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Infineon Technologies CY7C1470V33-167BZC

Part No.:
CY7C1470V33-167BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1470V33-167BZC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,406

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Product details

Overview

CY7C1470V33 from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36, operating at 167 MHz with 3.4 ns clock-to-output time, single 3.3 V core supply, and 3.3 V/2.5 V I/O support. It enables zero-wait-state back-to-back read/write operations in high-throughput network packet buffering systems.

For engineers reviewing the CY7C1470V33 datasheet, CY7C1470V33 pinout, CY7C1470V33 application, or CY7C1470V33 equivalent, key selection criteria include burst mode support (linear/interleaved), byte write capability (BWa–BWd), JTAG boundary scan compliance, ZZ sleep mode, and JEDEC-standard 100-pin TQFP packaging.

Technical Context

This SRAM implements fully registered synchronous interfaces: all address, control, and data signals pass through input registers on the rising clock edge; all outputs are clocked through output registers. Internal self-timed output buffer control eliminates asynchronous OE timing constraints.

The device supports three chip enables (CE1, CE2, CE3) for bank selection, synchronous self-timed writes, and burst access with ADV/LD-controlled address sequencing. Sleep mode is activated via the ZZ pin, requiring external grounding per errata on page 35 of Rev. *Y datasheet.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36 configuration)
Max Clock Frequency167 MHz - enables sustained 167 MT/s throughput with no wait states
Access Time3.4 ns - defines minimum clock-to-output delay for timing closure
Supply Voltage3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system interfacing
Power Consumption450 mA max operating current - determines thermal design margin at full speed
Burst CapabilityLinear or interleaved burst order - matches processor/cache line fetch patterns
JTAG SupportIEEE 1149.1 compliant - enables boundary-scan testability in dense PCBs

Pinout & Package

Package: JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm). Pin 64 (ZZ) requires external connection to ground per datasheet errata (page 35).

Pin/TerminalCircuit RoleDesign Meaning
CLKPrimary synchronous clock inputRising-edge-triggered register control for all inputs/outputs
CENClock enableDeassertion suspends operation and extends previous clock cycle
CE1, CE2, CE3Synchronous chip enablesThree-level decode for multi-bank memory mapping
BWa–BWdByte write selectsIndependent 9-bit write masking for 36-bit data bus (four 9-bit bytes)
ADV/LDAddress valid/loadControls burst address incrementing or loading new base address
ZZDeep power-down controlActive-low sleep mode entry; must be externally grounded per errata
DQa–DQdData I/O (36-bit)Bi-directional, registered data bus with DQP parity pins
VDDQI/O power supplySeparate 3.3 V/2.5 V rail decoupling required for signal integrity

Key Features

FeatureDesign Value
No Bus Latency™ (NoBL™) architectureEnables true back-to-back read/write without pipeline stalls, achieving 100% bus utilization
Internally self-timed output buffersRemoves dependency on asynchronous OE timing, simplifying PCB layout and timing analysis
Full registration of inputs and outputsGuarantees deterministic setup/hold margins across process/voltage/temperature corners
Synchronous self-timed writesEliminates external write pulse width constraints; internal logic manages write duration
Byte write capability (BWa–BWd)Allows partial 9-bit writes within 36-bit word, reducing bus traffic and power in cache-line updates

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in switching ASICs.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as ingress/egress packet buffer with burst-aligned access.

Use Value: 167 MHz zero-wait-state operation sustains 6 Gbps aggregate throughput across 36-bit bus.

Use Scenario: Holding frame headers and control metadata in multi-port TDM over IP gateways.

IC Role / Device Role / Timing Role: Synchronous burst-access memory interfaced to FPGA-based framer logic.

Use Value: Linear burst mode aligns with 32-byte header fetch patterns, minimizing address overhead.

Baseband Processor CacheRadar Signal Processing Buffer

Use Scenario: Serving as L2 instruction/data scratchpad in LTE/5G baseband SoCs.

IC Role / Device Role / Timing Role: Pipelined SRAM bridging high-frequency processor core and slower DDR subsystem.

Use Value: Fully registered interface ensures timing predictability under 167 MHz clock skew conditions.

Use Scenario: Temporarily storing FFT-processed chirp data in automotive radar ECU modules.

IC Role / Device Role / Timing Role: Burst-capable memory supporting real-time streaming of 128-sample complex vectors.

Use Value: Interleaved burst addressing matches FFT output ordering, avoiding software reordering latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72T3616L16PF16-Mbit (512K × 36), 167 MHz, same 100-pin TQFP but lacks ZZ sleep mode and JTAGLower density limits use in multi-gigabit buffering; no deep-sleep for power-constrained edge nodesSelect when cost sensitivity outweighs density and power features
AS7C33256A-167JC32-Mbit (1M × 32), 167 MHz, 100-pin TQFP, no burst mode or NoBL architectureNon-pipelined operation introduces wait states during read/write transitions, reducing effective bandwidthSelect only for legacy designs requiring pin compatibility without burst optimization

Compared with IDT72T3616L16PF and AS7C33256A-167JC, CY7C1470V33 delivers 2.25× higher density and deterministic zero-wait-state throughput via NoBL™, making it optimal for next-generation packet processing where latency and bandwidth are critical.

Availability

CY7C1470V33 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processor cache, and radar signal processing applications requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1470V33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, sensors, and memory solutions for industrial, automotive, and communications markets.

CY7C1470V33 belongs to Infineon's high-performance synchronous SRAM product line, designed specifically for zero-latency, burst-oriented data buffering in networking and real-time signal processing infrastructure.

FAQ

What is the required connection for the ZZ pin on CY7C1470V33?

The ZZ pin (Pin 64 in 100-pin TQFP) must be externally connected to ground to ensure proper deep power-down functionality. This requirement is documented in the errata on page 35 of datasheet Rev. *Y. Leaving ZZ floating or pulling high disables sleep mode and may cause undefined behavior during low-power operation.

Does CY7C1470V33 support both linear and interleaved burst modes?

Yes, CY7C1470V33 supports both linear and interleaved burst orders, selected via the MODE pin. Linear burst increments addresses sequentially (e.g., 0x00, 0x01, 0x02), while interleaved uses XOR-based addressing (e.g., 0x00, 0x02, 0x01, 0x03), matching cache-line fetch patterns in many processors and FPGAs.

How does the NoBL™ architecture eliminate bus latency?

NoBL™ eliminates bus latency by enabling consecutive read and write operations without wait states through fully registered pipelines and internal self-timed output control. Unlike conventional SRAMs, it avoids OE-driven asynchronous output enable delays and allows data transfer on every clock cycle, even during read-to-write transitions.

Can CY7C1470V33 operate with 2.5 V I/O voltage while maintaining 3.3 V core supply?

Yes, CY7C1470V33 supports independent 3.3 V core (VDD) and 2.5 V I/O (VDDQ) supplies. The VDDQ pins must be decoupled separately, and all I/O timing parameters (e.g., setup/hold) are specified for 2.5 V operation in the datasheet's 2.5 V AC test conditions section (page 20).

CY7C1470V33-167BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Last Time Buy
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1470V33-167BZC FAQ

1.How can I place an order for CY7C1470V33-167BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1470V33-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1470V33-167BZC reliable?

The price and inventory of CY7C1470V33-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470V33-167BZC is usually 5 days.

3.What payment methods are accepted for CY7C1470V33-167BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470V33-167BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1470V33-167BZC?

CY7C1470V33-167BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1470V33-167BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1470V33-167BZC?

For technical support, including CY7C1470V33-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470V33-167BZC requirements.

6.How does Aetrix verify that CY7C1470V33-167BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1470V33-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470V33-167BZC meets industry standards.

7.What is the process for return or replacement of CY7C1470V33-167BZC?

All CY7C1470V33-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470V33-167BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1470V33-167BZC part is unused and in its original packaging.

Return procedure for CY7C1470V33-167BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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