Infineon Technologies CY7C1470V25-200AXCT

Overview

CY7C1470V25-200AXCT from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36, operating at 200 MHz with zero wait states. It features fully registered inputs/outputs, 2.5 V core and I/O supply (VDDQ), 3.0 ns clock-to-output time, and byte-write capability via four BW pins. It is deployed in high-throughput network packet buffers and FPGA co-processor memory interfaces requiring deterministic latency.

For engineers reviewing the CY7C1470V25-200AXCT datasheet, CY7C1470V25-200AXCT pinout, CY7C1470V25-200AXCT application, or CY7C1470V25-200AXCT equivalent, key selection criteria include burst mode support (linear/interleaved), synchronous self-timed write control, JTAG boundary scan compliance, and TQFP/FBGA package compatibility for board-level timing closure and thermal management.

Technical Context

The device implements a pipelined read/write architecture with three synchronous chip enables (CE1–CE3), clock enable (CEN), and asynchronous output enable (OE). All address, data, and control signals are registered on the rising edge of CLK, enabling true back-to-back operations without bus latency.

NoBL™ logic eliminates bus turnaround delay by synchronously tri-stating outputs during write data phases and using internal self-timed write circuitry. Burst capability supports both linear and interleaved orders, and the ZZ sleep mode reduces standby current to 120 mA while maintaining data retention.

Key Specifications

Pinout & Package

Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 165-ball FBGA (15 × 17 × 1.4 mm) packages. Pin functions validated per Cypress Document No. 38-05290 Rev. *V.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IDT72V2125L15PF and IS61WV102436B, CY7C1470V25-200AXCT delivers higher throughput via NoBL™ architecture, tighter timing control through 3.0 ns access, and production-test readiness via integrated JTAG - making it optimal for new 200 MHz+ designs requiring reliability and scalability.

Availability

CY7C1470V25-200AXCT is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, and telecom line card memory applications requiring stable component supply across multi-year production cycles.

Supply support for CY7C1470V25-200AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including NoBL™ SRAMs, for industrial, automotive, and communications markets.

CY7C1470V25 belongs to the Cypress NoBL™ SRAM product line, engineered specifically for zero-latency, high-frequency memory subsystems in switching fabrics, protocol accelerators, and real-time embedded controllers.

FAQ

What is the function of the ZZ pin, and how must it be connected?

The ZZ pin enables deep sleep mode to reduce standby current to 120 mA while retaining memory contents. Per documented errata (page 36), ZZ must be externally tied to ground - leaving it floating or pulling high disables sleep functionality and may cause unpredictable behavior. This requirement applies to both TQFP (Pin 64) and FBGA (Ball H11) packages.

How does the NoBL™ architecture improve system performance compared to standard ZBT SRAMs?

NoBL™ eliminates bus turnaround latency by enabling immediate back-to-back read/write operations without wait states. Unlike ZBT devices that require one-cycle gap between direction changes, CY7C1470V25-200AXCT transfers data every clock cycle - increasing effective bandwidth by up to 35% in mixed-access workloads typical of packet processing and DSP buffering.

Can the CY7C1470V25-200AXCT operate with a 3.3 V I/O supply?

No. The device requires strictly 2.5 V for both core (VDD) and I/O (VDDQ) supplies. Applying 3.3 V exceeds absolute maximum ratings and risks permanent damage. Interface with 3.3 V systems requires level-shifting circuitry or compatible 2.5 V logic families (e.g., LVTTL or SSTL_25) on the DQ and control buses.

Is JTAG boundary scan supported in all package variants?

Yes. IEEE 1149.1 JTAG is implemented identically across both the 100-pin TQFP and 165-ball FBGA packages. All required TAP signals (TCK, TMS, TDI, TDO) are assigned to dedicated pins/balls per the datasheet, and boundary scan functionality is verified in production test for both variants.