Infineon Technologies CY7C1472BV25-200AXCT
- Part No.:
- CY7C1472BV25-200AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1472BV25-200AXCT.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1472BV25-200AXCT from Cypress Semiconductor is a 72-Mbit (4M × 18) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 200 MHz with zero wait states, delivers 3.0 ns clock-to-output delay, supports byte-write via BWa/BWb, and uses single 2.5 V supply with separate 2.5 V I/O (VDDQ). It enables back-to-back read/write transitions in burst-capable packet buffering applications.
For engineers reviewing the CY7C1472BV25-200AXCT datasheet, CY7C1472BV25-200AXCT pinout, CY7C1472BV25-200AXCT application, or CY7C1472BV25-200AXCT equivalent, key selection criteria include burst order control (MODE pin), synchronous self-timed write timing, JTAG boundary scan support, and TQFP-100 package compatibility with legacy ZBT™ designs.
Technical Context
This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK (qualified by CEN), and all outputs are driven through output registers synchronized to CLK. The internal NoBL™ logic eliminates bus latency by enabling consecutive read/write operations without inter-cycle gaps.
Burst operation supports linear or interleaved addressing via MODE pin configuration; byte-write capability is implemented using two dedicated BWa/BWb signals controlling 18-bit data groups; ZZ Sleep Mode and Stop Clock options reduce power during idle cycles while preserving data integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4M × 18 organization), enabling compact 18-bit wide memory banks in FPGA/ASIC co-processor systems |
| Max Clock Frequency | 200 MHz - guarantees sustained 200 MT/s throughput with no wait states in pipelined mode |
| Access Time (tCO) | 3.0 ns - defines minimum clock-to-valid-data delay for timing-critical burst reads |
| Supply Voltage | 2.5 V core (VDD) + 2.5 V I/O (VDDQ) - ensures compatibility with 2.5 V logic families and low-noise signaling |
| Power Consumption | 450 mA max operating current - sets thermal budget for dense PCB layouts in telecom modules |
| Burst Capability | Linear or interleaved burst order - selectable via MODE pin to match processor or DMA controller addressing patterns |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan testing without additional test fixtures on production boards |
Pinout & Package
Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free, surface-mount compatible with automated reflow assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Rising-edge-triggered master clock; qualified by CEN to gate internal state updates |
| CEN | Clock Enable (active LOW) | Suspends clock recognition without deselecting device-extends previous cycle for timing margin |
| CE1, CE3 | Synchronous chip enable (active LOW) | Combined with CE2 (active HIGH) for 3-signal depth expansion across multiple SRAMs |
| BWa, BWb | Byte Write Select (active LOW) | Control write masking for two 18-bit data groups (DQa/DQPa and DQb/DQPb) independently |
| ADV/LD | Advance/Load control | HIGH advances internal burst counter; LOW loads new address-required after deselection |
| MODE | Burst order configuration strap | HIGH = interleaved burst; LOW = linear burst-must be stable during operation |
| ZZ | Deep sleep mode enable | Active LOW entry into low-power state (<120 µA standby) with full data retention |
| OE | Asynchronous output enable | Tri-states DQ pins during writes and deselects-prevents bus contention without timing constraints |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ architecture | Enables true back-to-back read/write operations with zero wait states-critical for packet buffer line-rate performance |
| Synchronous self-timed writes | Eliminates external write pulse timing constraints-internal circuitry manages write completion independent of clock phase |
| Byte-write with dual BW controls | Allows partial 18-bit word updates without read-modify-write cycles-reduces bandwidth overhead in protocol header editing |
| Separate VDDQ supply | Isolates I/O noise from core logic-improves signal integrity for high-speed 200 MHz data transfers |
| JTAG boundary scan (IEEE 1149.1) | Supports automated PCB test coverage for all 100 pins-reduces manual ICT fixture cost in volume manufacturing |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory for ingress/egress packet queues with burst-mode DMA access. Use Value: 200 MHz pipelined operation sustains 3.6 Gbps aggregate throughput across 18-bit bus, eliminating frame drop under line-rate traffic. |
Use Scenario: Frame assembly/disassembly in SONET/SDH add-drop multiplexers requiring deterministic memory access. IC Role / Device Role / Timing Role: Synchronous burst SRAM interfacing directly with framer ASICs for time-division multiplexed payload storage. Use Value: 3.0 ns tCO and zero-wait-state operation meet sub-5 ns timing closure requirements for OC-192 interface logic. |
| FPGA Co-Processor Cache | Industrial Protocol Gateway |
|
Use Scenario: Offloading real-time data preprocessing from FPGA fabric to reduce LUT utilization in motor control systems. IC Role / Device Role / Timing Role: External instruction/data cache for soft-core processors (e.g., MicroBlaze) executing motion control algorithms. Use Value: Byte-write capability enables efficient update of small parameter sets without full-word writes-reducing memory bandwidth pressure by 67%. |
Use Scenario: Bridging Modbus TCP and CANopen protocols in factory automation gateways with concurrent session handling. IC Role / Device Role / Timing Role: Shared buffer for protocol translation engine managing multiple concurrent client connections. Use Value: ZZ Sleep Mode cuts standby power to <120 µA during idle periods-extending uptime in battery-backed edge nodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 4M × 18, 15 ns access, 3.3 V supply, no MODE-selectable burst order | Lacks NoBL™ zero-wait-state capability; requires external wait-state insertion in high-speed designs | Select when 3.3 V system integration is mandatory and 15 ns latency is acceptable |
| ISSI IS61WV102418BLL-200TQLI | 1M × 18, 200 MHz, 2.5 V, no JTAG, no ZZ Sleep Mode | Lower density (18 Mbit vs. 72 Mbit); missing deep-sleep and boundary-scan features | Select for cost-sensitive, lower-bandwidth applications where JTAG testability is not required |
Compared with IDT72V2115L15PF and IS61WV102418BLL-200TQLI, CY7C1472BV25-200AXCT uniquely combines 72-Mbit density, zero-wait-state 200 MHz operation, MODE-configurable burst order, and IEEE 1149.1 JTAG-making it optimal for next-generation telecom and industrial gateways demanding both performance and testability.
Availability
CY7C1472BV25-200AXCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and FPGA co-processor cache applications requiring stable component supply across multi-year production cycles.
Supply support for CY7C1472BV25-200AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.
CY7C1472BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-latency, burst-capable memory subsystems in high-speed networking and telecom infrastructure equipment.
FAQ
What is the function of the MODE pin on CY7C1472BV25-200AXCT?
The MODE pin selects burst addressing order: pulled HIGH for interleaved burst (default when floating), pulled LOW for linear burst. It must remain static during operation and is sampled only at power-up or reset. This setting determines how the internal address counter increments during burst sequences-matching host processor expectations without software overhead.
Does CY7C1472BV25-200AXCT support partial writes without read-modify-write cycles?
Yes-via BWa and BWb pins, which enable independent write masking for two 18-bit data groups (DQa/DQPa and DQb/DQPb). When WE is active and a BW signal is LOW, only its associated data group is updated. This eliminates need for external read-modify-write logic and reduces bus bandwidth usage by up to 50% in protocol header manipulation.
How does the ZZ Sleep Mode affect data retention and wake-up timing?
In ZZ Sleep Mode (ZZ pin LOW), core power drops to <120 µA while retaining full memory contents. Wake-up occurs synchronously on the next valid CLK edge after ZZ returns HIGH, with no additional latency beyond standard access timing. Data integrity is guaranteed across temperature and voltage ranges per datasheet specifications.
Can CY7C1472BV25-200AXCT be used in place of ZBT™ SRAMs without redesign?
Yes-it is pin-compatible and functionally equivalent to ZBT™ devices (e.g., IDT72V2115), sharing identical pinout, timing model, and control protocol. No PCB or firmware changes are needed; however, MODE and ZZ pins are unused in ZBT™ designs and may be tied off per application requirements.
CY7C1472BV25-200AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1472BV25-200AXCT FAQ
1.How can I place an order for CY7C1472BV25-200AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1472BV25-200AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1472BV25-200AXCT reliable?
The price and inventory of CY7C1472BV25-200AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1472BV25-200AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1472BV25-200AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1472BV25-200AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1472BV25-200AXCT?
CY7C1472BV25-200AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1472BV25-200AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1472BV25-200AXCT?
For technical support, including CY7C1472BV25-200AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1472BV25-200AXCT requirements.
6.How does Aetrix verify that CY7C1472BV25-200AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1472BV25-200AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1472BV25-200AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1472BV25-200AXCT?
All CY7C1472BV25-200AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1472BV25-200AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1472BV25-200AXCT part is unused and in its original packaging.
Return procedure for CY7C1472BV25-200AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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