Infineon Technologies CY7C1471BV33-133AXCT

Overview

CY7C1471BV33-133AXCT from Cypress Semiconductor is a 72-Mbit (2M × 36) synchronous flow-through SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It supports 133 MHz zero-wait-state bus operation, delivers 6.5 ns clock-to-output delay, enables true back-to-back read/write transitions, and operates with 3.3 V core and 2.5/3.3 V I/O supply (VDDQ).

For engineers reviewing the CY7C1471BV33-133AXCT datasheet, CY7C1471BV33-133AXCT pinout, CY7C1471BV33-133AXCT application, or CY7C1471BV33-133AXCT equivalent, key selection criteria include burst order configuration (linear/interleaved), synchronous byte write control via BWA–BWD, ZZ sleep mode power management, JEDEC-compliant TQFP-100 packaging, and IEEE 1149.1 JTAG boundary scan support.

Technical Context

The device implements a synchronous, clocked interface with all inputs registered on the rising edge of CLK, qualified by CEN. Its NoBL™ architecture eliminates dead cycles between consecutive operations using internal self-timed output buffer control and registered ADV/LD logic for burst address generation.

It supports two burst modes (linear or interleaved) selected by the MODE strap pin, features three synchronous chip enables (CE1 active LOW, CE2 active HIGH, CE3 active LOW) for bank expansion, and uses asynchronous OE with automatic tri-state during write data windows to prevent bus contention.

Key Specifications

Pinout & Package

Package: JEDEC-standard Pb-free 100-pin thin quad flat pack (TQFP), 14 mm × 20 mm × 1.4 mm body, 0.5 mm pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous burst SRAM applications.

Compared with IDT72V2135L133PFI and IS61WV102436BLL-133TQLI, CY7C1471BV33-133AXCT uniquely combines NoBL™ zero-latency operation, dual-voltage VDDQ, hardware-configurable burst order, and integrated JTAG - making it optimal for next-generation telecom and packet-processing systems demanding both performance and testability.

Availability

CY7C1471BV33-133AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and FPGA co-processor memory applications requiring stable component supply and long-term industrial availability.

Supply support for CY7C1471BV33-133AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.

CY7C1471BV33 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for systems requiring deterministic, high-throughput memory access with minimal latency variation - especially in packet-switching, baseband, and real-time control infrastructure.

FAQ

What is the function of the MODE pin, and how must it be connected?

The MODE pin selects burst addressing order: tied to GND for linear burst, tied to VDD or left floating for interleaved burst. It is a static strap input sampled at power-up and does not require dynamic control. Leaving it unconnected defaults to interleaved mode due to internal weak pull-up; incorrect strapping causes misaligned burst reads/writes and data corruption.

How does the ZZ sleep mode interact with data retention and wake-up timing?

When ZZ is driven HIGH, the device enters non-time-critical sleep mode with full data retention and reduced current draw (≤120 mA). Wake-up occurs synchronously on the first valid CLK edge after ZZ returns LOW, with no additional latency beyond standard access time - no initialization sequence or delay is required.

Can CE2 be used as an active-LOW enable like CE1 and CE3?

No - CE2 is defined as active HIGH per the datasheet and pin definition table. Using it as active LOW violates timing and functional specifications. Correct operation requires CE1 and CE3 asserted LOW while CE2 is asserted HIGH to enable the device; reversing CE2 polarity may cause unpredictable chip select behavior or failure to respond to commands.

Is the TQFP-100 package RoHS-compliant and lead-free?

Yes - the "XCT" suffix in CY7C1471BV33-133AXCT explicitly denotes JEDEC-standard Pb-free (RoHS-compliant) 100-pin TQFP packaging. The device meets IPC/JEDEC J-STD-609A Class 1 marking requirements and contains no lead, mercury, cadmium, hexavalent chromium, PBB, or PBDE above threshold limits.