Infineon Technologies CY7C1474BV25-167BGCT
- Part No.:
- CY7C1474BV25-167BGCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 209-BGA
- Datasheet:
-
CY7C1474BV25-167BGCT.pdf
- Description:
- IC SRAM 72MBIT PAR 209FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1474BV25-167BGCT from Cypress Semiconductor is a 72-Mbit (1M × 72) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 167 MHz with 3.4 ns maximum clock-to-output delay, supports synchronous self-timed writes, byte-write capability via eight BW inputs (BWSa–BWSh), and uses a single 2.5V core supply with separate 2.5V I/O supply (VDDQ).
For engineers reviewing the CY7C1474BV25-167BGCT datasheet, CY7C1474BV25-167BGCT pinout, CY7C1474BV25-167BGCT application, or CY7C1474BV25-167BGCT equivalent, key selection criteria include burst order configuration (linear/interleaved via MODE pin), JTAG boundary-scan support, 209-ball FBGA package compatibility, and zero-wait-state back-to-back read/write performance in depth-expanded memory systems.
Technical Context
This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. The internal NoBL™ logic eliminates bus latency by enabling true back-to-back reads and writes without wait states, using pipelined address and data paths.
Burst operation is controlled by ADV/LD and MODE pins-ADV/LD loads or advances the internal counter, while MODE selects linear or interleaved burst order. Write operations are qualified by WE and eight independent byte-write enables (BWSa–BWSh), each controlling one 9-bit data/parity pair (DQa/DQPa through DQh/DQPh), supporting partial-word writes without external masking logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (1,048,576 × 72 bits), enabling single-chip 9 MB data buffers for packet assembly/disassembly. |
| Maximum Clock Frequency | 167 MHz - supports sustained 167 MT/s throughput with no wait states in pipelined mode. |
| Access Time (tCO) | 3.4 ns - defines minimum clock-to-output delay for timing-critical read cycles in high-speed switch fabrics. |
| Supply Voltages | VDD = 2.5 V ±0.2 V (core), VDDQ = 2.5 V ±0.2 V (I/O) - ensures compatibility with 2.5V LVTTL and HSTL-18 interfaces. |
| Byte Write Inputs | 8 independent BWSa–BWSh signals - enable granular 9-bit write control per DQ/DQP pair, eliminating need for external byte-lane gating. |
| Burst Capability | Linear or interleaved 4-word burst - reduces address bus traffic and simplifies controller logic in streaming applications. |
| JTAG Support | IEEE 1149.1 compliant - enables boundary-scan testing of high-density FBGA interconnects without physical probe access. |
Pinout & Package
Package: 209-ball FBGA (14 mm × 22 mm × 1.76 mm, ball pitch 1.0 mm), Pb-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Input | Latched on rising CLK edge; selects one of 1M addresses (A0–A19 implied by 1M×72 config). |
| BWSa–BWSh | Synchronous Byte Write Select | Active-low per-byte controls for DQa/DQPa through DQh/DQPh; qualified by WE and CLK. |
| CLK | Primary Clock Input | Rising-edge-triggered master clock; gated by CEN to suspend operation without cycle termination. |
| CEN | Clock Enable | Active-low input that masks CLK; maintains internal state during power-aware clock gating. |
| DQa–DQh / DQPa–DQPh | Bidirectional Data I/O | 72 data + 8 parity lines; direction controlled by OE and internal read/write state; tri-stated during write data phase. |
| MODE | Burst Order Strap | Static input selecting linear (LOW) or interleaved (HIGH) burst sequence; must be stable during operation. |
| ADV/LD | Address Counter Control | HIGH advances internal burst counter; LOW loads new address from A[18:0]; required after deselect to reinitialize. |
| VDDQ | I/O Power Supply | Separate 2.5V rail for DQ/DQP drivers - isolates I/O noise from core logic and enables mixed-voltage system interfacing. |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables unlimited consecutive read/write operations with zero wait states - eliminates pipeline stalls in burst-intensive packet processing. |
| Fully Registered Interface | All inputs and outputs synchronized to CLK rising edge - simplifies timing closure in FPGA- or ASIC-based memory controllers. |
| Synchronous Self-Timed Writes | On-chip write timing logic eliminates external write pulse width constraints - removes need for precise WE assertion timing. |
| Eight Independent Byte-Write Enables | Supports 9-bit granularity writes across full 72-bit bus - avoids external multiplexers for partial-word updates in protocol header manipulation. |
| Configurable Burst Order | MODE pin selects linear or interleaved 4-word burst - matches legacy ZBT controller expectations or optimizes cache line alignment. |
| JTAG Boundary Scan | IEEE 1149.1 compliance with TDI/TDO/TCK/TMS - enables automated PCB test coverage for 209-ball FBGA solder joints. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with cut-through switching. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer between ingress and egress MACs. Use Value: 167 MHz zero-wait-state operation sustains 12 Gbps aggregate throughput across 72-bit bus, matching 10GbE line rates. |
Use Scenario: Temporary storage of ATM cells or SONET/SDH payloads in OC-192 line interface units. IC Role / Device Role / Timing Role: Depth-expanded memory bank providing deterministic 4-word burst access for cell header processing. Use Value: Synchronous self-timed writes eliminate external write strobe generation, reducing controller complexity in multi-ASIC designs. |
| Baseband Processing Buffer | High-Speed Test Equipment Memory |
|
Use Scenario: Intermediate storage of IQ samples between ADC/DAC and DSP in 4G/LTE radio units. IC Role / Device Role / Timing Role: Dual-port-capable buffer (via CE partitioning) supporting simultaneous capture and analysis streams. Use Value: Eight byte-write enables allow selective update of metadata fields within sample blocks without disturbing payload data. |
Use Scenario: Pattern memory in high-speed digital logic analyzers requiring deep, deterministic access timing. IC Role / Device Role / Timing Role: Deterministic-access memory subsystem with JTAG-testable interconnects for production validation. Use Value: 3.4 ns tCO and fully registered interface guarantee sub-6 ns setup/hold margins at 167 MHz, critical for pattern fidelity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1474BV25-250BGCT | Higher speed grade: 250 MHz max clock, 3.0 ns tCO vs. 3.4 ns. | Requires tighter PCB layout and stricter VDD/VDDQ decoupling; suitable only where 250 MT/s throughput is mandatory. | Select when system clock exceeds 167 MHz and board-level signal integrity supports 250 MHz timing margins. |
| AS7C36256P-167JC | Lower density (36 Mbit), 1M × 36 organization, no parity pins, non-NoBL architecture. | Lacks byte-write granularity and burst counter; requires external OE timing control and adds wait states in back-to-back access. | Consider only for cost-sensitive, lower-bandwidth applications where parity and zero-latency operation are not required. |
Compared with CY7C1474BV25-250BGCT, this 167 MHz variant trades 83 MHz bandwidth for relaxed timing margin and lower power (400 mA max operating current vs. 450 mA); versus AS7C36256P-167JC, it delivers double density, integrated parity, and true NoBL performance at higher pin count and FBGA complexity.
Availability
CY7C1474BV25-167BGCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for CY7C1474BV25-167BGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.
CY7C1474BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-wait-state, high-throughput buffering in networking and telecom infrastructure where deterministic latency and burst efficiency are critical.
FAQ
What is the function of the MODE pin, and can it be changed dynamically?
The MODE pin selects burst order: HIGH enables interleaved burst, LOW enables linear burst. It must remain static during device operation because changing MODE mid-burst violates timing assumptions in the internal counter logic and may cause address misalignment. Cypress specifies MODE as a strap pin-not a runtime control-and recommends tying it to VDD or GND via a pull-up/down resistor.
How does the CY7C1474BV25 handle simultaneous read and write operations?
It does not support true simultaneous read/write on the same port. As a single-port SRAM, it executes reads and writes sequentially in pipelined fashion: a write initiated on clock N completes before a read on clock N+1 begins. However, back-to-back operations (read→write or write→read) occur with zero wait states due to NoBL™ architecture, achieving effective 167 MT/s bidirectional throughput over time.
Is VDDQ required to be powered even during standby or sleep mode?
Yes. VDDQ must remain at 2.5 V whenever the device is powered, including ZZ Sleep Mode. The datasheet specifies that VDDQ supplies the output drivers and DQ/DQP I/O circuitry; removing VDDQ risks latch-up or undefined I/O states. Only VDD may be reduced during ZZ mode, but VDDQ must stay active to maintain I/O integrity and JTAG functionality.
Can the eight byte-write enables (BWSa–BWSh) be used independently of the WE signal?
No. All BWS signals are qualified by WE: only when WE is asserted LOW do the BWS inputs determine which 9-bit lanes are written. If WE is HIGH, no write occurs regardless of BWS states. This two-level qualification prevents accidental partial writes and ensures atomicity-consistent with ZBT™ compatibility requirements stated in the datasheet.
CY7C1474BV25-167BGCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 209-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 1M x 72
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 209-FBGA (14x22)
CY7C1474BV25-167BGCT FAQ
1.How can I place an order for CY7C1474BV25-167BGCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1474BV25-167BGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of CY7C1474BV25-167BGCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1474BV25-167BGCT is usually 5 days.
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Once your CY7C1474BV25-167BGCT order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for CY7C1474BV25-167BGCT?
For technical support, including CY7C1474BV25-167BGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1474BV25-167BGCT requirements.
6.How does Aetrix verify that CY7C1474BV25-167BGCT is sourced from the original manufacturer or authorized distributors?
All CY7C1474BV25-167BGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1474BV25-167BGCT meets industry standards.
7.What is the process for return or replacement of CY7C1474BV25-167BGCT?
All CY7C1474BV25-167BGCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1474BV25-167BGCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1474BV25-167BGCT part is unused and in its original packaging.
Return procedure for CY7C1474BV25-167BGCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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