Infineon Technologies CY7C1472BV33-167BZCT

Overview

CY7C1472BV33-167BZCT from Cypress Semiconductor is a 3.3 V, 4M × 18 (72-Mbit) synchronous pipelined SRAM with NoBL™ architecture, supporting zero-wait-state 167 MHz bus operation, fully registered I/O, and byte-write capability for high-throughput memory buffering in network packet processors and telecom line cards.

For engineers reviewing the CY7C1472BV33-167BZCT datasheet, CY7C1472BV33-167BZCT pinout, CY7C1472BV33-167BZCT application, or CY7C1472BV33-167BZCT equivalent, key selection factors include its 165-ball FBGA package, synchronous self-timed writes, burst linear/interleaved addressing, and JTAG boundary-scan compliance for system-level testability.

Technical Context

The device implements a fully synchronous, clocked interface with all inputs and outputs registered on the rising edge of CLK, qualified by CEN. It uses internal address counters and burst logic to enable back-to-back read/write operations without latency cycles.

NoBL™ architecture eliminates bus turnaround delay by decoupling output timing from asynchronous OE control-output buffer timing is internally self-timed, and tri-state control is synchronized to avoid bus contention during write data phases.

Key Specifications

Pinout & Package

Package: 165-ball FBGA (15 × 17 × 1.4 mm), RoHS-compliant, ball pitch 1.0 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IDT72V2115L16PF and IS61WV102418BLL-167TQLI, CY7C1472BV33-167BZCT uniquely delivers JTAG testability, ZZ Sleep Mode, and true NoBL™ zero-latency pipelining-critical for telecom and high-reliability embedded systems requiring both performance and production test coverage.

Availability

CY7C1472BV33-167BZCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, DSP algorithm scratchpad, and industrial motion controller buffer applications requiring stable component supply across extended product lifecycles.

Supply support for CY7C1472BV33-167BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets.

CY7C1472BV33 belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput buffering in packet-switched and real-time control systems demanding deterministic timing and JTAG testability.

FAQ

What is the function of the ADV/LD pin in CY7C1472BV33-167BZCT?

The ADV/LD pin controls the internal burst address counter: when HIGH and CEN is active, it advances the counter for sequential burst accesses; when LOW, it loads a new base address from A[17:0]. This dual-mode operation enables both linear streaming and random-access initiation without external address sequencing logic.

Does CY7C1472BV33-167BZCT support 2.5 V I/O signaling?

Yes-its VDDQ supply accepts 2.5 V ±0.2 V, allowing direct interface with 2.5 V logic families while maintaining full 167 MHz operation. The core VDD remains fixed at 3.3 V ±0.3 V, and VDDQ and VDD must be powered in sequence per datasheet recommendations to ensure proper I/O voltage translation.

How does the ZZ Sleep Mode reduce power consumption?

Asserting the ZZ pin places the device into low-power sleep mode, reducing CMOS standby current to ≤120 mA while retaining all stored data. Unlike conventional standby, ZZ mode disables internal clocks and precharge circuits without requiring external reset or initialization upon wake-up-data integrity is preserved across sleep cycles.

Can CY7C1472BV33-167BZCT be used in place of CY7C1470BV33-167BZI?

No-though pin-compatible in 100-pin TQFP, CY7C1472BV33-167BZCT is packaged in 165-ball FBGA and configured for 4M × 18 (not 2M × 36). Its BWa/BWb mapping, DQ/DQP pin assignments, and internal address decoding differ; substitution requires PCB layout and firmware address logic changes.