Infineon Technologies CY7C1470BV33-167BZIT
- Part No.:
- CY7C1470BV33-167BZIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470BV33-167BZIT.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,949
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1470BV33 from Cypress Semiconductor is a 72-Mbit (2M × 36) pipelined synchronous SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It supports 167 MHz bus operation with zero wait states, features fully registered I/O, 3.3 V core supply with 3.3 V/2.5 V I/O compatibility, and synchronous self-timed writes.
For engineers reviewing the CY7C1470BV33 datasheet, CY7C1470BV33 pinout, CY7C1470BV33 application, or CY7C1470BV33 equivalent, key selection criteria include its 100-pin TQFP package, byte-write capability across four 9-bit data groups (DQa–DQd + DQPa–DQPd), ZZ sleep mode, JTAG boundary scan support, and compatibility with ZBT™-based system designs requiring back-to-back burst throughput.
Technical Context
The device implements a fully synchronous, clocked interface where all inputs-including address, control, and byte-write signals-are registered on the rising edge of CLK, and all outputs are registered to eliminate output skew. Its NoBL™ logic enables true back-to-back read/write operations without bus latency, using internal burst counters and pipelined address steering.
It integrates three synchronous chip enables (CE1 low, CE2 high, CE3 low) for flexible bank decoding, an asynchronous OE for output tri-state control during write cycles, and a dedicated CEN pin to suspend clock recognition without deselecting the device-preserving internal state across clock gating events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization), enabling compact high-bandwidth buffer storage in packet processing pipelines |
| Max Clock Frequency | 167 MHz - supports sustained 167 MT/s burst transfers with no wait states in synchronous systems |
| Access Time | 3.4 ns - defines minimum clock-to-output delay for timing-critical read paths |
| Supply Voltage | Core: 3.3 V ± 0.3 V; I/O: 3.3 V or 2.5 V - allows interoperability with mixed-voltage ASIC/FPGA interfaces |
| Byte Write Groups | 4 independent 9-bit groups (BWa–BWd) - permits granular 1–36-bit writes without read-modify-write overhead |
| Power Consumption | Max operating current 450 mA at 167 MHz - informs thermal design and VRM sizing for dense memory banks |
| Sleep Mode | ZZ pin enables low-power standby with CMOS standby current ≤120 mA - reduces idle power in burst-inactive periods |
Pinout & Package
The CY7C1470BV33 is packaged in a JEDEC-standard Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body, with 0.5 mm pitch and exposed thermal pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Inputs | Sampled on rising CLK edge; select one of 2M addresses (18-bit address space) |
| BWa–BWd | Synchronous Byte Write Selects | Active-low controls write enable per 9-bit data group (DQa/DQPa through DQd/DQPd) |
| CLK, CEN | Clock & Clock Enable | CLK qualified by CEN; CEN=HIGH masks clock while preserving internal state |
| CE1, CE2, CE3 | Synchronous Chip Enables | Three-input decode (CE1=L, CE2=H, CE3=L) enables device selection without external logic |
| OE | Asynchronous Output Enable | Tri-states outputs during write data phase to prevent bus contention |
| ZZ | Deep Sleep Control | Active-low entry into low-current standby; retains memory contents |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O | 36-bit data bus with parity pins (DQPa–DQPd); direction controlled by OE and cycle type |
| ADV/LD | Burst Address Control | HIGH advances internal counter; LOW loads new address - enables linear/interleaved burst modes |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables consecutive read/write operations with zero wait states - eliminates pipeline stalls in burst-intensive traffic engines |
| IEEE 1149.1 JTAG Boundary Scan | Supports in-system test and interconnect verification without additional test fixtures or bed-of-nails access |
| Synchronous Self-Timed Writes | On-chip write timing control removes external write-pulse width constraints - simplifies timing closure in high-speed PCB layouts |
| Flexible Burst Ordering | Configurable linear or interleaved burst sequences via MODE pin - matches legacy ZBT™ or optimized cache-line access patterns |
| 3.3 V Core / Dual-Voltage I/O | Supports direct interfacing to both 3.3 V and 2.5 V FPGAs/ASICs - avoids level-shifter components in multi-voltage systems |
Applications
| Telecom Line Card Buffering | Network Packet Processor Cache |
|---|---|
Use Scenario: High-speed buffering of variable-length Ethernet/IP packets between ingress and egress ports on carrier-grade line cards. IC Role / Device Role / Timing Role: Primary burst-access SRAM serving as first-level packet buffer with deterministic 3.4 ns read latency and back-to-back write capability. Use Value: Eliminates wait states during rapid read/write alternation, sustaining >1.2 Gbps aggregate throughput under real-time traffic load. | Use Scenario: Temporary storage of packet headers and metadata during classification, forwarding, and QoS enforcement in multi-core NPU subsystems. IC Role / Device Role / Timing Role: Synchronous pipelined memory providing low-jitter, clock-aligned data staging between processing stages. Use Value: Fully registered I/O and 167 MHz clocking ensure setup/hold compliance with FPGA-based NPU interfaces, reducing timing margin risk. |
| Baseband Processing Memory | Industrial Real-Time Controller Buffer |
Use Scenario: Intermediate storage of FFT coefficients and channel estimation results in LTE/5G baseband units with strict latency budgets. IC Role / Device Role / Timing Role: Low-latency, high-reliability SRAM supporting deterministic burst reads/writes synchronized to baseband clock domains. Use Value: ZZ sleep mode cuts standby current to ≤120 mA, enabling power-gated operation between radio frame intervals without data loss. | Use Scenario: Deterministic I/O buffering in safety-critical motion controllers requiring guaranteed memory access within fixed-cycle PLC scan times. IC Role / Device Role / Timing Role: Zero-wait-state SRAM acting as dual-port register file replacement for real-time task scheduling and sensor fusion data exchange. Use Value: Pin-compatible ZBT™ equivalence allows drop-in upgrade of legacy controller memory subsystems without redesign. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1470BV33-200BZIT | Higher speed grade: 200 MHz max clock, 3.0 ns access time vs. 167 MHz / 3.4 ns | Requires tighter PCB layout and stricter power delivery; suitable only where ≥200 MT/s sustained bandwidth is mandatory | Select when system clock domain exceeds 167 MHz and timing margin analysis confirms feasibility |
| AS7C3256B-167JCIN | Lower density (32 Mbit), different organization (2M × 16), no JTAG or ZZ sleep mode | Lacks burst control, byte-write granularity, and advanced power management - limited to simpler buffering roles | Consider only for cost-sensitive, non-burst, non-ZZ applications where 36-bit width and NoBL™ are not required |
Compared with CY7C1470BV33-200BZIT, the -167BZIT offers relaxed timing margins and lower power at 450 mA operating current; versus AS7C3256B-167JCIN, it delivers superior burst throughput, full 36-bit width, and system-level debug/test capability via JTAG-making it uniquely suited for telecom and NPU memory subsystems.
Availability
CY7C1470BV33-167BZIT is available at Aetrix Electronics and suitable for telecom line card buffering, network packet processor caching, and industrial real-time controller buffering requiring stable component supply across extended production lifecycles.
Supply support for CY7C1470BV33-167BZIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.
This device belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, burst-capable memory subsystems in high-speed networking and signal processing equipment where deterministic timing and back-to-back throughput are critical.
FAQ
What is the function of the ADV/LD pin in CY7C1470BV33-167BZIT?
The ADV/LD pin controls burst address generation: when HIGH and CEN is active, it advances the internal burst counter for sequential accesses; when LOW, it loads a new starting address from A0–A17. This dual-mode operation enables both linear and interleaved burst sequences without external address sequencing logic, directly supporting cache-line and packet-buffer access patterns.
Does CY7C1470BV33-167BZIT support 2.5 V I/O voltage while operating on 3.3 V core supply?
Yes - the device features separate VDDQ (I/O) and VDD (core) supplies. VDDQ accepts 2.5 V ± 0.2 V while VDD remains at 3.3 V ± 0.3 V, allowing direct connection to 2.5 V FPGAs or ASICs without level shifters. This dual-voltage I/O capability is explicitly specified in the DC characteristics table and supported across all speed grades including the 167 MHz variant.
How does the ZZ (Sleep) mode affect data retention and wake-up timing?
In ZZ mode (pin driven LOW), the device enters deep standby with CMOS standby current ≤120 mA while retaining all stored data. Wake-up is synchronous: the first valid CLK edge after ZZ returns HIGH initiates internal recovery, and normal access resumes on the subsequent clock cycle - no additional stabilization delay or initialization sequence is required, ensuring deterministic resumption of burst operations.
Is JTAG boundary scan functionality enabled by default on CY7C1470BV33-167BZIT?
JTAG is implemented per IEEE 1149.1 and enabled by default; no configuration fuse or strap is needed. The TAP controller responds to standard JTAG instructions (SAMPLE/PRELOAD, EXTEST, IDCODE) using dedicated pins (TCK, TMS, TDI, TDO). Boundary scan testing can be performed immediately after power-up, provided the TAP reset sequence (TMS=HIGH for five TCK cycles) is executed first.
CY7C1470BV33-167BZIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470BV33-167BZIT FAQ
1.How can I place an order for CY7C1470BV33-167BZIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV33-167BZIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV33-167BZIT reliable?
The price and inventory of CY7C1470BV33-167BZIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-167BZIT is usually 5 days.
3.What payment methods are accepted for CY7C1470BV33-167BZIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV33-167BZIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470BV33-167BZIT?
CY7C1470BV33-167BZIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470BV33-167BZIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470BV33-167BZIT?
For technical support, including CY7C1470BV33-167BZIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV33-167BZIT requirements.
6.How does Aetrix verify that CY7C1470BV33-167BZIT is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV33-167BZIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV33-167BZIT meets industry standards.
7.What is the process for return or replacement of CY7C1470BV33-167BZIT?
All CY7C1470BV33-167BZIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-167BZIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV33-167BZIT part is unused and in its original packaging.
Return procedure for CY7C1470BV33-167BZIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1470BV33-167BZIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

