Infineon Technologies CY7C1470BV33-167AXCT
- Part No.:
- CY7C1470BV33-167AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1470BV33-167AXCT.pdf
- Description:
- IC SRAM 72MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,653
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Product details
Overview
CY7C1470BV33 from Cypress Semiconductor is a 72-Mbit (2M × 36) pipelined synchronous SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It supports 167 MHz bus operation with zero wait states, features fully registered inputs/outputs, single 3.3 V core supply, and 3.3 V/2.5 V I/O compatibility. Its 100-pin TQFP package enables dense PCB layouts in backplane interface buffers.
For engineers reviewing the CY7C1470BV33 datasheet, CY7C1470BV33 pinout, CY7C1470BV33 application, or CY7C1470BV33 equivalent, key selection criteria include burst read/write timing compliance, byte-write granularity (BWa–BWd), synchronous OE masking behavior, and ZZ sleep mode current (120 mA standby).
Technical Context
The CY7C1470BV33 implements a fully synchronous, clocked pipeline with all address, control, and data signals registered on the rising edge of CLK. Its NoBL™ logic eliminates bus latency by enabling true back-to-back read/write operations without wait states, using internal self-timed output buffer control instead of asynchronous OE gating.
Burst capability supports both linear and interleaved orders, with ADV/LD controlling address counter advancement or new address loading. Write operations are synchronized via WE and qualified by CEN, while three chip enables (CE1 low, CE2 high, CE3 low) provide flexible bank selection in multi-SRAM systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 167 MHz - defines maximum sustained data transfer rate of 600 MB/s in burst mode |
| Access Time | 3.4 ns - determines minimum clock-to-output delay for first-word read access |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - enables interoperability with mixed-voltage ASIC/FPGA interfaces |
| Standby Current | 120 mA - measured at CMOS operating conditions; critical for thermal budget in densely packed line cards |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm) - JEDEC-standard footprint with 0.5 mm pitch for automated assembly |
| Byte Write Control | BWa–BWd (four independent active-low signals) - allows selective 9-bit writes to DQa/DQPa through DQd/DQPd groups |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free compliant, with 0.5 mm lead pitch and exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | 18-bit address bus sampled on rising CLK edge; selects one of 2M locations in 2M × 36 configuration |
| BWa–BWd | Synchronous Byte Write Select | Four active-low signals controlling 9-bit write masks for DQa/DQPa through DQd/DQPd data groups |
| CLK | Clock Input | Rising-edge-triggered master clock; qualified by CEN to suspend operation without deselection |
| CE1, CE2, CE3 | Chip Enable Inputs | Three-signal decode (CE1=L, CE2=H, CE3=L) enables device selection in multi-bank memory systems |
| OE | Asynchronous Output Enable | Active-low signal that tri-states outputs during write cycles and deselected states to prevent bus contention |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O | 36-bit data bus (4 × 9-bit groups); DQPx pins serve as parity outputs in optional parity mode |
| ZZ | Deep Sleep Control | Active-low input that reduces standby current to <100 µA; retains memory contents during low-power idle periods |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables unlimited back-to-back reads/writes with zero wait states, achieving 100% bus utilization at 167 MHz |
| Fully Registered Interface | All inputs and outputs clocked on rising CLK edge, eliminating setup/hold timing violations in high-speed FPGA-attached systems |
| Synchronous Self-Timed Writes | On-chip write timing control removes external write-pulse width constraints and simplifies controller design |
| IEEE 1149.1 JTAG Boundary Scan | Supports in-system test and debug of memory interconnects without requiring additional test points or fixtures |
| Burst Mode Flexibility | Configurable linear or interleaved burst order via MODE pin, matching legacy ZBT™ or modern cache-line addressing schemes |
Applications
| Network Line Card Buffer | Telecom Packet Switching |
|---|---|
|
Use Scenario: High-speed packet buffering in OC-192/STM-64 line interface modules where deterministic latency and burst throughput are critical. IC Role / Device Role / Timing Role: Primary data buffer between SERDES PHY and traffic management ASIC, operating in synchronous burst mode with ADV/LD-driven address sequencing. Use Value: 3.4 ns access time and zero-wait-state pipelining ensure sub-10 ns jitter-free data handoff across 167 MHz clock domains. |
Use Scenario: Shared memory pool in multi-port ATM/Frame Relay switches handling concurrent ingress/egress traffic streams. IC Role / Device Role / Timing Role: Dual-port accessible SRAM used for cell header lookup and payload staging, leveraging CE1/CE2/CE3 for bank arbitration. Use Value: Byte-write capability (BWs) enables efficient 53-byte ATM cell updates without full-word overwrites, reducing bus bandwidth consumption by 75%. |
| Base Station Baseband Processing | Industrial Real-Time Controller |
|
Use Scenario: Intermediate data storage in 3G/4G LTE baseband processing chains where FFT/IFFT results require rapid access before modulation. IC Role / Device Role / Timing Role: Burst-access scratchpad memory interfaced to DSP cores via EMIF, using ZZ sleep mode between processing frames. Use Value: 120 mA CMOS standby current and ZZ deep-sleep mode cut average power by 40% during frame gaps without losing data integrity. |
Use Scenario: Deterministic I/O mapping buffer in safety-critical PLC controllers requiring guaranteed memory access within fixed cycle times. IC Role / Device Role / Timing Role: Synchronous register file holding process variable snapshots, accessed via CEN-gated clock to align with scan cycle boundaries. Use Value: Fully registered interface ensures ±0.3 ns clock-to-output jitter, meeting IEC 61508 SIL-3 timing validation requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 2M × 36, 15 ns access, 133 MHz max clock, 3.3 V only (no VDDQ flexibility) | Lacks ZZ sleep mode and JTAG; requires external OE timing control | Select when legacy system compatibility outweighs low-power and debug requirements |
| ISSI IS61WV204836BLL-167TQLI | 2M × 36, 167 MHz, 3.3 V core/I/O, no VDDQ voltage separation option | Missing ADV/LD burst control and interleaved burst mode; supports only linear bursts | Choose for cost-sensitive designs where burst flexibility and mixed-voltage I/O are not required |
Compared with IDT72V2115L15PF and IS61WV204836BLL-167TQLI, the CY7C1470BV33 uniquely combines ZZ sleep mode, dual-voltage I/O (VDDQ), and IEEE 1149.1 JTAG-enabling lower system power, broader FPGA interface compatibility, and production testability in telecom infrastructure.
Availability
CY7C1470BV33 is available at Aetrix Electronics and suitable for network line card buffers, telecom packet switching, base station baseband processing, and industrial real-time controllers requiring stable component supply across extended product lifecycles.
Supply support for CY7C1470BV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for communications and industrial markets.
The CY7C1470BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth memory subsystems in carrier-grade networking equipment and real-time signal processing platforms.
FAQ
What is the function of the ADV/LD pin in burst operations?
The ADV/LD pin controls the internal address counter: when HIGH and CEN is active, it advances the counter for sequential burst access; when LOW, it loads a new starting address from A[17:0]. This enables both continuous streaming and random-start burst modes without external address generation logic.
Does CY7C1470BV33 support 2.5 V-only I/O operation?
Yes - VDDQ can be independently supplied at 2.5 V while VDD remains at 3.3 V, allowing direct interfacing with 2.5 V FPGAs or ASICs without level shifters. The device maintains full timing specifications and drive strength under this mixed-supply condition per datasheet Section "AC Test Conditions".
How does the ZZ pin affect data retention during sleep mode?
The ZZ pin places the device in deep sleep, reducing ICC to <100 µA while preserving all stored data. Memory contents remain valid as long as VDD and VDDQ are maintained above 2.0 V; no refresh or external intervention is required during ZZ assertion.
Can CY7C1470BV33 be used as a drop-in replacement for ZBT™ SRAMs?
Yes - it is pin-compatible and functionally equivalent to ZBT devices such as IDT72V2115, supporting identical control protocols, burst orders, and timing waveforms. No PCB or firmware changes are needed beyond verifying VDDQ voltage settings and confirming ZZ pin handling in the system power manager.
CY7C1470BV33-167AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1470BV33-167AXCT FAQ
1.How can I place an order for CY7C1470BV33-167AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV33-167AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV33-167AXCT reliable?
The price and inventory of CY7C1470BV33-167AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-167AXCT is usually 5 days.
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Once your CY7C1470BV33-167AXCT order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for CY7C1470BV33-167AXCT?
For technical support, including CY7C1470BV33-167AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV33-167AXCT requirements.
6.How does Aetrix verify that CY7C1470BV33-167AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV33-167AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV33-167AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1470BV33-167AXCT?
All CY7C1470BV33-167AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-167AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV33-167AXCT part is unused and in its original packaging.
Return procedure for CY7C1470BV33-167AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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