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Infineon Technologies CY7C1471BV33-133AXC

Part No.:
CY7C1471BV33-133AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1471BV33-133AXC.pdf
Description:
IC SRAM 72MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,335

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Product details

Overview

CY7C1471BV33 from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous flow-through SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom equipment. It supports 133 MHz zero-wait-state bus operation, delivers 6.5 ns clock-to-output timing, and features synchronous byte write control via four BWx inputs and WE. Used in packet buffering and cache coherency logic where back-to-back read/write transitions are critical.

For engineers reviewing the CY7C1471BV33 datasheet, CY7C1471BV33 pinout, CY7C1471BV33 application, or CY7C1471BV33 equivalent, key selection criteria include its 100-pin TQFP package, synchronous self-timed writes, burst order configurability (linear/interleaved), IEEE 1149.1 JTAG support, and 3.3 V core / 2.5 V or 3.3 V I/O supply flexibility.

Technical Context

The device implements a No Bus Latency (NoBL™) architecture that eliminates dead cycles between consecutive read and write operations by synchronizing all inputs-including address, byte write enables, and control signals-to the rising edge of CLK, qualified by CEN. Internal burst counters and registered address/data paths ensure deterministic timing across all access types.

It supports both linear and interleaved burst orders selected via the MODE strap pin, and integrates synchronous self-timed write circuitry to eliminate external write pulse timing constraints. Output drivers are synchronously tri-stated during write data phases to prevent bus contention, independent of OE state.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36 configuration)
Max Clock Frequency133 MHz - enables sustained 133 MT/s throughput with no wait states
Access Time (tCDV)6.5 ns - guaranteed clock-to-output delay at 133 MHz, critical for timing closure
I/O Supply (VDDQ)2.5 V or 3.3 V - supports mixed-voltage system interfacing without level shifters
Burst CapabilityLinear or interleaved - selectable via MODE pin; matches processor/cache burst patterns
Power-Down ModeZZ sleep mode - reduces standby current while preserving data integrity
JTAG SupportIEEE 1149.1 compliant - enables boundary scan testing on PCB assemblies

Pinout & Package

Available in JEDEC-standard Pb-free 100-pin thin quad flat pack (TQFP), 14 × 20 × 1.4 mm body size, with 0.5 mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
A0–A[19]Synchronous Address Input20-bit address latched on rising CLK edge; A[1:0] drives internal 2-bit burst counter
BWA–BWDSynchronous Byte Write EnableFour active-low signals controlling 8-bit write granularity per DQ byte group
CE1, CE2, CE3Synchronous Chip EnableThree-level decode (CE1/CE3 active LOW, CE2 active HIGH) enables depth expansion up to 8×
CLK, CENClock & Clock EnableCLK qualified by CEN; CEN HIGH extends previous cycle without deselection
OEAsynchronous Output EnableTri-states outputs asynchronously but masked during write data phase and deselect
ZZAsynchronous Sleep ControlActive-HIGH entry into low-power ZZ mode; internal pull-down ensures safe default
DQPA–DQPDBidirectional Data I/O (Parity)Four 9-bit parity groups aligned with DQA–DQD; controlled by corresponding BWx
MODEBurst Order StrapGround = linear burst; VDD/floating = interleaved burst - sets burst address sequence

Key Features

FeatureDesign Value
NoBL™ ArchitectureEliminates bus latency between write-read transitions, enabling true back-to-back operations at full 133 MHz
Synchronous Self-Timed WritesRemoves external write pulse timing constraints-internal logic guarantees correct write completion within one clock cycle
Configurable Burst OrderHardware-selectable linear or interleaved burst via MODE pin, matching x86 or PowerPC cache line fetch patterns
Byte-Write GranularityFour independent 8-bit write enables (BWA–BWD) allow partial-word updates without read-modify-write overhead
Automatic Output Tri-StateOutputs disable synchronously during write data phase regardless of OE state-prevents bus contention without external logic

Applications

Packet Buffering in Switch ASICsCache Coherency Directory Storage

Use Scenario: High-speed Ethernet switch fabric buffers ingress/egress packets before classification and forwarding.

IC Role / Device Role / Timing Role: Acts as low-latency, pipelined SRAM buffer supporting concurrent read (lookup) and write (store) at line rate.

Use Value: 6.5 ns tCDV and NoBL™ enable sub-8 ns effective access time, meeting 10 Gbps+ packet processing deadlines.

Use Scenario: Storing cache coherency state (MESI tags) for multi-core processors with shared L3 cache.

IC Role / Device Role / Timing Role: Provides synchronized tag storage with burst reads matching cache line size and byte-write capability for single-tag updates.

Use Value: Synchronous self-timed writes and 4-byte write select reduce average tag update latency by >40% vs. asynchronous SRAM.

Telecom Line Card Control MemoryReal-Time Signal Processing FIFO

Use Scenario: Storing configuration tables and real-time statistics in optical transport network (OTN) line cards.

IC Role / Device Role / Timing Role: Serves as dual-port-accessible control memory interfaced to FPGA-based control plane and DSP data path.

Use Value: Three chip enables (CE1/CE2/CE3) simplify banked memory mapping; ZZ mode cuts standby power by 70% during idle intervals.

Use Scenario: Implementing programmable-depth FIFOs in radar signal preprocessing pipelines.

IC Role / Device Role / Timing Role: Functions as synchronous burst FIFO with ADV/LD-controlled address sequencing and burst-mode data streaming.

Use Value: Linear/interleaved burst selection aligns with FFT engine memory access patterns, reducing DMA overhead by 2×.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72V2115L133BGSame density (2M × 36), 133 MHz, but uses ZBT™ architecture and requires OE for output controlLacks automatic output tri-state during writes; requires external OE timing coordinationPrefer when legacy ZBT™ compatibility is required and board layout accommodates OE timing margins
ISSI IS61WV102436BLL-133TQLI133 MHz, 2M × 36, but no JTAG support and higher standby current (180 mA vs. 120 mA)Missing IEEE 1149.1 boundary scan; less suitable for high-reliability telecom BGA assembliesSelect for cost-sensitive industrial applications where JTAG testability is not mandated

Compared with IDT72V2115L133BG and IS61WV102436BLL-133TQLI, the CY7C1471BV33 provides superior timing determinism via NoBL™ and integrated output control, lower standby power, and production-ready JTAG test infrastructure-critical for carrier-grade hardware validation.

Availability

CY7C1471BV33 is available at Aetrix Electronics and suitable for packet buffering, cache coherency directory storage, and telecom line card control memory requiring stable component supply across long-lifecycle deployments.

Supply support for CY7C1471BV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The CY7C1471BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for deterministic, zero-wait-state memory subsystems in high-speed networking and real-time signal processing systems.

FAQ

What is the function of the MODE pin on CY7C1471BV33?

The MODE pin selects burst address order: tied to GND for linear burst (0,1,2,3…), or to VDD/floating for interleaved burst (0,2,4,6…,1,3,5,7…). This setting is sampled at power-up and remains static during operation. It directly determines how the internal 2-bit burst counter increments address bits A[1:0], aligning with host processor cache line fetch behavior without software intervention.

Does CY7C1471BV33 require an external clock divider for 133 MHz operation?

No. The device operates natively at 133 MHz with a single-ended CMOS clock input; no external divider is needed. Its internal input registers sample all synchronous signals-including address, BWx, WE, and CE-on the rising edge of CLK, and the 6.5 ns tCDV specification is guaranteed under 133 MHz conditions with proper AC loading (30 pF, 1.0 V/ns slew rate) per the datasheet's switching characteristics table.

How does the ZZ sleep mode interact with data retention?

In ZZ mode (pin driven HIGH), the device enters a non-time-critical sleep state with full data retention. Core power (VDD) remains active, but internal clocks and I/O drivers are gated. Data integrity is preserved indefinitely as long as VDD ≥ 2.7 V and ambient temperature stays within –40°C to +85°C. Exiting ZZ requires only a falling edge on ZZ followed by one valid clock cycle before normal access resumes.

Can CY7C1471BV33 be used with 2.5 V-only I/O interfaces?

Yes. VDDQ may be independently supplied at 2.5 V while VDD remains at 3.3 V, enabling direct interface to 2.5 V logic families without level shifters. The datasheet specifies full AC/DC performance-including 6.5 ns tCDV and 133 MHz operation-under 2.5 V VDDQ conditions. All DQ and DQP pins are 2.5 V tolerant in this configuration, and byte write functionality remains fully operational.

CY7C1471BV33-133AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6.5 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1471BV33-133AXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1471BV33-133AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY7C1471BV33-133AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1471BV33-133AXC is usually 5 days.

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6.How does Aetrix verify that CY7C1471BV33-133AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1471BV33-133AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1471BV33-133AXC meets industry standards.

7.What is the process for return or replacement of CY7C1471BV33-133AXC?

All CY7C1471BV33-133AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1471BV33-133AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1471BV33-133AXC part is unused and in its original packaging.

Return procedure for CY7C1471BV33-133AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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