Infineon Technologies CY7C1470BV33-167BZCT
- Part No.:
- CY7C1470BV33-167BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470BV33-167BZCT.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,355
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Product details
Overview
CY7C1470BV33-167BZCT from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in networking and telecom data paths. It operates at 167 MHz with zero wait states, supports 3.3 V core supply and 3.3 V/2.5 V I/O, and delivers 3.4 ns clock-to-output access time. Its fully registered inputs/outputs enable true back-to-back read/write operations in packet switching and protocol acceleration systems.
For engineers reviewing the CY7C1470BV33-167BZCT datasheet, CY7C1470BV33-167BZCT pinout, CY7C1470BV33-167BZCT application, or CY7C1470BV33-167BZCT equivalent, this device serves as a pin-compatible NoBL™ alternative to ZBT™ SRAMs in burst-mode memory subsystems requiring deterministic latency and byte-selectable writes.
Technical Context
The CY7C1470BV33-167BZCT implements a synchronous, fully registered pipeline where all address, control, and data signals are latched on the rising edge of CLK, qualified by CEN. Its NoBL™ logic eliminates bus latency by enabling consecutive read/write transfers without inter-cycle gaps.
It features four independent byte write enables (BWa–BWd), synchronous self-timed writes, and dual-mode burst addressing (linear or interleaved). The device integrates IEEE 1149.1 JTAG boundary scan and supports ZZ Sleep Mode for low-power standby with asynchronous wake-up via CE or CLK.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization), enabling single-chip support for 72-bit wide data buses in switch fabric buffers. |
| Max Clock Frequency | 167 MHz - guarantees sustained 167 MT/s throughput with no wait states in pipelined operation. |
| Access Time | 3.4 ns - defines maximum clock-to-output delay for timing-critical read cycles in high-speed interfaces. |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - allows interoperability with both LVTTL and SSTL-2 signaling domains. |
| Power Consumption | 450 mA max operating current - sets thermal budget for dense memory modules in carrier-grade equipment. |
| Burst Capability | Linear or interleaved burst order - matches standard memory controller addressing patterns for cache line fills and DMA transfers. |
| Byte Write Control | Four independent BWa–BWd signals - permits granular 8-bit updates within 36-bit words without read-modify-write overhead. |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | Latched on rising CLK edge; selects one of 2M addresses in 2M × 36 configuration. |
| BWa–BWd | Synchronous Byte Write Select | Active-low per-byte controls for DQa/DQPa, DQb/DQPb, DQc/DQPc, DQd/DQPd - enables partial-word writes. |
| CLK, CEN | Clock & Clock Enable | CLK qualified by active-low CEN; CEN deassertion extends previous cycle without deselecting device. |
| CE1, CE2, CE3 | Chip Enable Inputs | Three-level synchronous bank select (CE1/CE3 active-low, CE2 active-high) for multi-SRAM memory mapping. |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O | 36-bit data bus + 4 parity bits; direction controlled by OE and internal read/write state machine. |
| OE | Asynchronous Output Enable | Tri-states outputs during write data phase and after deselection - prevents bus contention without timing margin. |
| ADV/LD | Address Counter Control | HIGH advances internal burst counter; LOW loads new address - supports both sequential and random access modes. |
| ZZ | Deep Sleep Control | Asynchronous entry into low-power mode (<120 µA standby); wake-up triggered by CE or CLK transition. |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables unlimited back-to-back reads/writes with zero wait states - eliminates pipeline stalls in burst-intensive traffic shaping. |
| Fully Registered I/O Path | All inputs and outputs synchronized to CLK rising edge - ensures deterministic setup/hold timing across temperature and voltage. |
| Synchronous Self-Timed Writes | On-chip write timing control eliminates external write pulse width constraints - simplifies controller design and improves reliability. |
| JTAG Boundary Scan (IEEE 1149.1) | Supports production test and board-level diagnostics without additional test fixtures or signal access points. |
| Flexible I/O Voltage Support | VDDQ configurable for 3.3 V or 2.5 V - allows direct interface to legacy or low-voltage ASIC/FPGA I/O banks. |
Applications
| Packet Buffering in Ethernet Switches | Cell-Based ATM Line Cards |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switching ASICs with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory buffer interfacing directly to switch fabric controllers via 36-bit parallel bus. Use Value: 167 MHz zero-wait-state operation sustains 6 Gbps aggregate throughput (36 bits × 167 MHz), matching 10G Ethernet line rates. |
Use Scenario: Buffering fixed-length 53-byte ATM cells in OC-48/STM-16 line interface units. IC Role / Device Role / Timing Role: Burst-mode SRAM providing deterministic cell enqueue/dequeue timing for traffic policing and shaping engines. Use Value: Linear burst addressing aligns with cell payload alignment; byte write enables selective header modification without full-cell rewrite. |
| Protocol Acceleration Engines | Telecom Baseband Processing |
|
Use Scenario: Offloading TCP/IP checksum, encryption, or deep packet inspection in network processors. IC Role / Device Role / Timing Role: Local instruction/data scratchpad memory for microcoded accelerators requiring sub-4 ns read access. Use Value: 3.4 ns clock-to-output meets tight timing closure for 167 MHz accelerator clocks, reducing pipeline bubbles. |
Use Scenario: Storing channelized TDM frame buffers and voice codec parameters in wireless base station transceivers. IC Role / Device Role / Timing Role: Synchronous SRAM serving as time-slot interchange (TSI) memory with precise clock-domain crossing. Use Value: ZZ Sleep Mode reduces standby power to <120 µA during idle frames - critical for energy-constrained macrocell sites. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 2M × 36, 15 ns access, 133 MHz max - slower speed grade, no ZZ Sleep Mode. | Lacks deep-sleep capability; requires external power management for low-duty-cycle applications. | Select when cost sensitivity outweighs power efficiency and timing margin is relaxed beyond 3.4 ns. |
| ISSI IS61WV204836BLL-167TQLI | 2M × 36, 167 MHz, 3.4 ns, but uses standard ZBT™ interface - no NoBL™ zero-latency burst chaining. | Requires wait states between non-sequential accesses; lower effective bandwidth under mixed read/write workloads. | Select when existing ZBT™ controller IP is reused and burst chaining is not required for peak throughput. |
Compared with IDT72V2115L15PF and IS61WV204836BLL-167TQLI, the CY7C1470BV33-167BZCT uniquely delivers zero-wait-state burst chaining and integrated sleep control - essential for latency-sensitive, power-aware telecom infrastructure designs.
Availability
CY7C1470BV33-167BZCT is available at Aetrix Electronics and suitable for packet buffering in Ethernet switches, cell-based ATM line cards, protocol acceleration engines, and telecom baseband processing requiring stable component supply across extended product lifecycles.
Supply support for CY7C1470BV33-167BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC, and connectivity solutions for industrial, automotive, and communications markets.
The CY7C1470BV33 series belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, high-bandwidth memory subsystems in networking and telecom infrastructure where latency predictability and burst efficiency are critical.
FAQ
What is the function of the ADV/LD pin in CY7C1470BV33-167BZCT?
The ADV/LD pin controls the internal address counter: when HIGH (with CEN active), it advances the burst address; when LOW, it loads a new starting address from A0–A17. This dual-mode operation supports both sequential burst access and random address loading without external address generation logic.
Does CY7C1470BV33-167BZCT support 2.5 V I/O operation?
Yes - the VDDQ supply accepts 2.5 V ±0.2 V, allowing direct interface to 2.5 V FPGA or ASIC I/O banks. The device maintains full 167 MHz operation and 3.4 ns access time at 2.5 V I/O, with separate 3.3 V VDD for core logic.
How does the ZZ Sleep Mode reduce power consumption?
In ZZ mode, the device enters deep standby with core logic halted and I/O drivers disabled, drawing ≤120 µA typical. Wake-up occurs asynchronously on any CE transition or CLK edge - no clock restart delay - making it ideal for bursty traffic with long idle periods.
Can CY7C1470BV33-167BZCT be used in place of ZBT™ SRAMs?
Yes - it is pin-compatible and functionally equivalent to ZBT™ devices (e.g., IDT72V2115), but adds NoBL™ zero-latency burst chaining and ZZ Sleep Mode. No hardware or timing changes are needed for drop-in replacement in existing ZBT™ designs.
CY7C1470BV33-167BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470BV33-167BZCT FAQ
1.How can I place an order for CY7C1470BV33-167BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV33-167BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV33-167BZCT reliable?
The price and inventory of CY7C1470BV33-167BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-167BZCT is usually 5 days.
3.What payment methods are accepted for CY7C1470BV33-167BZCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV33-167BZCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470BV33-167BZCT?
CY7C1470BV33-167BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470BV33-167BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470BV33-167BZCT?
For technical support, including CY7C1470BV33-167BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV33-167BZCT requirements.
6.How does Aetrix verify that CY7C1470BV33-167BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV33-167BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV33-167BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1470BV33-167BZCT?
All CY7C1470BV33-167BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-167BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV33-167BZCT part is unused and in its original packaging.
Return procedure for CY7C1470BV33-167BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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