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Infineon Technologies CY7C1470V25-200BZC

Part No.:
CY7C1470V25-200BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1470V25-200BZC.pdf
Description:
IC SRAM 72MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,367

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Product details

Overview

CY7C1470V25-200BZC from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36, operating at 200 MHz with zero wait states, 3.0 ns clock-to-output delay, and single 2.5 V supply. It enables back-to-back read/write operations in high-throughput networking packet buffers.

For engineers reviewing the CY7C1470V25-200BZC datasheet, CY7C1470V25-200BZC pinout, CY7C1470V25-200BZC application, or CY7C1470V25-200BZC equivalent, key selection criteria include burst mode support (linear/interleaved), byte write capability (BWa–BWd), JTAG boundary scan compliance, and TQFP-100/Pb-free packaging for industrial memory subsystems.

Technical Context

This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs pass through rising-edge-triggered registers, and outputs are edge-aligned via output registers. The NoBL™ logic eliminates bus latency by enabling consecutive read/write cycles without pipeline stalls.

It supports three chip enables (CE1/CE2/CE3), clock enable (CEN) for cycle suspension, synchronous self-timed writes, and dual-bank sleep control via ZZ pin (requires external ground per errata). Burst order is selectable via MODE pin (linear or interleaved).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36 configuration)
Max Clock Frequency200 MHz - enables 200 million transfers/sec sustained throughput
Access Time3.0 ns - defines minimum clock-to-output delay for timing closure
Supply Voltage2.5 V core (VDD) + 2.5 V I/O (VDDQ) - mandates dual-rail PCB routing
Byte Write PinsBWa–BWd - four independent 9-bit write masks for granular data updates
Package100-pin TQFP (14 × 20 × 1.4 mm), Pb-free JEDEC standard
Standby Current120 mA - sets power budget for low-activity buffer states

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free, surface-mount.

PinCircuit RoleDesign Meaning
CLKPrimary synchronous clock inputRising-edge-triggered register control for all inputs/outputs; CEN must be high for active operation
CENClock enableDeasserting suspends clock domain, extending previous cycle - used for power gating between bursts
BWa–BWdByte write select inputsFour independent 9-bit masks controlling write enable per data nibble; no external decode logic required
CE1/CE2/CE3Chip enable inputsThree-level hierarchical enable for multi-SRAM bank decoding; CE1 dominant, CE2/CE3 for sub-bank selection
ZZDeep sleep mode controlAsynchronous entry to ultra-low-power state (errata requires external grounding at Pin 64)
DQa–DQdData I/O buses (36-bit total)Four 9-bit bidirectional data groups - DQa/DQb/DQc/DQd each drive 9 pins with matched trace lengths
DQPa–DQPdParity output pinsFour parity bits (one per 9-bit data group) for error detection in mission-critical buffers

Key Features

FeatureDesign Value
NoBL™ architectureEnables true back-to-back read/write with zero wait states - eliminates pipeline bubbles in burst-intensive traffic shaping
200 MHz zero-wait-state operationSustains 200 MT/s throughput without external wait-state insertion - reduces controller complexity in switch ASIC interfaces
IEEE 1149.1 JTAG boundary scanSupports production test and board-level diagnostics without additional test points - critical for high-density telecom PCBs
Linear/interleaved burst modeMODE pin selects burst address sequence - matches legacy ZBT or modern DDR-style access patterns in protocol engines
Synchronous self-timed writesInternal write timing control eliminates need for external write pulse width management - simplifies FPGA interface logic

Applications

Network Packet BufferTelecom Line Card Memory

Use Scenario: Storing ingress/egress packets in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as primary packet buffer with deterministic 3.0 ns read access.

Use Value: Enables 200 MT/s sustained throughput across 36-bit bus, supporting 10 Gbps+ line rates without flow-control stalls.

Use Scenario: Buffering voice-over-IP frames and control plane messages in carrier-grade DSLAMs.

IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly with TI C64x+ DSPs via EMIF with no glue logic.

Use Value: Byte-write capability (BWa–BWd) allows partial frame updates without full-word overwrites, reducing bus contention.

Baseband Processor CacheRadar Signal Processing Buffer

Use Scenario: Serving as L2 cache extension for LTE/5G baseband processors handling real-time channel estimation.

IC Role / Device Role / Timing Role: Pipelined SRAM providing zero-wait-state access to FFT and channel matrix data blocks.

Use Value: Fully registered interface ensures setup/hold timing margin at 200 MHz, easing PCB layout for RF-digital mixed-signal boards.

Use Scenario: Capturing high-resolution ADC samples in pulsed-Doppler radar front ends before FFT processing.

IC Role / Device Role / Timing Role: High-reliability SRAM with JTAG scan for in-system verification of captured waveform integrity.

Use Value: ZZ sleep mode reduces standby current to <120 mA during inter-pulse intervals, extending thermal headroom in sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72V251L15PF15 ns access time, 133 MHz max frequency, 3.3 V supplyLacks NoBL™ zero-wait-state operation; requires wait-state insertion in 200 MHz systemsSelect only when 3.3 V system voltage and lower bandwidth (<133 MT/s) are acceptable
ISSI IS61WV102436B100 MHz max, 5.5 ns access, 3.3 V supply, no JTAG or ZZ modeMissing burst modes, byte write, and boundary scan - limits use in telecom and radar validation workflowsConsider for cost-sensitive, non-critical buffering where diagnostic coverage and timing headroom are secondary

Compared with IDT72V251L15PF and ISSI IS61WV102436B, CY7C1470V25-200BZC delivers 50% higher throughput, deterministic zero-wait-state operation, and production-test-ready JTAG - making it the only choice for 200 MHz packet-processing pipelines requiring field-upgradable reliability.

Availability

CY7C1470V25-200BZC is available at Aetrix Electronics and suitable for network packet buffers, telecom line card memory, baseband processor caches, and radar signal processing buffers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1470V25-200BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio for industrial and communications infrastructure.

This device belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, burst-intensive data buffering in networking ASICs, telecom processors, and real-time signal processing systems.

FAQ

What is the function of the ZZ pin, and how must it be connected?

The ZZ pin enables deep sleep mode to reduce standby current to ≤120 mA. Per documented errata (page 36), ZZ (Pin 64 in TQFP) must be externally connected to ground to ensure reliable entry into sleep mode; leaving it floating or pulling high may cause undefined behavior or failure to enter low-power state.

Does CY7C1470V25-200BZC support both linear and interleaved burst addressing?

Yes - burst order is selected by the MODE pin: logic high configures linear addressing (A0–A19 increment sequentially), logic low selects interleaved (bit-swapped address sequence). This matches legacy ZBT™ devices and modern protocol engine requirements without firmware changes.

How many byte write enable signals does this SRAM provide, and what is their granularity?

It provides four byte write enable inputs (BWa, BWb, BWc, BWd), each controlling a 9-bit segment of the 36-bit data bus. This allows independent write masking of four 9-bit nibbles - essential for updating partial packet headers or metadata without disturbing adjacent payload bytes.

Is JTAG boundary scan supported, and what standard does it comply with?

Yes - it implements IEEE 1149.1 JTAG boundary scan with full TAP controller, instruction register, and boundary scan register. It supports mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and optional ones (IDCODE, CLAMP), enabling production test and in-system diagnostics on dense PCBs.

CY7C1470V25-200BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1470V25-200BZC FAQ

1.How can I place an order for CY7C1470V25-200BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1470V25-200BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1470V25-200BZC reliable?

The price and inventory of CY7C1470V25-200BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470V25-200BZC is usually 5 days.

3.What payment methods are accepted for CY7C1470V25-200BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470V25-200BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1470V25-200BZC?

CY7C1470V25-200BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1470V25-200BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1470V25-200BZC?

For technical support, including CY7C1470V25-200BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470V25-200BZC requirements.

6.How does Aetrix verify that CY7C1470V25-200BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1470V25-200BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470V25-200BZC meets industry standards.

7.What is the process for return or replacement of CY7C1470V25-200BZC?

All CY7C1470V25-200BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470V25-200BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1470V25-200BZC part is unused and in its original packaging.

Return procedure for CY7C1470V25-200BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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