Infineon Technologies CY7C1470BV33-200BZXI
- Part No.:
- CY7C1470BV33-200BZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470BV33-200BZXI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1470BV33-200BZXI from Cypress Semiconductor is a 72-Mbit (2M × 36) pipelined synchronous SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 200 MHz with zero wait states, supports 3.3 V core supply and 3.3 V/2.5 V I/O, and delivers 3.0 ns clock-to-output time.
For engineers reviewing the CY7C1470BV33-200BZXI datasheet, CY7C1470BV33-200BZXI pinout, CY7C1470BV33-200BZXI application, or CY7C1470BV33-200BZXI equivalent, this device enables true back-to-back read/write operations without bus latency-critical for burst-intensive data path architectures requiring deterministic timing and byte-level write granularity.
Technical Context
The CY7C1470BV33-200BZXI implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. Its NoBL™ logic eliminates bus turnaround overhead by enabling consecutive reads or writes on every clock cycle.
It features four independent byte write enables (BWa–BWd), synchronous self-timed writes, three chip enables (CE1, CE2, CE3) for flexible bank selection, and an asynchronous OE for output tri-state control during write sequences. The device supports linear and interleaved burst modes and includes IEEE 1149.1 JTAG boundary scan.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization) |
| Max Clock Frequency | 200 MHz - enables sustained 200 MT/s throughput with no wait states |
| Access Time | 3.0 ns - defines minimum clock-to-output delay for timing-critical read paths |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system interfacing |
| Byte Write Control | 4 independent BWa–BWd signals - allows selective 8-bit writes within 36-bit data word |
| Power Consumption | 500 mA max operating current - sets thermal and PCB power delivery requirements |
| Package | 100-pin TQFP (14 × 20 × 1.4 mm) - surface-mount compatible with standard reflow profiles |
Pinout & Package
Package: 100-pin TQFP (JEDEC-standard Pb-free, 14 mm × 20 mm × 1.4 mm body height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | Latched on rising CLK edge; selects one of 2M addresses in 36-bit word space |
| BWa–BWd | Synchronous Byte Write Enable | Active-low controls write enable per 8-bit byte (DQa/DQPa, DQb/DQPb, etc.) |
| CLK | Master Synchronous Clock | Rising-edge-triggered timing reference for all registered inputs/outputs |
| CEN | Clock Enable | Active-low gate for CLK; suspends operation without deselecting device |
| CE1, CE2, CE3 | Chip Enable Inputs | Three-signal decode (CE1=L, CE2=H, CE3=L) selects device; enables multi-SRAM bank control |
| OE | Asynchronous Output Enable | Active-low; forces I/O pins to output state, masked during write data phase to prevent contention |
| DQa–DQd, DQPa–DQPd | Bidirectional Data I/O | 36-bit data bus (4 × 9-bit groups); DQPx are parity bits for error detection |
| ADV/LD | Burst Address Control | HIGH advances internal counter for burst access; LOW loads new address from A[17:0] |
| ZZ | Deep Sleep Mode | Active-low entry into low-power standby (reduces current to CMOS standby level) |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) Architecture | Enables unlimited back-to-back read/write cycles with zero wait states-eliminates pipeline stalls in burst-heavy traffic |
| Full Input/Output Registration | All signals synchronized to CLK rising edge-ensures deterministic setup/hold timing across PVT corners |
| Synchronous Self-Timed Writes | Internal write completion detection removes external write-strobe timing constraints |
| JTAG Boundary Scan (IEEE 1149.1) | Supports board-level interconnect test without requiring functional memory access |
| Flexible Burst Ordering | Configurable linear or interleaved burst sequences-matches legacy ZBT™ or modern processor cache line patterns |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in ASIC-based switch fabric buffers. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer between ingress and egress engines. Use Value: 200 MHz zero-wait-state operation sustains 7.2 GB/s aggregate bandwidth (200 MT/s × 36-bit), matching line-rate processing demands. |
Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH add-drop multiplexers. IC Role / Device Role / Timing Role: Dual-port-like pipelined memory for time-division multiplexing and jitter attenuation. Use Value: Byte-write capability (BWa–BWd) enables precise payload insertion without full-word rewrite-reducing bus arbitration overhead. |
| Baseband Processing Cache | Industrial Real-Time Controller |
|
Use Scenario: Temporary storage of FFT coefficients and channel estimation data in LTE/5G baseband FPGAs. IC Role / Device Role / Timing Role: Deterministic-latency scratchpad memory for DSP pipelines with strict cycle budgets. Use Value: 3.0 ns clock-to-output ensures read data aligns precisely with next-stage pipeline registers-enabling single-cycle forwarding. |
Use Scenario: Motion control loop buffering in CNC machines requiring sub-microsecond memory access predictability. IC Role / Device Role / Timing Role: Synchronous SRAM serving as real-time I/O mapping table and command queue. Use Value: ZZ sleep mode reduces standby current to 120 mA-extending uptime in fanless, thermally constrained enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1470BV33-250BZXI | 250 MHz speed grade; 3.0 ns access time identical, but higher frequency margin | Required where system clock exceeds 200 MHz or timing裕度 is critical | Select when design targets >200 MHz operation or requires headroom for PVT variation |
| AS7C3256B-20JCN | 256 K × 16 async SRAM; no pipelining, no burst, no NoBL™, 20 ns access | Only suitable for non-burst, low-frequency control-plane storage-not data-path replacement | Use only for simple configuration storage where throughput and latency are non-critical |
Compared with CY7C1470BV33-250BZXI, the -200BZXI trades 50 MHz bandwidth for lower power and relaxed timing closure; versus AS7C3256B-20JCN, it provides 36× higher bandwidth and deterministic pipelined behavior essential for data-path applications.
Availability
CY7C1470BV33-200BZXI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and industrial real-time controller applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1470BV33-200BZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems.
This device belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, burst-capable memory subsystems in high-speed digital signal processing and packet-switching infrastructure.
FAQ
What is the function of the ADV/LD pin in burst operations?
The ADV/LD pin controls the internal address counter during burst accesses: when HIGH and CEN is active, it increments the counter for sequential addressing; when LOW, it loads a new base address from A[17:0]. This dual-mode operation enables both continuous streaming and random-start burst transfers without external address generation logic.
Does CY7C1470BV33-200BZXI support 2.5 V I/O signaling?
Yes-the VDDQ supply accepts 2.5 V ±0.2 V, allowing direct interface with 2.5 V logic families. The device maintains full 200 MHz operation and specified timing margins at 2.5 V I/O, with separate VDD (3.3 V) powering core logic to ensure noise isolation between analog-sensitive memory arrays and digital I/O.
How does the ZZ pin reduce power consumption?
The ZZ pin places the device in deep sleep mode, disabling internal clocks and memory array biasing while retaining data. This reduces supply current from 500 mA (active) to 120 mA (CMOS standby), making it suitable for power-gated subsystems where memory state must persist during idle intervals without full power-down sequencing.
Can CY7C1470BV33-200BZXI be used as a drop-in replacement for ZBT SRAMs?
Yes-it is pin-compatible and functionally equivalent to ZBT devices, supporting identical control protocols, burst orders, and timing models. However, its NoBL™ architecture delivers superior throughput in back-to-back scenarios due to eliminated bus turnaround cycles, requiring no changes to existing ZBT firmware or controller logic.
CY7C1470BV33-200BZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470BV33-200BZXI FAQ
1.How can I place an order for CY7C1470BV33-200BZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470BV33-200BZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470BV33-200BZXI reliable?
The price and inventory of CY7C1470BV33-200BZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-200BZXI is usually 5 days.
3.What payment methods are accepted for CY7C1470BV33-200BZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV33-200BZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470BV33-200BZXI?
CY7C1470BV33-200BZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470BV33-200BZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470BV33-200BZXI?
For technical support, including CY7C1470BV33-200BZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV33-200BZXI requirements.
6.How does Aetrix verify that CY7C1470BV33-200BZXI is sourced from the original manufacturer or authorized distributors?
All CY7C1470BV33-200BZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV33-200BZXI meets industry standards.
7.What is the process for return or replacement of CY7C1470BV33-200BZXI?
All CY7C1470BV33-200BZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-200BZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470BV33-200BZXI part is unused and in its original packaging.
Return procedure for CY7C1470BV33-200BZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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