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Infineon Technologies CY7C1470V25-167BZC
- Part No.:
- CY7C1470V25-167BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1470V25-167BZC.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,495
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Product details
Overview
CY7C1470V25-167BZC from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36-bit, operating at 167 MHz with zero wait states. It features fully registered I/O, 2.5 V core and I/O supplies, byte write capability, and JEDEC-standard Pb-free 100-pin TQFP packaging. It enables high-throughput back-to-back read/write operations in network packet buffers and telecom line cards.
For engineers reviewing the CY7C1470V25-167BZC datasheet, CY7C1470V25-167BZC pinout, CY7C1470V25-167BZC application, or CY7C1470V25-167BZC equivalent, key selection considerations include clock-to-output timing (3.4 ns), synchronous self-timed writes, burst order support (linear/interleaved), and ZZ sleep mode implementation per Errata on Pin 64.
Technical Context
The device implements a fully synchronous, pipelined memory architecture where all address, control, and data signals are registered on the rising edge of CLK. Internal NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without wait states, supported by three chip enables (CE1–CE3), clock enable (CEN), and asynchronous OE for output tri-state control.
It supports burst reads/writes in linear or interleaved order, uses synchronous self-timed write circuitry with four byte write selects (BWa–BWd), and includes IEEE 1149.1 JTAG boundary scan. The ZZ pin (Pin 64) must be externally grounded per documented errata to ensure correct sleep mode operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36-bit organization) |
| Max Clock Frequency | 167 MHz - enables sustained 167 MT/s throughput with no wait states |
| Access Time | 3.4 ns - defines maximum clock-to-output delay for timing-critical interfaces |
| Supply Voltages | 2.5 V VDD (core) and 2.5 V VDDQ (I/O) - requires dual-rail 2.5 V system design |
| Operating Current | 400 mA max - determines thermal and power delivery requirements at full speed |
| Sleep Mode | ZZ pin-controlled - reduces standby current to ≤120 mA when asserted and grounded |
| Burst Capability | Linear or interleaved - matches processor/cache burst patterns without address reissuance |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free, RoHS-compliant.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Input clock | Rising-edge-triggered master timing reference for all synchronous registers |
| CEN | Clock enable | Deassertion suspends internal clock domain while preserving state |
| CE1–CE3 | Chip enables | Three-level synchronous bank select; all must be active for access |
| WE | Write enable | Active-low synchronous write strobe, qualified by CEN and CE signals |
| BWa–BWd | Byte write selects | Four independent 9-bit write masks for granular 36-bit data updates |
| OE | Output enable | Asynchronous control for output buffer tri-state; avoids bus contention during writes |
| ZZ | Deep sleep control | Must be externally tied to GND (Errata p.36); enables low-power standby mode |
| DQa–DQd | Data I/O (36-bit) | Bi-directional, registered data bus; DQa = bits 0–8, DQb = 9–17, etc. |
| DQPa–DQPd | Parity outputs | Four parity bits (one per byte group) for error detection in mission-critical systems |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables true back-to-back read/write cycles with zero wait states, increasing effective bandwidth by >30% vs. conventional SRAMs |
| Internally self-timed output buffer | Eliminates need for external OE timing control, simplifying interface timing closure |
| Synchronous self-timed writes | Removes external write pulse width constraints; write completion is internally managed per clock cycle |
| JTAG boundary scan (IEEE 1149.1) | Supports production test and board-level debug without additional test fixtures |
| ZZ sleep mode with stop-clock option | Reduces active power by >70% during idle periods while retaining data integrity |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in real time with minimal latency. IC Role / Device Role / Timing Role: High-speed, low-latency buffer between MAC and switch fabric; operates synchronously with 167 MHz system clock. Use Value: Zero-wait-state pipelining ensures deterministic frame buffering with no pipeline stalls during mixed read/write traffic. |
Use Scenario: Serving as shared memory for DSP-based signal processing in OC-48/OC-192 line cards. IC Role / Device Role / Timing Role: Dual-port-accessible SRAM interfacing with multiple processors and DMA engines via common bus. Use Value: Byte-write capability and burst addressing reduce bus arbitration overhead and improve channel utilization efficiency. |
| Industrial PLC Data Logging | Avionics Real-Time FIFO |
|
Use Scenario: Capturing sensor telemetry at 100+ kHz sampling rates with timestamped storage. IC Role / Device Role / Timing Role: Ring buffer memory with deterministic write latency; synchronized to PLC scan clock. Use Value: 3.4 ns clock-to-output and synchronous self-timed writes guarantee sample capture integrity under jitter-prone conditions. |
Use Scenario: Implementing ARINC 429 or AFDX message queues in flight control computers. IC Role / Device Role / Timing Role: Deterministic FIFO buffer with parity-checked data path for safety-critical messaging. Use Value: Integrated DQP parity bits and ZZ-mode power gating meet DO-254 functional safety requirements for data integrity and low-power idle states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1470V25-200BZC | Higher speed grade: 200 MHz, 3.0 ns access time; identical pinout and feature set | Required for systems demanding >167 MT/s sustained throughput or tighter setup/hold margins | Select when clock frequency headroom or sub-3.4 ns timing closure is mandatory |
| AS7C3256A-15JCIN | Lower density (32 Mbit), 15 ns async access; TTL-compatible 3.3 V interface, no NoBL™ or burst modes | Suitable only for non-pipelined, lower-bandwidth control-plane memory where latency tolerance >10 ns | Use only if cost sensitivity outweighs performance needs and system lacks burst-capable controller |
Compared with CY7C1470V25-167BZC, the -200BZC offers higher throughput at same footprint, while the AS7C3256A-15JCIN sacrifices pipelining, burst, and speed for cost and voltage compatibility-making it unsuitable for NoBL™-dependent architectures.
Availability
CY7C1470V25-167BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial PLC data logging requiring stable component supply, long-term lifecycle support, and Pb-free compliance.
Supply support for CY7C1470V25-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, industrial, and memory solutions.
This device belongs to Infineon's legacy Cypress synchronous SRAM product line, designed specifically for high-bandwidth, low-latency buffering in networking, telecom, and real-time embedded systems requiring deterministic pipelined access.
FAQ
What is the required connection for the ZZ pin on CY7C1470V25-167BZC?
The ZZ pin (Pin 64) must be externally connected to ground, as specified in the Errata on page 36 of the datasheet. Leaving ZZ floating or pulling it high disables deep sleep mode and may cause unpredictable standby current behavior. This grounding requirement is mandatory for correct low-power operation and is not optional.
Does CY7C1470V25-167BZC support interleaved burst addressing?
Yes, the device supports both linear and interleaved burst addressing modes, selected via the MODE pin. Interleaved mode aligns with PowerPC and certain DSP memory controllers, enabling efficient cache-line fills. Burst length is fixed at four or eight words depending on configuration, and all addresses are generated internally without external address incrementing.
Can CY7C1470V25-167BZC operate with only VDD applied, without VDDQ?
No. Both VDD (2.5 V core) and VDDQ (2.5 V I/O) must be powered simultaneously and ramped monotonically. Applying VDD without VDDQ violates Absolute Maximum Ratings and risks latch-up or I/O driver damage. The device does not support split-rail operation or I/O-only power-down modes.
Is JTAG boundary scan enabled by default on CY7C1470V25-167BZC?
JTAG is implemented per IEEE 1149.1 but requires TMS held high for five consecutive TCK cycles after power-up to enter Test-Logic-Reset state and activate the TAP controller. It is not enabled by default at power-on; initialization sequence must be executed by test equipment or boot firmware to access scan registers.
CY7C1470V25-167BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1470V25-167BZC FAQ
1.How can I place an order for CY7C1470V25-167BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470V25-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470V25-167BZC reliable?
The price and inventory of CY7C1470V25-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470V25-167BZC is usually 5 days.
3.What payment methods are accepted for CY7C1470V25-167BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470V25-167BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470V25-167BZC?
CY7C1470V25-167BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470V25-167BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470V25-167BZC?
For technical support, including CY7C1470V25-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470V25-167BZC requirements.
6.How does Aetrix verify that CY7C1470V25-167BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1470V25-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470V25-167BZC meets industry standards.
7.What is the process for return or replacement of CY7C1470V25-167BZC?
All CY7C1470V25-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470V25-167BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470V25-167BZC part is unused and in its original packaging.
Return procedure for CY7C1470V25-167BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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