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Infineon Technologies CY7C1472V33-200AXC

Part No.:
CY7C1472V33-200AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1472V33-200AXC.pdf
Description:
IC SRAM 72MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,031

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Product details

Overview

CY7C1472V33 from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36 or 4M × 18, operating at 200 MHz with zero wait states, 3.0 ns clock-to-output delay, and single 3.3 V core supply - used in high-throughput network packet buffering and FPGA co-processor data staging.

For engineers reviewing the CY7C1472V33 datasheet, CY7C1472V33 pinout, CY7C1472V33 application, or CY7C1472V33 equivalent, key selection criteria include burst mode support (linear/interleaved), byte write capability (BWa–BWb), synchronous self-timed writes, JTAG boundary scan compliance, and TQFP-100 package compatibility with ZBT pinouts.

Technical Context

This SRAM implements fully registered pipelined operation: all address, control, and data signals are synchronized to the rising edge of CLK; output registers ensure deterministic timing, eliminating asynchronous OE dependency. The NoBL™ logic enables true back-to-back read/write cycles without bus latency.

It supports three chip enables (CE1/CE2/CE3) for bank selection, burst addressing via ADV/LD, and dual I/O voltage support (3.3 V core / 2.5 V or 3.3 V I/O). Sleep mode is controlled by the ZZ pin (Pin 64), which must be externally grounded per errata.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density72 Mbit (2M × 36 or 4M × 18 configuration)
Max Clock Frequency200 MHz - enables sustained 200 MT/s throughput with no wait states
Access Time3.0 ns - guaranteed clock-to-output delay for timing-critical pipeline stages
Supply Voltage3.3 V ±0.3 V core; 3.3 V/2.5 V selectable I/O - supports mixed-voltage system interfacing
Byte Write PinsBWa, BWb - enable independent 18-bit word writes in 2M × 36 mode
JTAG SupportIEEE 1149.1 compliant - enables production test and board-level debug without external logic
Sleep ControlZZ pin (Pin 64) - reduces standby current to <120 mA when asserted (requires external ground tie)

Pinout & Package

Package: JEDEC-standard Pb-free 100-pin Thin Quad Flat Package (TQFP), 14 mm × 20 mm × 1.4 mm body, 0.5 mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
CLKPrimary synchronous clock inputDrives all internal registers; qualified by CEN; rising-edge triggered
CENClock enableWhen low, suspends clock domain operation and holds previous state
CE1, CE2, CE3Chip enable inputsThree-level decode for multi-bank memory mapping; all must be active for access
WEWrite enableActive-low control for synchronous write initiation; gated with BW pins
BWa, BWbByte write selectsSelect 18-bit subwords in 2M × 36 mode; enable partial writes without read-modify-write
ADV/LDAddress valid/loadControls burst address generation - advances on each clock when asserted
ZZDeep sleep controlAsynchronous active-low sleep entry; Pin 64 requires external ground connection per errata
DQa–DQdData I/O busesFour 18-bit bidirectional data groups (72-bit total); support source-synchronous reads/writes
DQPa–DQPdData parity outputsParity bits for DQa–DQd respectively; enabled only when MODE = high

Key Features

FeatureDesign Value
NoBL™ pipelined architectureEnables unlimited back-to-back read/write operations with zero cycle latency between transfers
Synchronous self-timed writesEliminates external write pulse timing constraints; internal logic manages write duration and data coherency
Linear or interleaved burst orderConfigurable via MODE pin to match processor or DMA controller addressing patterns
IEEE 1149.1 JTAG boundary scanSupports automated PCB test and interconnect verification without additional test fixtures
3.3 V core / 2.5 V or 3.3 V I/OAllows direct interface to both legacy 3.3 V and low-power 2.5 V logic families

Applications

Network Packet BufferingFPGA Co-Processor Staging

Use Scenario: Temporary storage of variable-length Ethernet frames in Layer 2/3 switches before classification and forwarding.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer with deterministic 3.0 ns read response.

Use Value: Enables line-rate 10 Gbps switching by sustaining 200 MT/s burst reads/writes without pipeline stalls.

Use Scenario: Intermediary data exchange between FPGA fabric and external microcontroller during real-time signal processing.

IC Role / Device Role / Timing Role: Synchronous pipelined memory bridging mismatched clock domains (e.g., 200 MHz SRAM vs. 100 MHz ARM interface).

Use Value: Eliminates handshake logic and wait states, reducing FPGA resource usage and improving throughput predictability.

Baseband Digital Signal ProcessingIndustrial Motion Controller Look-Up Tables

Use Scenario: Storing FFT coefficients and intermediate results in wireless baseband processors for LTE/5G PHY layer.

IC Role / Device Role / Timing Role: Burst-capable SRAM supporting interleaved addressing for parallel butterfly operations.

Use Value: Matches DSP burst access patterns, achieving >95% bus utilization versus ~70% with asynchronous SRAM.

Use Scenario: Hosting real-time position interpolation tables and PID gain schedules in servo drive firmware.

IC Role / Device Role / Timing Role: Deterministic-access memory providing jitter-free lookup for 20 kHz PWM update cycles.

Use Value: Guarantees sub-5 ns address-to-data timing, preventing motion control loop instability under load variation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT72V2115L10PF10 ns access time, 100 MHz max frequency, 36-bit bus only, no ZZ sleep modeLacks deep sleep and burst flexibility; suited for cost-sensitive non-real-time systemsSelect when 100 MHz bandwidth suffices and JTAG/testability is not required
ISSI IS61WV102432BLL-10TLI10 ns access, 100 MHz, 32-bit bus, asynchronous interface, no pipelining or burst logicRequires external wait-state generation; incompatible with NoBL™ zero-latency protocolsChoose only for legacy designs where synchronous burst capability is unnecessary

Compared with IDT72V2115L10PF and IS61WV102432BLL-10TLI, CY7C1472V33 delivers 2× higher throughput (200 vs. 100 MHz), deterministic pipelined timing, and integrated burst control - critical for real-time networking and signal processing where bus efficiency directly impacts system latency.

Availability

CY7C1472V33 is available at Aetrix Electronics and suitable for network switch buffering, FPGA co-processor staging, and baseband DSP applications requiring stable component supply, long-term lifecycle assurance, and Pb-free manufacturing compliance.

Supply support for CY7C1472V33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-performance memory solutions.

CY7C1472V33 belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for zero-latency, high-throughput data buffering in telecom infrastructure, test equipment, and real-time embedded systems.

FAQ

What is the required connection for the ZZ pin on CY7C1472V33?

The ZZ pin (Pin 64) must be externally connected to ground to enable proper deep sleep mode operation, as documented in the errata on page 35 of Rev. *Y datasheet. Leaving ZZ floating or pulling high disables sleep functionality and may cause excessive standby current.

Does CY7C1472V33 support 2.5 V I/O while operating on 3.3 V core?

Yes - the device features separate VDDQ (I/O) and VDD (core) supplies. VDDQ can be set to 2.5 V ±0.2 V while VDD remains at 3.3 V ±0.3 V, enabling direct interface to 2.5 V FPGAs or ASICs without level shifters.

How does burst addressing work with ADV/LD and MODE pins?

When ADV/LD is asserted, the internal burst counter increments on each CLK rising edge. MODE pin selects linear (MODE = low) or interleaved (MODE = high) address sequencing - matching Intel or Motorola bus protocols respectively - with no external address generation logic required.

Is CY7C1472V33 pin-compatible with standard ZBT SRAMs?

Yes - it is explicitly designed as pin-compatible and functionally equivalent to ZBT devices (e.g., IDT72V2115), sharing identical TQFP-100 footprint, signal naming, and timing behavior, allowing drop-in replacement in existing ZBT-based designs.

CY7C1472V33-200AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1472V33-200AXC FAQ

1.How can I place an order for CY7C1472V33-200AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1472V33-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1472V33-200AXC reliable?

The price and inventory of CY7C1472V33-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1472V33-200AXC is usually 5 days.

3.What payment methods are accepted for CY7C1472V33-200AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1472V33-200AXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1472V33-200AXC?

CY7C1472V33-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1472V33-200AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1472V33-200AXC?

For technical support, including CY7C1472V33-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1472V33-200AXC requirements.

6.How does Aetrix verify that CY7C1472V33-200AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1472V33-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1472V33-200AXC meets industry standards.

7.What is the process for return or replacement of CY7C1472V33-200AXC?

All CY7C1472V33-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1472V33-200AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1472V33-200AXC part is unused and in its original packaging.

Return procedure for CY7C1472V33-200AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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