Infineon Technologies CY7C1472V25-200AXCT

Overview

CY7C1472V25-200AXCT from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36-bit, operating at 200 MHz with zero wait states. It features fully registered inputs/outputs, 2.5 V core and I/O supply (VDD/VDDQ), 3.0 ns clock-to-output delay, and byte-write capability via BWa–BWb pins. It is used in high-throughput network packet buffering and FPGA co-processor memory interfaces.

For engineers reviewing the CY7C1472V25-200AXCT datasheet, CY7C1472V25-200AXCT pinout, CY7C1472V25-200AXCT application, or CY7C1472V25-200AXCT equivalent, key selection criteria include burst mode support (linear/interleaved), ZZ sleep mode control, JTAG boundary scan compliance, and TQFP-100 package compatibility for board-level timing-critical designs.

Technical Context

This SRAM implements a synchronous, clocked pipeline architecture where all address, control, and data signals are registered on the rising edge of CLK. Internal self-timed output buffer control eliminates asynchronous OE dependency, and write operations use on-chip synchronous self-timed circuitry with byte-select granularity.

The device supports three chip enables (CE1, CE2, CE3) for bank isolation and includes ADV/LD for burst address generation, MODE for burst order selection (linear/interleaved), and CEN for clock suspension. The ZZ pin enables low-power sleep mode, requiring external grounding per errata on page 36.

Key Specifications

Pinout & Package

Package: JEDEC-standard Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body height, with exposed pad not specified in datasheet.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with IDT72V2115L10PF and IS61WV102436B, CY7C1472V25-200AXCT delivers 2× higher bandwidth, integrated burst control, and power-managed sleep mode - making it optimal for next-generation telecom and real-time embedded systems demanding deterministic latency and energy efficiency.

Availability

CY7C1472V25-200AXCT is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, and telecom baseband processing requiring stable component supply, long-term lifecycle support, and Pb-free compliance.

Supply support for CY7C1472V25-200AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, including NoBL™ SRAMs, for industrial, automotive, and communications markets.

CY7C1472V25 belongs to the NoBL™ Pipelined SRAM product line, designed specifically for applications demanding sustained high-bandwidth, zero-latency memory access in FPGA-, ASIC-, and network processor-based systems.

FAQ

What is the function of the MODE pin on CY7C1472V25-200AXCT?

The MODE pin selects burst address order: logic high enables linear burst, logic low enables interleaved burst. This directly affects how consecutive addresses increment during burst transfers-critical for optimizing cache-line alignment in processors or FFT memory access patterns in DSPs. The setting is sampled on the rising edge of CLK during burst initiation and remains latched until next burst command.

Why must the ZZ pin be externally grounded?

Per Errata on page 36 of datasheet 38-05290 Rev. *V, the ZZ pin (Pin 64 in TQFP) requires external grounding to reliably enter deep sleep mode. Leaving it floating or pulling high causes inconsistent sleep activation and increased standby current. This is a silicon-level behavioral requirement-not a recommendation-and applies to all production lots of CY7C1472V25-200AXCT.

Does CY7C1472V25-200AXCT support JTAG boundary scan in-system?

Yes, it implements IEEE 1149.1 JTAG boundary scan with TCK, TMS, TDI, TDO, and TRST pins. Scan functionality is active when TMS is held high for five TCK cycles to reset the TAP controller. Boundary scan supports interconnect testing of solder joints and routing integrity on dense PCBs without physical probe access.

How does the ADV/LD pin affect burst operation?

ADV/LD controls burst address generation: when asserted (high), it advances the internal burst counter; when deasserted (low), it loads a new starting address from A0–A19. This dual-mode operation allows seamless switching between sequential bursts and random-address bursts within the same clock domain, essential for dynamic memory allocation in real-time OS kernels or packet classification engines.