Infineon Technologies CY7C1470V25-200BZI

Overview

CY7C1470V25-200BZI from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36, operating at 200 MHz with zero wait states. It features fully registered inputs/outputs, 2.5 V core and I/O supply (VDDQ), 3.0 ns clock-to-output time, and byte write capability via BWa–BWd pins. It is used in high-throughput network packet buffering and FPGA co-processor memory interfaces.

For engineers reviewing the CY7C1470V25-200BZI datasheet, CY7C1470V25-200BZI pinout, CY7C1470V25-200BZI application, or CY7C1470V25-200BZI equivalent, key selection criteria include burst mode support (linear/interleaved), synchronous self-timed writes, JTAG boundary scan compliance, ZZ sleep mode implementation, and TQFP/FBGA package compatibility for board layout and thermal management.

Technical Context

The device implements a pipelined read/write architecture with No Bus Latency™ logic, enabling true back-to-back operations without wait states. All address, control, and data signals are registered on the rising edge of CLK, and output drivers are synchronously tri-stated during write cycles to prevent bus contention.

It supports three chip enables (CE1, CE2, CE3) for bank selection, asynchronous OE for output control, and clock enable (CEN) to suspend operation. Burst addressing is configurable via MODE pin for linear or interleaved order, and internal self-timed output buffer control eliminates need for external OE timing coordination.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free, with exposed thermal pad (not electrically connected). Pin 64 (ZZ) must be externally tied to ground per errata on page 36.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IDT72V2115L10PF and IS61WV204836BLL-200TQLI, CY7C1470V25-200BZI uniquely combines 200 MHz zero-wait-state operation, hardware parity outputs, JTAG testability, and validated ZZ sleep behavior - making it optimal for high-reliability telecom and industrial control where timing determinism and test coverage are mandatory.

Availability

CY7C1470V25-200BZI is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, and telecom line card buffering requiring stable component supply across extended production lifecycles.

Supply support for CY7C1470V25-200BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, documentation, and long-term supply commitment for legacy Cypress memory and microcontroller portfolios.

This device belongs to the NoBL™ SRAM product line, designed specifically for high-speed, low-latency memory interfacing in networking infrastructure, baseband processing, and real-time embedded systems demanding deterministic burst performance.

FAQ

What is the function of the ADV/LD pin in CY7C1470V25-200BZI?

The ADV/LD (Address Valid/Load) pin qualifies address latching on the rising edge of CLK. When asserted, it enables burst address generation for sequential accesses; when deasserted, it holds the current address. It directly controls the internal address counter used in linear or interleaved burst modes, and its timing relative to CLK defines valid address setup/hold windows per datasheet AC specs.

Does CY7C1470V25-200BZI support both linear and interleaved burst orders?

Yes - burst order is selected by the MODE pin: logic high configures linear burst (incrementing addresses), logic low selects interleaved burst (bit-reversed address sequence). This matches standard CPU cache line fetch patterns and allows optimization for specific processor or DMA controller architectures without firmware changes.

Why must the ZZ pin be tied to ground?

Per documented errata (page 36), the ZZ pin (Pin 64 in TQFP, Ball H11 in FBGA) exhibits undefined behavior unless externally pulled to ground. Failure to do so may cause erratic sleep entry/exit or increased standby current. This is a silicon-level requirement, not a recommendation, and applies to all speed grades and packages.

How does the CY7C1470V25-200BZI handle simultaneous read and write operations on the same address?

The device implements write-before-read coherency: when a write and read target the same location in the same burst sequence, the newly written data appears on the output bus in the subsequent clock cycle. This is enforced by internal registry and data coherency control logic, ensuring deterministic behavior without external arbitration or wait-state insertion.