × 17 × 1.4 mm) packages. Pin functions validated per Cypress Document 001-15032 Rev. *O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Input | Latched on rising CLK edge; selects one of 2M addresses in 36-bit mode |
| BWa–BWd | Synchronous Byte Write Select | Active-low controls 9-bit write mask per DQ group (e.g., BWa → DQa/DQPa) |
| CLK | System Clock Input | Rising-edge-triggered; qualified by CEN; drives all internal registers |
| CEN | Clock Enable | Active-low; masks CLK without deselecting device, enabling cycle extension |
| ADV/LD | Burst Counter Control | High = advance internal counter; Low = load new address after deselect |
| MODE | Burst Order Strap | Static input: HIGH = interleaved, LOW = linear; must not toggle during operation |
| DQa–DQd / DQPa–DQPd | Bidirectional Data I/O | 36 data + 4 parity bits; direction controlled by OE and internal write/read state |
| CE1, CE2, CE3 | Chip Enable Inputs | Synchronous (CE1/CE3 active-low, CE2 active-high); enable depth expansion |
| OE | Asynchronous Output Enable | Active-low; tri-states outputs during write data phase regardless of state |
| ZZ | Deep Sleep Mode | Active-low; reduces standby current to <120 mA while preserving data |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) Architecture | Enables true back-to-back read/write operations with zero wait states at 250 MHz |
| Fully Registered Pipelined Interface | All inputs and outputs synchronized to CLK rising edge, simplifying timing analysis and PCB routing |
| Synchronous Self-Timed Writes | On-chip write timing logic eliminates external write pulse width constraints |
| Configurable Burst Order | MODE pin selects linear or interleaved addressing - matches processor/cache burst patterns |
| Integrated Parity I/O (DQP) | Four parity bits (DQPa–DQPd) support error detection in mission-critical systems |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in switching ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to packet processors. Use Value: 250 MHz pipelined operation sustains >7 Gbps sustained throughput with deterministic 3.0 ns tCO for precise packet timestamping. |
Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line interface units. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as FIFO between framer and DSP subsystems. Use Value: Byte-write capability allows partial frame updates without full-line rewrite; ZZ sleep mode cuts power during idle intervals. |
| Baseband Processing Memory | Industrial Real-Time Controller Cache |
|
Use Scenario: Temporary storage of channelized TDMA bursts in wireless base station transceivers. IC Role / Device Role / Timing Role: Synchronous burst SRAM acting as ping-pong buffer between RF front-end and baseband processor. Use Value: Interleaved burst mode aligns with GSM/UMTS burst structures; JTAG support enables in-system test during manufacturing. |
Use Scenario: Deterministic instruction/data cache for multi-axis motion controllers in CNC machinery. IC Role / Device Role / Timing Role: Low-jitter memory subsystem supporting hard real-time loop execution at 250 MHz. Use Value: Fully registered interface eliminates setup/hold violations across temperature; 2.5 V supply ensures compatibility with industrial FPGA I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L10PF | 36-bit, 256K × 36, 10 ns access, 133 MHz max clock - slower speed grade, no MODE-selectable burst order | Lacks NoBL architecture; requires wait states above 133 MHz; no ZZ sleep mode | Preferred where cost sensitivity outweighs throughput requirements and burst flexibility is unnecessary |
| ISSI IS61WV102436B | 36-bit, 1M × 36, 2.5 V, 200 MHz max - lower density, same voltage, no JTAG or parity I/O | Missing DQP parity pins and IEEE 1149.1 support; limited to linear burst only | Selected when parity checking and board-level testability are not required and 72 Mbit capacity is excessive |
Compared with IDT72V2115L10PF and IS61WV102436B, CY7C1470BV25-250AXC delivers higher bandwidth (250 MHz vs ≤200 MHz), integrated parity I/O, configurable burst order, and JTAG testability - critical for high-reliability telecom and networking designs requiring deterministic latency and production test coverage.
Availability
CY7C1470BV25-250AXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing memory, and industrial real-time controller cache requiring stable component supply across extended product lifecycles.
Supply support for CY7C1470BV25-250AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.
CY7C1470BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically to replace asynchronous and ZBT SRAMs in bandwidth-constrained systems demanding zero-wait-state, fully pipelined memory access.
FAQ
What is the function of the MODE pin on CY7C1470BV25-250AXC?
The MODE pin is a static strap input that selects burst address order: pulled HIGH for interleaved burst (default when floating), LOW for linear burst. It must remain stable during operation and is sampled at power-up or reset. This setting directly affects how the internal address counter increments during burst reads/writes, aligning with host processor burst protocols.
Does CY7C1470BV25-250AXC support true dual-port operation?
No. CY7C1470BV25-250AXC is a single-port synchronous SRAM with pipelined read/write capability. While it supports back-to-back accesses without wait states, it lacks independent read and write ports. True dual-port functionality requires separate address/data buses and arbitration logic not present in this device.
How does the ZZ (Sleep) mode reduce power consumption?
Asserting ZZ LOW places the device in deep sleep mode, reducing CMOS standby current to ≤120 mA while retaining memory contents. Unlike standard standby, ZZ disables internal clocks and non-essential circuitry without requiring reinitialization upon wake. It is compatible with all burst modes and retains address counter state.
Can CY7C1470BV25-250AXC be used with a 3.3 V interface?
No. CY7C1470BV25-250AXC requires strict 2.5 V ±0.2 V for both VDD (core) and VDDQ (I/O). Driving inputs above 2.7 V violates absolute maximum ratings and may cause latch-up or permanent damage. Level-shifting is mandatory for interfacing with 3.3 V systems.
CY7C1470BV25-250AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1470BV25-250AXC FAQ
1.How can I place an order for CY7C1470BV25-250AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV25-250AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV25-250AXC reliable?
The price and inventory of CY7C1470BV25-250AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV25-250AXC is usually 5 days.
3.What payment methods are accepted for CY7C1470BV25-250AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV25-250AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470BV25-250AXC?
CY7C1470BV25-250AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470BV25-250AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470BV25-250AXC?
For technical support, including CY7C1470BV25-250AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV25-250AXC requirements.
6.How does Aetrix verify that CY7C1470BV25-250AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV25-250AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV25-250AXC meets industry standards.
7.What is the process for return or replacement of CY7C1470BV25-250AXC?
All CY7C1470BV25-250AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV25-250AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV25-250AXC part is unused and in its original packaging.
Return procedure for CY7C1470BV25-250AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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