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Infineon Technologies CY7C1470V33-200AXCT
- Part No.:
- CY7C1470V33-200AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1470V33-200AXCT.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,740
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Product details
Overview
CY7C1470V33 from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36, operating at 200 MHz with zero wait states. It features fully registered I/O, 3.3 V core supply, 3.3 V/2.5 V I/O support, and 3.0 ns clock-to-output delay. Used in high-throughput network packet buffering and FPGA co-processor memory interfaces.
For engineers reviewing the CY7C1470V33 datasheet, CY7C1470V33 pinout, CY7C1470V33 application, or CY7C1470V33 equivalent, key selection criteria include burst mode compatibility (linear/interleaved), byte-write granularity (BWa–BWd), synchronous self-timed write control, and TQFP/FBGA package availability with JTAG boundary scan support.
Technical Context
The device implements a true pipelined read/write architecture with all inputs and outputs registered on the rising edge of CLK, enabling back-to-back operations without bus latency. Its NoBL™ logic eliminates asynchronous OE dependency via internally self-timed output buffer control.
It supports three chip enables (CE1–CE3) for bank selection, clock enable (CEN) for cycle suspension, and ZZ sleep mode with external grounding requirement per errata. Burst capability includes linear and interleaved orders with ADV/LD-controlled address sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 configuration) |
| Max Clock Frequency | 200 MHz - enables sustained 200 MT/s throughput with no wait states |
| Access Time | 3.0 ns - defines minimum clock-to-output delay for timing-critical interfaces |
| Supply Voltage | 3.3 V core, 3.3 V/2.5 V I/O - supports mixed-voltage system integration |
| Power Consumption | 500 mA max operating current - constrains thermal design in dense PCB layouts |
| Burst Mode | Linear or interleaved - matches CPU/FPGA burst addressing patterns |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan testability in production |
Pinout & Package
Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and non-Pb-free 165-ball FBGA (15 × 17 × 1.4 mm). Pin functions validated per datasheet Rev. *Y (March 2019).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Primary synchronous clock input | Drives all internal registers; rising-edge triggered for address/data capture |
| CEN | Clock enable control | When deasserted, suspends operation and extends previous clock cycle - critical for power-gated modes |
| BWa–BWd | Byte write select inputs | Enable independent 9-bit writes to four 36-bit data segments - essential for partial-word updates |
| CE1–CE3 | Synchronous chip enables | Three-level decode for multi-bank memory mapping without external logic |
| ADV/LD | Address valid/load control | Qualifies burst address generation - determines linear vs. interleaved sequence behavior |
| ZZ | Asynchronous sleep mode input | Must be externally grounded per errata (Pin 64 TQFP / H11 FBGA) to disable sleep functionality |
| DQa–DQd | 36-bit bidirectional data bus | Four 9-bit groups aligned to BWa–BWd; synchronous tristate during write data phase |
| DQPa–DQPd | Parity output pins | Provide even parity per 9-bit data nibble - supports ECC-capable controllers |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables unlimited true back-to-back read/write cycles with zero wait states - eliminates pipeline stalls in burst-heavy traffic |
| Fully Registered I/O | All inputs and outputs synchronized to CLK rising edge - simplifies timing closure in high-speed FPGA/CPU interfaces |
| Synchronous Self-Timed Writes | On-chip write timing control removes external write pulse width constraints - improves reliability across voltage/temperature |
| Byte Write Capability | Four independent 9-bit write enables (BWa–BWd) - allows precise data modification without read-modify-write overhead |
| JTAG Boundary Scan | IEEE 1149.1 compliance with TAP controller - enables automated PCB test and interconnect verification |
Applications
| Network Packet Buffering | FPGA Co-Processor Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/3 switches with line-rate throughput. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory between ingress/egress engines and lookup tables. Use Value: 200 MHz pipelined operation sustains 7.2 GB/s aggregate bandwidth, eliminating frame drop under full load. | Use Scenario: Offloading compute-intensive tasks (e.g., encryption, filtering) from host CPU using tightly coupled FPGA accelerators. IC Role / Device Role / Timing Role: Low-latency scratchpad memory with deterministic access timing for DMA and streaming pipelines. Use Value: Fully registered interface ensures setup/hold timing margins >0.8 ns at 200 MHz, reducing FPGA timing closure effort. |
| Telecom Baseband Processing | Industrial Real-Time Control |
Use Scenario: Buffering I/Q samples between ADC/DAC and DSP cores in 4G/5G remote radio units. IC Role / Device Role / Timing Role: Synchronous burst memory supporting interleaved addressing for FFT/IFFT data reordering. Use Value: Interleaved burst mode aligns with radix-4 FFT memory access patterns, cutting memory controller logic by 35%. | Use Scenario: Deterministic data exchange between safety-critical PLC CPUs and fieldbus interface ASICs. IC Role / Device Role / Timing Role: Fail-safe dual-port memory with parity-checked writes for SIL-3 certified motion control loops. Use Value: DQPa–DQPd parity outputs enable end-to-end error detection without external logic, meeting IEC 61508 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T36120L10BG | 10 ns access time, 100 MHz max frequency, 3.3 V only I/O, no ZZ sleep mode | Lacks burst mode flexibility and JTAG test support; suited for simpler legacy systems | Select when lower cost and reduced feature set are acceptable trade-offs for non-burst workloads |
| ISSI IS61WV102436B | 150 MHz max frequency, 3.5 ns access time, no ADV/LD or interleaved burst, no JTAG | Supports only linear burst; lacks parity outputs and sleep mode control | Prefer for cost-sensitive industrial controllers where 200 MHz throughput is not required |
Compared with IDT72T36120L10BG and IS61WV102436B, CY7C1470V33 delivers 100% higher bandwidth, integrated parity for functional safety, and JTAG for production testability - making it optimal for next-generation telecom and real-time embedded systems requiring deterministic performance.
Availability
CY7C1470V33 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, and telecom baseband processing requiring stable component supply across extended product lifecycles.
Supply support for CY7C1470V33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, industrial, and memory solutions with emphasis on reliability and long-term support.
This device belongs to Infineon's legacy Cypress synchronous SRAM portfolio, designed specifically for high-throughput, low-latency memory subsystems in networking, communications, and real-time embedded systems.
FAQ
What is the required connection for the ZZ pin on CY7C1470V33?
The ZZ pin must be externally connected to ground per documented errata (page 35, Rev. *Y). Leaving it floating or pulling high may cause unintended sleep mode entry and system instability. This applies to both TQFP (Pin 64) and FBGA (Ball H11) packages.
Does CY7C1470V33 support 2.5 V I/O signaling without level shifters?
Yes - the device supports 2.5 V I/O operation with dedicated VDDQ pins. When VDDQ = 2.5 V, input thresholds and output drive strength comply with SSTL_2 standards, enabling direct interface to 2.5 V FPGAs and ASICs without external level translation.
How does the ADV/LD pin affect burst addressing behavior?
ADV/LD controls burst address sequencing: asserted HIGH enables linear burst order; LOW selects interleaved order. This signal is sampled synchronously on CLK rising edge and directly drives the burst logic block, determining how successive addresses increment during burst transfers.
Is CY7C1470V33 pin-compatible with ZBT SRAMs?
Yes - it is pin-compatible and functionally equivalent to standard ZBT SRAMs per datasheet specification. This includes identical pin assignments for CLK, CEN, CE1–CE3, WE, OE, BWx, and DQx signals, enabling drop-in replacement in existing ZBT-based designs.
CY7C1470V33-200AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1470V33-200AXCT FAQ
1.How can I place an order for CY7C1470V33-200AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1470V33-200AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1470V33-200AXCT reliable?
The price and inventory of CY7C1470V33-200AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1470V33-200AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1470V33-200AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1470V33-200AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1470V33-200AXCT?
CY7C1470V33-200AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1470V33-200AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1470V33-200AXCT?
For technical support, including CY7C1470V33-200AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1470V33-200AXCT requirements.
6.How does Aetrix verify that CY7C1470V33-200AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1470V33-200AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1470V33-200AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1470V33-200AXCT?
All CY7C1470V33-200AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1470V33-200AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1470V33-200AXCT part is unused and in its original packaging.
Return procedure for CY7C1470V33-200AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1470V33-200AXCT Tags
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