Infineon Technologies CY7C1472V33-167AXI
- Part No.:
- CY7C1472V33-167AXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1472V33-167AXI.pdf
- Description:
- IC SRAM 72MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1472V33 from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36 or 4M × 18, operating at 167 MHz with zero wait states. It features fully registered I/O, byte write capability (BWa–BWb), single 3.3 V core supply, and 3.3 V/2.5 V I/O compatibility. Used in high-throughput packet buffering for network line cards.
For engineers reviewing the CY7C1472V33 datasheet, CY7C1472V33 pinout, CY7C1472V33 application, or CY7C1472V33 equivalent, key selection criteria include burst mode support (linear/interleaved), ZZ sleep mode implementation, clock-to-output timing (3.4 ns), and JEDEC-standard 100-pin TQFP package compatibility with ZBT-family designs.
Technical Context
The device implements synchronous pipelined operation using rising-edge clock-triggered input and output registers, enabling true back-to-back read/write cycles without bus latency. Its NoBL™ logic eliminates asynchronous OE dependency via internally self-timed output buffer control.
Burst addressing supports both linear and interleaved orders, controlled by the MODE pin. Write operations are synchronous and self-timed, with byte write selects (BWa, BWb) enabling granular 18-bit word writes in 4M × 18 mode or 36-bit writes in 2M × 36 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 or 4M × 18 configuration) |
| Max Clock Frequency | 167 MHz - enables sustained 167 MT/s throughput with no wait states |
| Access Time | 3.4 ns - defines minimum clock-to-output delay for timing closure |
| Supply Voltage | 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system interfacing |
| Byte Write Pins | BWa, BWb - enable independent 18-bit write masking in 4M × 18 mode |
| Sleep Mode | ZZ pin - reduces standby current to ≤120 mA while preserving data |
| JTAG Support | IEEE 1149.1 compliant - enables boundary scan testing in production and debug |
Pinout & Package
Package: JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm), RoHS-compliant, surface-mount.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting 2M-word depth in 36-bit mode |
| DQa–DQb | Data I/O (36-bit) | Two 18-bit bidirectional data groups; DQa = bits [17:0], DQb = bits [35:18] |
| BWa, BWb | Byte Write Enables | Individually gate 18-bit portions of write data in 4M × 18 mode |
| CLK, CEN | System Clock & Enable | CEN deassertion suspends clock domain, extending previous cycle for power gating |
| CE1–CE3, OE | Chip & Output Enables | Three synchronous CE inputs + asynchronous OE allow flexible bank decoding and tristate control |
| ZZ | Deep Sleep Control | Must be externally tied to GND per errata (Page 35); activates low-power retention mode |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables consecutive read/write transfers on every clock edge - eliminates pipeline stalls in burst-intensive traffic |
| Zero Wait State Operation | Supports full 167 MHz bus utilization without external wait-state insertion logic |
| Configurable Burst Order | MODE pin selects linear or interleaved burst addressing - matches CPU or ASIC memory controller requirements |
| Synchronous Self-Timed Writes | On-chip write timing eliminates need for external write pulse generation or handshake signals |
| IEEE 1149.1 JTAG | Full boundary-scan support enables automated PCB test and interconnect verification |
Applications
| Network Packet Buffering | Baseband Signal Processing |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM serving as first-level packet memory with deterministic access timing. Use Value: 167 MT/s sustained throughput and zero-wait-state operation prevent frame loss under line-rate traffic. | Use Scenario: Temporary storage of FFT outputs and channel estimation data in LTE/5G baseband FPGAs. IC Role / Device Role / Timing Role: Synchronous burst-capable memory interfaced directly to FPGA DDR interfaces for real-time signal buffering. Use Value: Fully registered I/O and 3.4 ns clock-to-output meet tight setup/hold margins of high-speed FPGA fabric. |
| Industrial PLC Data Logging | Avionics Sensor Fusion Buffer |
Use Scenario: Capturing time-stamped I/O snapshots from distributed fieldbus nodes in deterministic automation cycles. IC Role / Device Role / Timing Role: Reliable, non-refreshing SRAM acting as cyclic data ring buffer with guaranteed write atomicity per 18-bit byte. Use Value: Byte write capability (BWa/BWb) allows partial updates without read-modify-write overhead, reducing CPU load. | Use Scenario: Aggregating synchronized inertial measurement unit (IMU) and GPS timestamps prior to Kalman filter execution. IC Role / Device Role / Timing Role: Low-jitter, radiation-tolerant memory buffer ensuring temporal coherence across multi-sensor streams. Use Value: ZZ sleep mode (with GND tie) maintains data integrity during periodic sensor idle intervals while minimizing power draw. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L16PF | Same 2M × 36 density and 167 MHz speed, but uses 165-ball FBGA; lacks ZZ sleep mode | Preferred where board space permits FBGA and deep sleep is unnecessary | Select when footprint flexibility exists and JTAG boundary scan is not required |
| CY7C1470V33-167AXI | Identical architecture and pinout, but supports 2M × 36 only (no 4M × 18 mode); same TQFP package | Used where memory width is fixed and burst order is not configurable | Choose for simplified design when 4M × 18 mode and MODE pin functionality are unused |
Compared with IDT72V2115L16PF and CY7C1470V33-167AXI, the CY7C1472V33 uniquely supports dual memory configurations (2M × 36 / 4M × 18) and includes ZZ sleep mode with documented GND tie requirement - critical for power-constrained embedded systems requiring data retention during idle periods.
Availability
CY7C1472V33 is available at Aetrix Electronics and suitable for network switching infrastructure, baseband processing units, industrial PLCs, and avionics sensor hubs requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1472V33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-performance memory solutions.
This device belongs to Infineon's legacy Cypress NoBL™ SRAM product line, engineered for deterministic, high-bandwidth data buffering in telecom infrastructure and real-time embedded systems where bus latency must be eliminated.
FAQ
What is the required connection for the ZZ pin on CY7C1472V33?
The ZZ pin (Pin 64) must be externally connected to ground, as specified in the datasheet errata (Page 35). This connection activates the deep sleep mode, reducing standby current to ≤120 mA while retaining memory contents. Leaving ZZ floating or pulling high disables sleep functionality and may cause undefined behavior.
Does CY7C1472V33 support both linear and interleaved burst modes?
Yes - burst addressing order is selected by the MODE pin: logic high enables interleaved burst, logic low selects linear burst. This matches standard CPU and ASIC memory controller protocols and is validated in the Interleaved Burst Address Table and Linear Burst Address Table (Pages 11–12 of datasheet Rev. *Y).
How many byte write enable signals does CY7C1472V33 provide?
CY7C1472V33 provides two byte write enable signals: BWa and BWb. In 4M × 18 mode, they control independent 18-bit write masks; in 2M × 36 mode, they jointly enable full 36-bit writes. This differs from CY7C1474V33 (eight BW pins) and CY7C1470V33 (four BW pins).
Is CY7C1472V33 pin-compatible with ZBT SRAMs?
Yes - the datasheet explicitly states it is pin compatible and functionally equivalent to ZBT devices. This includes identical pin functions for CLK, CEN, CE1–CE3, WE, OE, ADV/LD, and DQ buses, allowing drop-in replacement in existing ZBT-based designs without layout changes.
CY7C1472V33-167AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1472V33-167AXI FAQ
1.How can I place an order for CY7C1472V33-167AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1472V33-167AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1472V33-167AXI reliable?
The price and inventory of CY7C1472V33-167AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1472V33-167AXI is usually 5 days.
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5.How can I obtain technical support or documentation for CY7C1472V33-167AXI?
For technical support, including CY7C1472V33-167AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1472V33-167AXI requirements.
6.How does Aetrix verify that CY7C1472V33-167AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1472V33-167AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1472V33-167AXI meets industry standards.
7.What is the process for return or replacement of CY7C1472V33-167AXI?
All CY7C1472V33-167AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1472V33-167AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1472V33-167AXI part is unused and in its original packaging.
Return procedure for CY7C1472V33-167AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1472V33-167AXI Tags

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