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Infineon Technologies CY7C1470V25-200AXC

Part No.:
CY7C1470V25-200AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1470V25-200AXC.pdf
Description:
IC SRAM 72MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,594

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Product details

Overview

CY7C1470V25-200AXC from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36, operating at 200 MHz with zero wait states. It features fully registered I/O, 2.5 V core and I/O supply, 3.0 ns clock-to-output delay, and byte-write capability for high-throughput memory buffering in network packet processors.

For engineers reviewing the CY7C1470V25-200AXC datasheet, CY7C1470V25-200AXC pinout, CY7C1470V25-200AXC application, or CY7C1470V25-200AXC equivalent, key selection criteria include burst mode support (linear/interleaved), synchronous self-timed writes, JTAG boundary scan compliance, and TQFP/FBGA package compatibility for backplane and switch fabric designs.

Technical Context

The device implements a fully synchronous, pipelined read/write interface with all inputs and outputs registered on the rising edge of CLK. Internal NoBL™ logic eliminates bus latency by enabling true back-to-back operations without wait states, sustaining 200 MHz continuous data transfer.

It supports three chip enables (CE1–CE3), clock enable (CEN), asynchronous OE, and four byte write selects (BWa–BWd) for granular 8-bit write control. Sleep mode (ZZ) and stop-clock operation reduce power during idle cycles while maintaining data retention.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 configuration)
Max Clock Frequency 200 MHz - enables 400 MT/s sustained throughput with no wait states
Access Time 3.0 ns - clock-to-output delay determines minimum read cycle timing
Supply Voltage 2.5 V core (VDD) and I/O (VDDQ) - requires single-rail 2.5 V system design
Operating Current 450 mA max at 200 MHz - defines thermal and power delivery requirements
Burst Capability Linear or interleaved - matches CPU/DSP burst address patterns for cache coherency
JTAG Support IEEE 1149.1 compliant - enables boundary-scan testability in dense PCB layouts

Pinout & Package

Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 165-ball FBGA (15 × 17 × 1.4 mm). Pinout validated per Cypress Document No. 38-05290 Rev. *V (Pages 6–7).

Pin/Terminal Circuit Role Design Meaning
CLK Clock input Rising-edge-triggered master timing reference for all synchronous registers
CEN Clock enable Deassertion suspends clock domain operation without resetting internal state
CE1, CE2, CE3 Chip enable inputs Three-level decode for bank selection in multi-SRAM memory subsystems
BWa–BWd Byte write enables Independent 8-bit write masking for 36-bit data bus (four 9-bit nibbles)
OE Output enable Asynchronous control for output buffer tri-state; avoids bus contention during writes
ZZ Deep sleep control Active-low signal forcing standby current ≤120 mA; requires external tie to GND per errata

Key Features

Feature Design Value
NoBL™ architecture Enables unlimited back-to-back read/write cycles with zero wait states, eliminating pipeline stalls
Synchronous self-timed writes On-chip timing control ensures write completion within fixed clock cycles, independent of board trace delays
Internally self-timed output buffer Removes need for external OE timing control, simplifying PCB layout and timing closure
2.5 V I/O compatibility Direct interface with 2.5 V ASIC/FPGA I/O banks without level-shifting circuitry
Linear/interleaved burst order Configurable via MODE pin to match host processor burst addressing conventions

Applications

Network Packet Buffering High-Speed Switch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches.

IC Role / Device Role / Timing Role: Pipelined SRAM acting as low-latency first-level buffer between MAC and switching engine.

Use Value: 3.0 ns clock-to-output and 200 MHz operation sustain line-rate forwarding for 10 GbE interfaces.

Use Scenario: Holding forwarding tables and queue descriptors in modular chassis-based routers.

IC Role / Device Role / Timing Role: Synchronous burst memory supporting parallel lookups across multiple ASIC pipelines.

Use Value: Byte-write capability and 36-bit width enable efficient update of variable-length table entries without read-modify-write overhead.

Telecom Line Card Buffering Test Equipment Pattern Memory

Use Scenario: Temporarily storing SONET/SDH frame payloads during jitter correction and alignment.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used in ping-pong configuration for seamless frame handoff.

Use Value: ZZ sleep mode reduces standby current to 120 mA, meeting NEBS Level 3 power budgets during idle intervals.

Use Scenario: Storing stimulus and expected response vectors in automated IC testers (ATE).

IC Role / Device Role / Timing Role: High-reliability memory providing deterministic access for pattern generation at 200 MHz.

Use Value: JTAG boundary scan support enables in-system verification of memory interconnect integrity pre-test execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T36120L10PFI 36-bit, 2M × 36, 10 ns access, 100 MHz max - slower speed grade, different pinout Targeted at legacy telecom systems with relaxed timing margins Select when 100 MHz operation suffices and JTAG is not required
ISSI IS61WV204836BLL-200TQLI 36-bit, 2M × 36, 200 MHz, but lacks NoBL™ architecture and ZZ sleep mode Suitable for cost-sensitive industrial controllers where burst continuity is non-critical Choose only if NoBL™ zero-wait-state performance and deep sleep are not design requirements

Compared with IDT72T36120L10PFI and IS61WV204836BLL-200TQLI, CY7C1470V25-200AXC uniquely delivers 200 MHz zero-wait-state operation with integrated sleep control and JTAG testability-critical for next-generation packet processing and high-reliability instrumentation.

Availability

CY7C1470V25-200AXC is available at Aetrix Electronics and suitable for network packet buffering, high-speed switch fabric memory, telecom line card buffering, and test equipment pattern memory requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1470V25-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including NoBL™ SRAMs, for demanding infrastructure applications.

This device belongs to the Cypress NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth memory interfacing in networking, telecom, and test equipment where deterministic timing and burst efficiency are critical.

FAQ

What is the function of the ZZ pin on CY7C1470V25-200AXC?

The ZZ pin enables deep sleep mode to reduce standby current to ≤120 mA. Per documented errata (Page 36), ZZ must be externally tied to ground for proper operation - leaving it floating or driving it high disables sleep functionality and may cause unpredictable behavior.

Does CY7C1470V25-200AXC support both linear and interleaved burst orders?

Yes - burst order is selected by the MODE pin: logic high configures linear burst, logic low selects interleaved burst. This allows direct compatibility with Intel or Motorola-style processor burst protocols without external address translation logic.

How does the NoBL™ architecture improve system performance compared to standard ZBT SRAMs?

NoBL™ eliminates bus turnaround time by enabling immediate back-to-back reads and writes on every clock cycle. Unlike ZBT devices that require one-cycle gaps between transitions, CY7C1470V25-200AXC sustains full 200 MHz throughput even under mixed read/write workloads typical in packet buffering.

Can CY7C1470V25-200AXC operate with only a 2.5 V supply, or are separate VDD and VDDQ rails required?

Both VDD (core) and VDDQ (I/O) must be supplied at 2.5 V ±0.2 V. Although voltage values match, they are electrically isolated pins per datasheet recommendations to suppress noise coupling between core logic and I/O drivers - using a single shared rail violates recommended layout practice.

CY7C1470V25-200AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1470V25-200AXC FAQ

1.How can I place an order for CY7C1470V25-200AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1470V25-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1470V25-200AXC reliable?

The price and inventory of CY7C1470V25-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470V25-200AXC is usually 5 days.

3.What payment methods are accepted for CY7C1470V25-200AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470V25-200AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1470V25-200AXC?

CY7C1470V25-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1470V25-200AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1470V25-200AXC?

For technical support, including CY7C1470V25-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470V25-200AXC requirements.

6.How does Aetrix verify that CY7C1470V25-200AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1470V25-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470V25-200AXC meets industry standards.

7.What is the process for return or replacement of CY7C1470V25-200AXC?

All CY7C1470V25-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470V25-200AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1470V25-200AXC part is unused and in its original packaging.

Return procedure for CY7C1470V25-200AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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