Infineon Technologies CY7C1471BV25-133AXCT

Overview

CY7C1471BV25-133AXCT from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous NoBL™ SRAM with 2.5V VDDQ I/O supply, 133 MHz maximum clock frequency, 6.5 ns clock-to-output delay, and pin-compatible ZBT™ functionality. It serves as a high-throughput data buffer in network packet processors requiring zero-wait-state back-to-back read/write transitions.

For engineers reviewing the CY7C1471BV25-133AXCT datasheet, CY7C1471BV25-133AXCT pinout, CY7C1471BV25-133AXCT application, or CY7C1471BV25-133AXCT equivalent, key selection criteria include burst order configuration (linear/interleaved), byte-write select granularity (4 × 9-bit), synchronous self-timed write control, and TQFP-100 package compatibility with JEDEC Pb-free standards.

Technical Context

The device implements a flow-through architecture with registered address, data, and control inputs synchronized to the rising edge of CLK, qualified by CEN. Its NoBL™ logic eliminates bus dead cycles by enabling consecutive read/write operations with data valid on every clock cycle.

Burst addressing is controlled by ADV/LD and MODE pins, supporting linear or interleaved sequences across 2-bit counters. Output drivers are synchronously tri-stated during write data phases and automatically disabled upon CE deselection or OE deassertion-no external timing coordination required.

Key Specifications

Pinout & Package

Package: 100-pin TQFP (14 × 14 mm, 0.5 mm pitch), JEDEC-standard Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IDT72V2115L133PF and IS61WV102436BLL-133TQLI, CY7C1471BV25-133AXCT uniquely supports both linear and interleaved burst modes via hardware strap, retains full ZBT™ pin compatibility, and delivers guaranteed 6.5 ns access at 133 MHz in a Pb-free TQFP package with integrated JTAG testability.

Availability

CY7C1471BV25-133AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processing cache applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for CY7C1471BV25-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial systems, with headquarters in San Jose, CA.

This device belongs to Cypress's NoBL™ SRAM product line, engineered specifically to replace asynchronous SRAMs and ZBT™ SRAMs in bandwidth-constrained, low-latency applications demanding deterministic timing and seamless burst operation.

FAQ

What is the function of the MODE pin on CY7C1471BV25-133AXCT?

The MODE pin is a hardware strap that selects burst order: tied to ground for linear burst sequence, or to VDD/floating for interleaved burst. It is sampled at power-up and does not require register programming. This pin directly configures the internal 2-bit burst counter behavior and must remain static during operation to avoid undefined burst addressing.

How does the automatic tri-state control work during write cycles?

During the data portion of a write sequence, output drivers for DQ and DQP lines are synchronously forced into high-impedance state regardless of OE state - preventing bus contention. This occurs automatically on the same clock edge that latches write data, eliminating need for external OE timing coordination or hold-time margins.

Can CY7C1471BV25-133AXCT operate with mixed voltage supplies?

Yes: it requires 2.5V ±0.2V for VDDQ (I/O supply) and 2.3V–2.7V for VDD (core supply). These rails may be independently regulated. VDDQ must be powered before or simultaneously with VDD; reverse sequencing risks latch-up. The device does not support 3.3V I/O operation.

Is JTAG boundary scan supported in the TQFP package?

No: TDO, TCK, TMS, and TDI pins are not bonded out in the 100-pin TQFP package (CY7C1471BV25-133AXCT). JTAG functionality is available only in FBGA variants (e.g., CY7C1471BV25-133BAXI). For TQFP-based designs, boundary scan testing must rely on external tools or functional verification.