Infineon Technologies CY7C1470V25-200AXC
- Part No.:
- CY7C1470V25-200AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1470V25-200AXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1470V25-200AXC from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36, operating at 200 MHz with zero wait states. It features fully registered I/O, 2.5 V core and I/O supply, 3.0 ns clock-to-output delay, and byte-write capability for high-throughput memory buffering in network packet processors.
For engineers reviewing the CY7C1470V25-200AXC datasheet, CY7C1470V25-200AXC pinout, CY7C1470V25-200AXC application, or CY7C1470V25-200AXC equivalent, key selection criteria include burst mode support (linear/interleaved), synchronous self-timed writes, JTAG boundary scan compliance, and TQFP/FBGA package compatibility for backplane and switch fabric designs.
Technical Context
The device implements a fully synchronous, pipelined read/write interface with all inputs and outputs registered on the rising edge of CLK. Internal NoBL™ logic eliminates bus latency by enabling true back-to-back operations without wait states, sustaining 200 MHz continuous data transfer.
It supports three chip enables (CE1–CE3), clock enable (CEN), asynchronous OE, and four byte write selects (BWa–BWd) for granular 8-bit write control. Sleep mode (ZZ) and stop-clock operation reduce power during idle cycles while maintaining data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 200 MHz - enables 400 MT/s sustained throughput with no wait states |
| Access Time | 3.0 ns - clock-to-output delay determines minimum read cycle timing |
| Supply Voltage | 2.5 V core (VDD) and I/O (VDDQ) - requires single-rail 2.5 V system design |
| Operating Current | 450 mA max at 200 MHz - defines thermal and power delivery requirements |
| Burst Capability | Linear or interleaved - matches CPU/DSP burst address patterns for cache coherency |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan testability in dense PCB layouts |
Pinout & Package
Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 165-ball FBGA (15 × 17 × 1.4 mm). Pinout validated per Cypress Document No. 38-05290 Rev. *V (Pages 6–7).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master timing reference for all synchronous registers |
| CEN | Clock enable | Deassertion suspends clock domain operation without resetting internal state |
| CE1, CE2, CE3 | Chip enable inputs | Three-level decode for bank selection in multi-SRAM memory subsystems |
| BWa–BWd | Byte write enables | Independent 8-bit write masking for 36-bit data bus (four 9-bit nibbles) |
| OE | Output enable | Asynchronous control for output buffer tri-state; avoids bus contention during writes |
| ZZ | Deep sleep control | Active-low signal forcing standby current ≤120 mA; requires external tie to GND per errata |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ architecture | Enables unlimited back-to-back read/write cycles with zero wait states, eliminating pipeline stalls |
| Synchronous self-timed writes | On-chip timing control ensures write completion within fixed clock cycles, independent of board trace delays |
| Internally self-timed output buffer | Removes need for external OE timing control, simplifying PCB layout and timing closure |
| 2.5 V I/O compatibility | Direct interface with 2.5 V ASIC/FPGA I/O banks without level-shifting circuitry |
| Linear/interleaved burst order | Configurable via MODE pin to match host processor burst addressing conventions |
Applications
| Network Packet Buffering | High-Speed Switch Fabric Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches. IC Role / Device Role / Timing Role: Pipelined SRAM acting as low-latency first-level buffer between MAC and switching engine. Use Value: 3.0 ns clock-to-output and 200 MHz operation sustain line-rate forwarding for 10 GbE interfaces. |
Use Scenario: Holding forwarding tables and queue descriptors in modular chassis-based routers. IC Role / Device Role / Timing Role: Synchronous burst memory supporting parallel lookups across multiple ASIC pipelines. Use Value: Byte-write capability and 36-bit width enable efficient update of variable-length table entries without read-modify-write overhead. |
| Telecom Line Card Buffering | Test Equipment Pattern Memory |
|
Use Scenario: Temporarily storing SONET/SDH frame payloads during jitter correction and alignment. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used in ping-pong configuration for seamless frame handoff. Use Value: ZZ sleep mode reduces standby current to 120 mA, meeting NEBS Level 3 power budgets during idle intervals. |
Use Scenario: Storing stimulus and expected response vectors in automated IC testers (ATE). IC Role / Device Role / Timing Role: High-reliability memory providing deterministic access for pattern generation at 200 MHz. Use Value: JTAG boundary scan support enables in-system verification of memory interconnect integrity pre-test execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36120L10PFI | 36-bit, 2M × 36, 10 ns access, 100 MHz max - slower speed grade, different pinout | Targeted at legacy telecom systems with relaxed timing margins | Select when 100 MHz operation suffices and JTAG is not required |
| ISSI IS61WV204836BLL-200TQLI | 36-bit, 2M × 36, 200 MHz, but lacks NoBL™ architecture and ZZ sleep mode | Suitable for cost-sensitive industrial controllers where burst continuity is non-critical | Choose only if NoBL™ zero-wait-state performance and deep sleep are not design requirements |
Compared with IDT72T36120L10PFI and IS61WV204836BLL-200TQLI, CY7C1470V25-200AXC uniquely delivers 200 MHz zero-wait-state operation with integrated sleep control and JTAG testability-critical for next-generation packet processing and high-reliability instrumentation.
Availability
CY7C1470V25-200AXC is available at Aetrix Electronics and suitable for network packet buffering, high-speed switch fabric memory, telecom line card buffering, and test equipment pattern memory requiring stable component supply and long-term lifecycle support.
Supply support for CY7C1470V25-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including NoBL™ SRAMs, for demanding infrastructure applications.
This device belongs to the Cypress NoBL™ SRAM product line, engineered specifically for zero-latency, high-bandwidth memory interfacing in networking, telecom, and test equipment where deterministic timing and burst efficiency are critical.
FAQ
What is the function of the ZZ pin on CY7C1470V25-200AXC?
The ZZ pin enables deep sleep mode to reduce standby current to ≤120 mA. Per documented errata (Page 36), ZZ must be externally tied to ground for proper operation - leaving it floating or driving it high disables sleep functionality and may cause unpredictable behavior.
Does CY7C1470V25-200AXC support both linear and interleaved burst orders?
Yes - burst order is selected by the MODE pin: logic high configures linear burst, logic low selects interleaved burst. This allows direct compatibility with Intel or Motorola-style processor burst protocols without external address translation logic.
How does the NoBL™ architecture improve system performance compared to standard ZBT SRAMs?
NoBL™ eliminates bus turnaround time by enabling immediate back-to-back reads and writes on every clock cycle. Unlike ZBT devices that require one-cycle gaps between transitions, CY7C1470V25-200AXC sustains full 200 MHz throughput even under mixed read/write workloads typical in packet buffering.
Can CY7C1470V25-200AXC operate with only a 2.5 V supply, or are separate VDD and VDDQ rails required?
Both VDD (core) and VDDQ (I/O) must be supplied at 2.5 V ±0.2 V. Although voltage values match, they are electrically isolated pins per datasheet recommendations to suppress noise coupling between core logic and I/O drivers - using a single shared rail violates recommended layout practice.
CY7C1470V25-200AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1470V25-200AXC FAQ
1.How can I place an order for CY7C1470V25-200AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470V25-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470V25-200AXC reliable?
The price and inventory of CY7C1470V25-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470V25-200AXC is usually 5 days.
3.What payment methods are accepted for CY7C1470V25-200AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470V25-200AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470V25-200AXC?
CY7C1470V25-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470V25-200AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470V25-200AXC?
For technical support, including CY7C1470V25-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470V25-200AXC requirements.
6.How does Aetrix verify that CY7C1470V25-200AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1470V25-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470V25-200AXC meets industry standards.
7.What is the process for return or replacement of CY7C1470V25-200AXC?
All CY7C1470V25-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470V25-200AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470V25-200AXC part is unused and in its original packaging.
Return procedure for CY7C1470V25-200AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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