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Infineon Technologies CY7C1472V33-200AXCT

Part No.:
CY7C1472V33-200AXCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1472V33-200AXCT.pdf
Description:
IC SRAM 72MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,341

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Product details

Overview

CY7C1472V33 from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 2M × 36 or 4M × 18, operating at 200 MHz with zero wait states. It features fully registered I/O, byte write capability (BWa–BWb), 3.3 V core supply, and 3.3 V/2.5 V I/O support. Used in high-throughput packet buffering and network switch fabric control planes where deterministic latency and back-to-back read/write transitions are critical.

For engineers reviewing the CY7C1472V33 datasheet, CY7C1472V33 pinout, CY7C1472V33 application, or CY7C1472V33 equivalent, key selection criteria include clock-to-output timing (3.0 ns), burst mode support (linear/interleaved), ZZ sleep mode implementation, and TQFP-100 package compatibility with legacy ZBT designs.

Technical Context

This SRAM implements a synchronous, fully registered pipeline: all address, control, and data signals pass through input registers on the rising CLK edge; outputs are latched on the same edge. Internal self-timed output buffer control eliminates asynchronous OE dependency, enabling deterministic bus timing.

The device supports burst reads/writes with ADV/LD-controlled addressing and includes three chip enables (CE1–CE3) for bank selection, plus CEN for clock suspension. Byte write select logic (BWa/BWb) enables independent 18-bit word writes in 2M × 36 mode or 36-bit writes in 4M × 18 mode.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 or 4M × 18 configuration)
Max Clock Frequency 200 MHz - enables 200 million back-to-back operations per second without wait states
Access Time 3.0 ns - clock-to-output delay at 200 MHz, defining minimum read cycle time
Supply Voltage 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - supports mixed-voltage system interfacing
Byte Write Pins BWa, BWb - two independent 18-bit write enable controls for granular data updates
Sleep Mode ZZ pin - active-low deep power-down mode reducing standby current to ≤120 mA
JTAG Support IEEE 1149.1 compliant - enables boundary scan testing in production and field diagnostics

Pinout & Package

Package: 100-pin TQFP (14 × 20 × 1.4 mm), JEDEC-standard Pb-free, RoHS-compliant.

Pin Circuit Role Design Meaning
CLK Clock input Rising-edge-triggered master timing reference for all synchronous operations
CEN Clock enable Active-low signal that suspends internal clocking while preserving state
CE1, CE2, CE3 Chip enable inputs Three-level decode for multi-bank memory mapping and partial array activation
WE Write enable Active-low global write strobe synchronized with CLK and BW pins
BWa, BWb Byte write selects Independent 18-bit write masks for 2M × 36 mode; enable partial-word updates
ADV/LD Address valid/load Controls burst address generation: advances counter on read, loads new address on write
ZZ Deep power-down Active-low sleep control requiring external tie to GND per errata (Pin 64)
DQa–DQb Data I/O buses Two 18-bit bidirectional data ports supporting concurrent read/write in pipelined mode

Key Features

Feature Design Value
NoBL™ Architecture Enables true back-to-back read/write cycles with no bus latency - eliminates pipeline stalls in burst-intensive systems
Fully Registered I/O All inputs and outputs clocked on rising CLK edge - ensures precise setup/hold timing and simplifies PCB layout
Synchronous Self-Timed Writes On-chip write timing control removes external write pulse width constraints - improves reliability across voltage/temperature
Burst Capability Linear or interleaved burst order selectable via MODE pin - matches processor/cache burst patterns without glue logic
IEEE 1149.1 JTAG Full boundary scan support with TAP controller - enables automated test coverage and solder joint validation

Applications

Network Switch Fabric Buffering Telecom Line Card Control Memory

Use Scenario: Storing packet headers and forwarding tables in Layer 2/3 switches requiring sub-5 ns access and continuous burst throughput.

IC Role / Device Role / Timing Role: High-speed shared memory buffer interfaced to multiple ASICs via synchronous parallel bus with deterministic 3.0 ns clock-to-output timing.

Use Value: Enables 200 MHz sustained read/write bandwidth (1.44 GB/s in 36-bit mode), eliminating bottlenecks in 10G+ switching pipelines.

Use Scenario: Holding real-time signaling state and protocol stack variables in carrier-grade SDH/SONET line cards with strict jitter and latency budgets.

IC Role / Device Role / Timing Role: Synchronous control memory synchronized to system clock domain, using CEN and ZZ for dynamic power gating during idle intervals.

Use Value: Reduces active power to ≤500 mA and standby to ≤120 mA while maintaining zero-wait-state operation during traffic bursts.

Industrial PLC Data Logging Buffer Test Equipment Pattern Memory

Use Scenario: Capturing high-speed sensor streams and motion control feedback in programmable logic controllers with deterministic interrupt response.

IC Role / Device Role / Timing Role: Pipelined SRAM acting as dual-port-accessible FIFO between acquisition engine and CPU, using ADV/LD for burst address sequencing.

Use Value: Supports uninterrupted 200 MHz burst writes during analog capture, preventing data loss under worst-case interrupt latency conditions.

Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) where pattern depth and repeatability are critical.

IC Role / Device Role / Timing Role: Deterministic timing memory providing glitch-free vector delivery to DUT, leveraging fully registered I/O and synchronous self-timed writes.

Use Value: Guarantees 3.0 ns output validity window and eliminates metastability risk in high-speed digital pattern generation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L10PF 10 ns access time, 100 MHz max frequency, 36-bit × 512K depth (18 Mbit), LVDS I/O Limited to lower bandwidth systems; lacks ZZ sleep mode and burst flexibility Select when LVDS signaling and lower power at reduced speed are prioritized over 200 MHz throughput
ISSI IS61WV102432BLL-10TLI 10 ns access, 100 MHz, 32-bit × 1M (32 Mbit), single 3.3 V supply, no burst mode Non-pipelined architecture; no ADV/LD or burst capability; simpler interface but lower peak bandwidth Choose for cost-sensitive embedded control where zero-wait-state pipelining is unnecessary

Compared with IDT72V2115L10PF and IS61WV102432BLL-10TLI, CY7C1472V33 delivers 2× higher bandwidth, integrated burst control, and active power management - making it uniquely suited for infrastructure-grade packet processing where latency predictability and throughput density are non-negotiable.

Availability

CY7C1472V33 is available at Aetrix Electronics and suitable for network switch fabric buffering, telecom line card control memory, and industrial PLC data logging requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1472V33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains its high-performance memory portfolio, focusing on automotive, industrial, and communications infrastructure solutions.

CY7C1472V33 belongs to the NoBL™ SRAM product line, designed specifically for deterministic, low-latency memory subsystems in networking ASICs, baseband processors, and real-time control systems demanding zero-wait-state performance.

FAQ

What is the function of the ADV/LD pin on CY7C1472V33?

The ADV/LD pin controls burst address generation: during reads, it advances the internal address counter; during writes, it loads a new starting address. This dual-mode operation enables seamless linear or interleaved burst sequences without external address management logic, directly supporting processor cache-line fetch patterns.

How does the ZZ pin operate, and what is the errata requirement?

The ZZ pin places the device in deep power-down mode when asserted low. Per Errata on page 35 of Rev. *Y datasheet, Pin 64 (ZZ) must be externally tied to ground - it is not internally pulled down. Failure to do so may cause undefined sleep behavior or increased standby current beyond the rated 120 mA maximum.

Can CY7C1472V33 operate with 2.5 V I/O while using 3.3 V core supply?

Yes. The device supports independent VDDQ (I/O) supply ranging from 2.5 V to 3.3 V while VDD (core) remains fixed at 3.3 V ±0.3 V. This allows direct interfacing with 2.5 V FPGAs or ASICs without level shifters, provided VDDQ stability and noise margins meet AC timing requirements for setup/hold at 200 MHz.

Is CY7C1472V33 pin-compatible with ZBT SRAMs?

Yes - it is explicitly designed as pin-compatible and functionally equivalent to industry-standard ZBT SRAMs (e.g., IDT72V2115). This includes identical pin assignments for CLK, CEN, CE1–CE3, WE, BWa/BWb, DQa/DQb, and ADV/LD, enabling drop-in replacement in existing ZBT-based designs without PCB revision.

CY7C1472V33-200AXCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
4M x 18
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1472V33-200AXCT FAQ

1.How can I place an order for CY7C1472V33-200AXCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1472V33-200AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1472V33-200AXCT reliable?

The price and inventory of CY7C1472V33-200AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1472V33-200AXCT is usually 5 days.

3.What payment methods are accepted for CY7C1472V33-200AXCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1472V33-200AXCT transactions.

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CY7C1472V33-200AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1472V33-200AXCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1472V33-200AXCT?

For technical support, including CY7C1472V33-200AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1472V33-200AXCT requirements.

6.How does Aetrix verify that CY7C1472V33-200AXCT is sourced from the original manufacturer or authorized distributors?

All CY7C1472V33-200AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1472V33-200AXCT meets industry standards.

7.What is the process for return or replacement of CY7C1472V33-200AXCT?

All CY7C1472V33-200AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1472V33-200AXCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1472V33-200AXCT part is unused and in its original packaging.

Return procedure for CY7C1472V33-200AXCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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