Infineon Technologies CY7C1474BV25-200BGCT
- Part No.:
- CY7C1474BV25-200BGCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 209-BGA
- Datasheet:
-
CY7C1474BV25-200BGCT.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 209FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1474BV25-200BGCT from Cypress Semiconductor is a 72-Mbit (1M × 72) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 200 MHz with zero wait states, supports linear/interleaved burst modes, features 8-byte write select (BWa–BWh), and uses a single 2.5V core supply with separate 2.5V I/O supply (VDDQ).
For engineers reviewing the CY7C1474BV25-200BGCT datasheet, CY7C1474BV25-200BGCT pinout, CY7C1474BV25-200BGCT application, or CY7C1474BV25-200BGCT equivalent, this device delivers deterministic 3.0 ns clock-to-output timing, synchronous self-timed writes, JTAG boundary scan support, and 209-ball FBGA packaging optimized for high-density routing in backplane interface designs.
Technical Context
The CY7C1474BV25-200BGCT implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. Its NoBL™ logic eliminates bus latency by enabling true back-to-back read/write transitions without wait states.
Burst addressing is controlled by ADV/LD and MODE pins-ADV/LD loads or advances the internal counter, while MODE selects linear or interleaved burst order. Byte write capability is implemented via eight independent active-low BW signals (BWa–BWh), each controlling one 9-bit data/parity pair (DQx/DQP x), enabling granular 1–72-bit write operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (1,048,576 × 72 bits) - supports large packet buffering with full-width parallel access. |
| Max Clock Frequency | 200 MHz - enables 200 million synchronous transactions per second with pipelined throughput. |
| Access Time (tCO) | 3.0 ns - guaranteed clock-to-output delay ensures tight timing closure in 200 MHz system buses. |
| Supply Voltages | VDD = 2.5 V ± 0.2 V, VDDQ = 2.5 V ± 0.2 V - dual-rail I/O allows independent noise isolation for memory core and data bus. |
| Byte Write Capability | 8 independent BW inputs (BWa–BWh) - enables selective 9-bit writes to DQ/DQP pairs without read-modify-write overhead. |
| Burst Mode Support | Linear or interleaved burst order - selectable via MODE pin; critical for cache-line alignment in processor coherency protocols. |
| JTAG Compliance | IEEE 1149.1 boundary scan - enables in-system testability and interconnect verification in dense FBGA layouts. |
Pinout & Package
Package: 209-ball Fine-Pitch Ball Grid Array (FBGA), 14 mm × 22 mm × 1.76 mm body, RoHS-compliant (Pb-free and non-Pb-free options available).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Input | Latched on rising CLK edge; selects one of 1M addresses (A0–A19 implied by 1M × 72 configuration). |
| BWa–BWh | Synchronous Byte Write Select | Active-low controls write enable for corresponding 9-bit DQ/DQP pair (e.g., BWa → DQa/DQPa). |
| CLK | Primary Clock Input | Rising-edge-triggered master clock; qualified by CEN - no internal state change when CEN = HIGH. |
| CEN | Clock Enable | Active-low; suspends clock recognition without deselecting device - extends previous cycle for power gating or timing margin. |
| CE1, CE3 | Synchronous Chip Enable | Active-low; CE2 is active-high - three-signal encoding enables flexible bank selection in multi-SRAM systems. |
| OE | Asynchronous Output Enable | Active-low; tri-states outputs during write cycles regardless of OE state - prevents bus contention. |
| DQa–DQh / DQPa–DQPh | Bidirectional Data I/O | 72 data + 8 parity lines; direction controlled by OE and internal logic; automatically tri-stated during write data phase. |
| MODE | Burst Order Configuration | Strap pin: HIGH = interleaved burst, LOW = linear burst; must remain static during operation. |
| ZZ | Deep Sleep Control | Active-low; reduces standby current to ≤120 mA - used for dynamic power management in idle periods. |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ (NoBL™) Architecture | Enables unlimited back-to-back reads/writes with zero wait states - eliminates pipeline stalls in burst-intensive traffic flows. |
| Fully Registered Pipelined Interface | All inputs and outputs synchronized to CLK rising edge - simplifies timing analysis and PCB layout for >200 MHz operation. |
| Synchronous Self-Timed Writes | On-chip write timing control eliminates external write pulse width constraints - removes need for precise WE assertion timing. |
| Separate VDDQ Supply | Isolates I/O power domain from core logic - reduces switching noise coupling into memory array and improves signal integrity. |
| IEEE 1149.1 JTAG Boundary Scan | Supports automated PCB test and interconnect validation - essential for high-reliability telecom and networking hardware. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing variable-length Ethernet frames in ingress/egress queues of 10G/40G switch ASICs. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to SerDes MAC controllers. Use Value: 200 MHz pipelined operation sustains 14.4 GB/s aggregate bandwidth (72-bit × 200 MHz), eliminating frame drop under bursty traffic. |
Use Scenario: Frame reassembly and header processing in OC-192/STM-64 SONET/SDH line cards. IC Role / Device Role / Timing Role: Dual-port accessible memory for time-division multiplexing (TDM) crosspoint buffers with parity protection. Use Value: 8-byte write select and integrated parity (DQx/DQP x) enable error-resilient, sub-word updates without full-line overwrites. |
| Baseband Processing Buffer | High-Speed Test Equipment Memory |
|
Use Scenario: Temporary storage of IQ samples between FPGA-based FFT engines and DACs in LTE/5G radio units. IC Role / Device Role / Timing Role: Synchronous burst memory aligned to FPGA clock domains with deterministic tCO ≤3.0 ns. Use Value: Linear/interleaved burst mode matches FFT output ordering, reducing DMA controller complexity and latency. |
Use Scenario: Pattern memory in automated test equipment (ATE) for high-speed digital IC validation. IC Role / Device Role / Timing Role: Deterministic-access memory for stimulus/response capture with JTAG-verifiable interconnect integrity. Use Value: IEEE 1149.1 boundary scan enables post-assembly verification of all 209-ball solder joints - critical for production test yield. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1474BV25-250BGCT | 250 MHz max frequency, 3.0 ns tCO - higher speed grade with identical pinout and feature set. | Requires tighter PCB timing margins; suitable only where system clock exceeds 200 MHz. | Select when sustained 250 MHz operation is required and board-level signal integrity supports it. |
| AS7C3256B-20JC | 256K × 16 async SRAM, 20 ns access, no pipelining or burst - fundamentally different architecture and interface. | Used in legacy microcontroller address/data bus interfaces; lacks NoBL, clocking, or byte-write capability. | Not a functional substitute - only considered if design abandons synchronous high-speed requirements entirely. |
Compared with CY7C1474BV25-250BGCT, the -200BGCT trades 50 MHz speed headroom for relaxed timing closure and lower power; versus AS7C3256B-20JC, it provides 28× higher bandwidth and deterministic pipelined behavior but requires clock-domain integration.
Availability
CY7C1474BV25-200BGCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for CY7C1474BV25-200BGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC, and connectivity solutions for industrial, automotive, and communications markets.
The CY7C1474BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-wait-state, high-throughput buffering in packet-switched infrastructure where deterministic latency and burst efficiency are critical.
FAQ
What is the function of the MODE pin on CY7C1474BV25-200BGCT?
The MODE pin selects burst order: pulled HIGH (or left floating) enables interleaved burst mode; pulled LOW enables linear burst mode. It must remain static during operation because changing MODE mid-burst causes undefined address sequencing. The pin is sampled only at power-up or reset, not dynamically.
How does the ZZ (Sleep) pin reduce power consumption?
Asserting ZZ LOW places the device in deep sleep mode, reducing CMOS standby current to ≤120 mA - identical to normal standby but with additional internal clock gating. Unlike CEN suspension, ZZ disables internal oscillators and memory array biasing, making it suitable for extended idle periods in power-constrained line cards.
Can CY7C1474BV25-200BGCT be used with a 3.3V I/O interface?
No. The device requires VDDQ = 2.5 V ± 0.2 V and has no 3.3V-tolerant I/O. Connecting to a 3.3V bus without level translation risks damage or unreliable operation. External 2.5V-compatible level shifters or matching 2.5V logic families (e.g., HSTL or SSTL_2) are mandatory for interface compliance.
What is the role of ADV/LD during burst read sequences?
ADV/LD controls the internal burst counter: when LOW at clock rise, it loads the address from A[18:0]; when HIGH, it advances the counter to the next burst address. For sequential burst reads, ADV/LD is held HIGH after initial load - no external address changes are needed, reducing bus overhead and timing complexity.
CY7C1474BV25-200BGCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 209-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 1M x 72
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 2.375V ~ 2.625V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 209-FBGA (14x22)
CY7C1474BV25-200BGCT FAQ
1.How can I place an order for CY7C1474BV25-200BGCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1474BV25-200BGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1474BV25-200BGCT reliable?
The price and inventory of CY7C1474BV25-200BGCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1474BV25-200BGCT is usually 5 days.
3.What payment methods are accepted for CY7C1474BV25-200BGCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1474BV25-200BGCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1474BV25-200BGCT?
CY7C1474BV25-200BGCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1474BV25-200BGCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1474BV25-200BGCT?
For technical support, including CY7C1474BV25-200BGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1474BV25-200BGCT requirements.
6.How does Aetrix verify that CY7C1474BV25-200BGCT is sourced from the original manufacturer or authorized distributors?
All CY7C1474BV25-200BGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1474BV25-200BGCT meets industry standards.
7.What is the process for return or replacement of CY7C1474BV25-200BGCT?
All CY7C1474BV25-200BGCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1474BV25-200BGCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1474BV25-200BGCT part is unused and in its original packaging.
Return procedure for CY7C1474BV25-200BGCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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