Infineon Technologies CY7C1470BV33-167BZI
- Part No.:
- CY7C1470BV33-167BZI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470BV33-167BZI.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,374
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Product details
Overview
CY7C1470BV33 from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 167 MHz with zero wait states, supports 3.3 V core supply and 3.3 V/2.5 V I/O, and delivers 3.4 ns clock-to-output time.
For engineers reviewing the CY7C1470BV33 datasheet, CY7C1470BV33 pinout, CY7C1470BV33 application, or CY7C1470BV33 equivalent, key selection criteria include burst mode support (linear/interleaved), synchronous self-timed writes, byte write capability across four 9-bit data groups, and IEEE 1149.1 JTAG boundary scan compliance for system-level testability.
Technical Context
This SRAM implements fully registered synchronous operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs pass through output registers synchronized to the same edge. The internal NoBL™ logic eliminates bus latency by enabling true back-to-back read/write transitions without wait states.
It features three synchronous chip enables (CE1 low-active, CE2 high-active, CE3 low-active) for flexible bank decoding, an asynchronous OE for output tri-state control during write cycles, and Clock Enable (CEN) to suspend clock recognition without deselecting the device. Burst addressing is controlled via ADV/LD, supporting both linear and interleaved sequences.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 167 MHz - enables sustained 167 MT/s throughput with no wait states |
| Access Time | 3.4 ns - defines minimum clock-to-output delay for timing-critical interfaces |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system integration |
| Operating Current | 450 mA max at 167 MHz - determines thermal and power delivery requirements |
| Standby Current | 120 mA max - sets baseline power consumption during idle periods |
| Burst Mode | Linear or interleaved - matches CPU or ASIC burst patterns without address re-latching |
Pinout & Package
Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and Pb-free/non-Pb-free 165-ball FBGA (15 × 17 × 1.4 mm) packages. Pin functions validated per Cypress Document 001-15031 Rev. *O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | Latched on rising CLK edge; selects one of 2M addresses in 2M × 36 configuration |
| BWa–BWd | Synchronous Byte Write Select | Active-low controls 9-bit DQa/DQPa, DQb/DQPb, DQc/DQPc, DQd/DQPd groups independently |
| CLK | Clock Input | Rising-edge-triggered master clock; qualified by CEN to enable/disable sampling |
| CEN | Clock Enable | Active-low gate for CLK; suspends operation without deselection, extending previous cycle |
| CE1, CE2, CE3 | Synchronous Chip Enables | Three-input decode (CE1↓, CE2↑, CE3↓) enables fine-grained bank selection in multi-SRAM systems |
| OE | Asynchronous Output Enable | Active-low tri-states outputs during write data phase to prevent bus contention |
| ADV/LD | Advance/Load Control | HIGH advances internal burst counter; LOW loads new address - critical for burst sequence control |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O | 36-bit data bus (four 9-bit groups); direction controlled by OE and internal read/write state |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables consecutive read/write operations with zero wait states - essential for deterministic packet buffering |
| Fully Registered I/O | All inputs and outputs synchronized to CLK rising edge - simplifies timing closure in high-speed PCB layouts |
| Synchronous Self-Timed Writes | On-chip write timing eliminates external write pulse width constraints - reduces controller overhead |
| IEEE 1149.1 JTAG Boundary Scan | Supports in-system test and interconnect verification - required for telecom equipment compliance |
| ZZ Sleep Mode Option | Reduces standby current while preserving data - extends hold time in power-constrained applications |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress packets in 10G Ethernet switch fabric ASICs with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfacing directly to SerDes MAC controllers. Use Value: 167 MT/s sustained throughput and 3.4 ns clock-to-output enable sub-100 ns round-trip access for real-time traffic shaping. | Use Scenario: Frame assembly/disassembly in SONET/SDH add-drop multiplexers requiring burst-aligned memory access. IC Role / Device Role / Timing Role: Synchronous burst SRAM providing aligned 36-bit data paths to framer ICs. Use Value: Linear/interleaved burst modes match STS-192 framing structures, eliminating address setup overhead per transfer. |
| Baseband Processing Cache | Industrial Protocol Gateway |
Use Scenario: Temporary storage of OFDM symbol data between FFT processing stages in LTE eNodeB baseband units. IC Role / Device Role / Timing Role: Pipelined SRAM acting as low-latency scratchpad between FPGA-based DSP blocks. Use Value: Fully registered I/O and CEN-controlled clock gating simplify synchronization across multiple clock domains. | Use Scenario: Protocol translation buffer in industrial Ethernet-to-PROFINET gateways handling deterministic cyclic data exchange. IC Role / Device Role / Timing Role: Deterministic-access memory staging fieldbus data before TCP/IP encapsulation. Use Value: Zero-wait-state operation ensures guaranteed 167 MHz data handoff between real-time and non-real-time subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L16PF | 2M × 36, 166 MHz max, 3.3 V only, no ZZ sleep mode | Lacks sleep mode and JTAG scan; requires external OE timing control | Choose when JTAG testability is not required and power management is handled externally |
| ISSI IS61WV204836BLL-167TQLI | 2M × 36, 167 MHz, 3.3 V core/I/O, no ADV/LD pin or burst mode | Single-cycle addressing only; no burst capability limits throughput in streaming applications | Choose for simpler control logic where burst transfers are unnecessary |
Compared with IDT72V2115L16PF and IS61WV204836BLL-167TQLI, CY7C1470BV33 uniquely combines JTAG testability, ZZ sleep mode, and programmable burst order-critical for telecom infrastructure where field-upgradable reliability and power-aware operation are mandatory.
Availability
CY7C1470BV33 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and industrial protocol gateway applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1470BV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems.
CY7C1470BV33 belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput buffering in deterministic communication infrastructure where back-to-back read/write performance is non-negotiable.
FAQ
What is the function of the ADV/LD pin in CY7C1470BV33?
The ADV/LD pin controls burst address generation: when HIGH (with CEN active), it advances the internal burst counter; when LOW, it loads a new starting address from A[17:0]. This dual-mode operation enables seamless transition between sequential burst access and random-address initiation without external address sequencing logic.
Does CY7C1470BV33 support 2.5 V I/O operation?
Yes - the VDDQ supply accepts 2.5 V ±0.2 V, allowing direct interface with 2.5 V logic families while maintaining full 167 MHz operation. Core VDD remains fixed at 3.3 V ±0.3 V. I/O voltage selection is hardware-configured via VDDQ pin voltage, not register-programmable.
How does the ZZ Sleep Mode reduce power consumption?
When ZZ is asserted LOW, the device enters low-power sleep mode with standby current reduced to ≤120 mA (same as CMOS standby spec). Unlike standard standby, ZZ preserves all memory contents and retains internal state, allowing immediate resumption of operation upon deassertion without initialization delay or data loss.
Can CY7C1470BV33 be used in place of ZBT™ SRAMs?
Yes - it is pin-compatible and functionally equivalent to ZBT devices, supporting identical control protocols, timing models, and burst behaviors. Migration requires no PCB redesign or firmware changes, but designers must verify compatibility of ADV/LD timing and OE masking behavior against legacy ZBT implementations.
CY7C1470BV33-167BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470BV33-167BZI FAQ
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Please submit a Request for Quotation (RFQ) for CY7C1470BV33-167BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of CY7C1470BV33-167BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-167BZI is usually 5 days.
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7.What is the process for return or replacement of CY7C1470BV33-167BZI?
All CY7C1470BV33-167BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-167BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV33-167BZI part is unused and in its original packaging.
Return procedure for CY7C1470BV33-167BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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