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Infineon Technologies CY7C1470BV33-250BZXC

Part No.:
CY7C1470BV33-250BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1470BV33-250BZXC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,482

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Product details

Overview

CY7C1470BV33-250BZXC from Cypress Semiconductor is a 72-Mbit (2M × 36) pipelined synchronous SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 250 MHz with zero wait states, delivers 3.0 ns clock-to-output time, supports byte-write control via four BW pins (BWa–BWd), and uses a single 3.3 V core supply with 3.3 V/2.5 V I/O compatibility.

For engineers reviewing the CY7C1470BV33-250BZXC datasheet, CY7C1470BV33-250BZXC pinout, CY7C1470BV33-250BZXC application, or CY7C1470BV33-250BZXC equivalent, key selection criteria include burst read/write timing integrity, synchronous self-timed write latency, JEDEC-compliant 100-pin TQFP packaging, and IEEE 1149.1 JTAG boundary-scan support for system-level testability.

Technical Context

The device implements fully registered synchronous interfaces: all address, control, and data inputs pass through input registers on the rising CLK edge; all outputs are latched by output registers synchronized to the same edge. Its NoBL™ logic eliminates bus latency by enabling true back-to-back read/write operations without wait states.

Internal self-timed output buffer control removes dependency on asynchronous OE for tri-state management, while synchronous CEN suspends clock recognition without deselecting the device. Burst capability supports both linear and interleaved orders, and ZZ Sleep Mode reduces standby current to 120 mA.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization), enabling 72-bit wide data paths for high-bandwidth buffering
Max Clock Frequency 250 MHz - supports 4 ns clock period for sustained back-to-back access cycles
Access Time 3.0 ns - defines minimum clock-to-output delay for timing-critical pipeline stages
Supply Voltage 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - allows interoperability with mixed-voltage SoC interfaces
Byte Write Pins 4 independent BWa–BWd signals - enable granular 9-bit writes per byte lane without full-word overhead
Standby Current 120 mA - measured under CMOS standby conditions, critical for thermal budget in dense PCB layouts
JTAG Support IEEE 1149.1 compliant - enables boundary-scan testing of SRAM interconnects in assembled systems

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Synchronous Address Input 18-bit address bus sampled on rising CLK edge; selects one of 2M locations in 2M × 36 configuration
BWa–BWd Synchronous Byte Write Select Active-low controls 9-bit data lanes (DQa/DQPa through DQd/DQPd); enables partial-word writes
CLK Primary Clock Input Rising-edge-triggered master clock; qualified by CEN to gate synchronous operation
CEN Clock Enable Active-low signal that masks CLK without deselecting device - extends previous cycle for timing margin
CE1, CE3 Synchronous Chip Enable (Low) Two active-low enables sampled on CLK edge; used with CE2 (active-high) for 3-signal bank decoding
OE Asynchronous Output Enable Active-low control of I/O direction; masked during write data phase to prevent bus contention
DQa–DQd, DQPa–DQPd Bidirectional Data I/O 36-bit data bus + 4 parity bits; DQx carry data, DQP x carry parity - supports ECC-capable systems
ZZ Deep Sleep Control Active-low entry into low-power mode; reduces dynamic and leakage current while preserving data

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) Architecture Enables unlimited consecutive read/write operations with no wait states - essential for deterministic packet buffering
Fully Registered I/O All inputs and outputs synchronized to CLK rising edge - eliminates setup/hold violations in high-speed PCB routing
Synchronous Self-Timed Writes On-chip write timing control eliminates external write-pulse generation - simplifies controller logic
Interleaved & Linear Burst Modes Configurable burst order via MODE pin - matches legacy ZBT™ or optimized sequential access patterns
IEEE 1149.1 JTAG Boundary Scan Full scan chain for interconnect validation - critical for high-reliability telecom and industrial backplanes

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in multi-gigabit switches.

IC Role / Device Role / Timing Role: High-speed, low-latency shared memory buffer interfacing directly with MAC and switch fabric controllers.

Use Value: 250 MHz zero-wait-state operation sustains 9 Gbps aggregate throughput across 36-bit bus, eliminating packet drop under burst traffic.

Use Scenario: Frame buffering in OC-192/STM-64 SONET/SDH line interface units.

IC Role / Device Role / Timing Role: Synchronous pipeline memory staging incoming/outgoing ATM or GFP frames before DSP processing.

Use Value: 3.0 ns clock-to-output and burst addressing reduce frame latency by >15% versus asynchronous SRAM alternatives.

Baseband Processing Cache Industrial Real-Time Controller

Use Scenario: Temporary storage of channelized TDMA bursts in 4G/LTE baseband subsystems.

IC Role / Device Role / Timing Role: Dual-port-like behavior via pipelined reads/writes, supporting simultaneous RACH and PDSCH data flow.

Use Value: Byte-write capability (BWa–BWd) enables efficient partial updates of modulation symbol buffers without full-word rewrite overhead.

Use Scenario: Deterministic I/O mapping and state retention in PLC motion control modules.

IC Role / Device Role / Timing Role: Configurable memory resource for real-time task scheduling tables and encoder position history.

Use Value: ZZ Sleep Mode cuts standby power to 120 mA - extends uptime in fanless, convection-cooled enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36120L10BG 100 MHz max frequency, 4.5 ns access, 2.5 V core supply only Limited to lower-bandwidth control-plane buffering; lacks ZZ sleep and JTAG Choose when cost sensitivity outweighs speed and testability requirements
ISSI IS61WV102436BLL-15BLI 150 MHz max frequency, 1.8 V/3.3 V I/O, no burst mode or JTAG Suitable for non-bursting, moderate-throughput embedded controllers Prefer where simplified interface and lower voltage margin are prioritized over pipeline efficiency

Compared with IDT72T36120L10BG and IS61WV102436BLL-15BLI, the CY7C1470BV33-250BZXC delivers 2.5× higher bandwidth, integrated JTAG for production test, and deep-sleep mode - making it optimal for infrastructure-grade systems requiring deterministic latency and lifecycle traceability.

Availability

CY7C1470BV33-250BZXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial real-time controller designs requiring stable component supply, long-term obsolescence management, and RoHS-compliant manufacturing.

Supply support for CY7C1470BV33-250BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

This device belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, high-frequency memory interfacing in telecom infrastructure and high-end networking equipment.

FAQ

What is the function of the ADV/LD pin in CY7C1470BV33-250BZXC?

The ADV/LD pin controls the internal burst address counter: when HIGH and CEN is active, it advances the counter for sequential burst access; when LOW, it loads a new starting address from A0–A17. This dual-mode operation enables both continuous streaming and random-access initiation without external address generation logic.

Does CY7C1470BV33-250BZXC support 2.5 V I/O signaling?

Yes - the device features separate VDDQ pins supporting 2.5 V or 3.3 V I/O voltage, allowing direct interfacing with 2.5 V FPGA I/O banks or ASIC cores while maintaining 3.3 V core operation. VDDQ must be externally decoupled and set before VDD during power-up sequencing.

How does the ZZ Sleep Mode affect data retention?

In ZZ Sleep Mode (pin driven LOW), the device enters a low-power state with 120 mA standby current while retaining all stored data. Internal refresh circuitry remains active, and data integrity is guaranteed across the full industrial temperature range (–40°C to +85°C) without external intervention.

Can CY7C1470BV33-250BZXC be used as a drop-in replacement for ZBT™ SRAMs?

Yes - it is pin-compatible and functionally equivalent to ZBT™ devices such as the IDT72T36120, supporting identical control protocols, burst orders, and timing models. No PCB redesign or firmware changes are required when migrating to leverage its improved 250 MHz performance and NoBL™ latency benefits.

CY7C1470BV33-250BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1470BV33-250BZXC FAQ

1.How can I place an order for CY7C1470BV33-250BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1470BV33-250BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1470BV33-250BZXC reliable?

The price and inventory of CY7C1470BV33-250BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470BV33-250BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1470BV33-250BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470BV33-250BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1470BV33-250BZXC?

CY7C1470BV33-250BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1470BV33-250BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1470BV33-250BZXC?

For technical support, including CY7C1470BV33-250BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470BV33-250BZXC requirements.

6.How does Aetrix verify that CY7C1470BV33-250BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1470BV33-250BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470BV33-250BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1470BV33-250BZXC?

All CY7C1470BV33-250BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470BV33-250BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1470BV33-250BZXC part is unused and in its original packaging.

Return procedure for CY7C1470BV33-250BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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