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Infineon Technologies CY7C1474BV25-200BGCT

Part No.:
CY7C1474BV25-200BGCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
209-BGA
Datasheet:
AetrixCY7C1474BV25-200BGCT.pdf
Description:
IC SRAM 72MBIT PARALLEL 209FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,403

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Product details

Overview

CY7C1474BV25-200BGCT from Cypress Semiconductor is a 72-Mbit (1M × 72) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory buffering in network packet processors and telecom line cards. It operates at 200 MHz with zero wait states, supports linear/interleaved burst modes, features 8-byte write select (BWa–BWh), and uses a single 2.5V core supply with separate 2.5V I/O supply (VDDQ).

For engineers reviewing the CY7C1474BV25-200BGCT datasheet, CY7C1474BV25-200BGCT pinout, CY7C1474BV25-200BGCT application, or CY7C1474BV25-200BGCT equivalent, this device delivers deterministic 3.0 ns clock-to-output timing, synchronous self-timed writes, JTAG boundary scan support, and 209-ball FBGA packaging optimized for high-density routing in backplane interface designs.

Technical Context

The CY7C1474BV25-200BGCT implements fully registered pipelined operation: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven from output registers synchronized to CLK. Its NoBL™ logic eliminates bus latency by enabling true back-to-back read/write transitions without wait states.

Burst addressing is controlled by ADV/LD and MODE pins-ADV/LD loads or advances the internal counter, while MODE selects linear or interleaved burst order. Byte write capability is implemented via eight independent active-low BW signals (BWa–BWh), each controlling one 9-bit data/parity pair (DQx/DQP x), enabling granular 1–72-bit write operations.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (1,048,576 × 72 bits) - supports large packet buffering with full-width parallel access.
Max Clock Frequency 200 MHz - enables 200 million synchronous transactions per second with pipelined throughput.
Access Time (tCO) 3.0 ns - guaranteed clock-to-output delay ensures tight timing closure in 200 MHz system buses.
Supply Voltages VDD = 2.5 V ± 0.2 V, VDDQ = 2.5 V ± 0.2 V - dual-rail I/O allows independent noise isolation for memory core and data bus.
Byte Write Capability 8 independent BW inputs (BWa–BWh) - enables selective 9-bit writes to DQ/DQP pairs without read-modify-write overhead.
Burst Mode Support Linear or interleaved burst order - selectable via MODE pin; critical for cache-line alignment in processor coherency protocols.
JTAG Compliance IEEE 1149.1 boundary scan - enables in-system testability and interconnect verification in dense FBGA layouts.

Pinout & Package

Package: 209-ball Fine-Pitch Ball Grid Array (FBGA), 14 mm × 22 mm × 1.76 mm body, RoHS-compliant (Pb-free and non-Pb-free options available).

Pin/Terminal Circuit Role Design Meaning
A0–A18 Synchronous Address Input Latched on rising CLK edge; selects one of 1M addresses (A0–A19 implied by 1M × 72 configuration).
BWa–BWh Synchronous Byte Write Select Active-low controls write enable for corresponding 9-bit DQ/DQP pair (e.g., BWa → DQa/DQPa).
CLK Primary Clock Input Rising-edge-triggered master clock; qualified by CEN - no internal state change when CEN = HIGH.
CEN Clock Enable Active-low; suspends clock recognition without deselecting device - extends previous cycle for power gating or timing margin.
CE1, CE3 Synchronous Chip Enable Active-low; CE2 is active-high - three-signal encoding enables flexible bank selection in multi-SRAM systems.
OE Asynchronous Output Enable Active-low; tri-states outputs during write cycles regardless of OE state - prevents bus contention.
DQa–DQh / DQPa–DQPh Bidirectional Data I/O 72 data + 8 parity lines; direction controlled by OE and internal logic; automatically tri-stated during write data phase.
MODE Burst Order Configuration Strap pin: HIGH = interleaved burst, LOW = linear burst; must remain static during operation.
ZZ Deep Sleep Control Active-low; reduces standby current to ≤120 mA - used for dynamic power management in idle periods.

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) Architecture Enables unlimited back-to-back reads/writes with zero wait states - eliminates pipeline stalls in burst-intensive traffic flows.
Fully Registered Pipelined Interface All inputs and outputs synchronized to CLK rising edge - simplifies timing analysis and PCB layout for >200 MHz operation.
Synchronous Self-Timed Writes On-chip write timing control eliminates external write pulse width constraints - removes need for precise WE assertion timing.
Separate VDDQ Supply Isolates I/O power domain from core logic - reduces switching noise coupling into memory array and improves signal integrity.
IEEE 1149.1 JTAG Boundary Scan Supports automated PCB test and interconnect validation - essential for high-reliability telecom and networking hardware.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing variable-length Ethernet frames in ingress/egress queues of 10G/40G switch ASICs.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer interfacing directly to SerDes MAC controllers.

Use Value: 200 MHz pipelined operation sustains 14.4 GB/s aggregate bandwidth (72-bit × 200 MHz), eliminating frame drop under bursty traffic.

Use Scenario: Frame reassembly and header processing in OC-192/STM-64 SONET/SDH line cards.

IC Role / Device Role / Timing Role: Dual-port accessible memory for time-division multiplexing (TDM) crosspoint buffers with parity protection.

Use Value: 8-byte write select and integrated parity (DQx/DQP x) enable error-resilient, sub-word updates without full-line overwrites.

Baseband Processing Buffer High-Speed Test Equipment Memory

Use Scenario: Temporary storage of IQ samples between FPGA-based FFT engines and DACs in LTE/5G radio units.

IC Role / Device Role / Timing Role: Synchronous burst memory aligned to FPGA clock domains with deterministic tCO ≤3.0 ns.

Use Value: Linear/interleaved burst mode matches FFT output ordering, reducing DMA controller complexity and latency.

Use Scenario: Pattern memory in automated test equipment (ATE) for high-speed digital IC validation.

IC Role / Device Role / Timing Role: Deterministic-access memory for stimulus/response capture with JTAG-verifiable interconnect integrity.

Use Value: IEEE 1149.1 boundary scan enables post-assembly verification of all 209-ball solder joints - critical for production test yield.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1474BV25-250BGCT 250 MHz max frequency, 3.0 ns tCO - higher speed grade with identical pinout and feature set. Requires tighter PCB timing margins; suitable only where system clock exceeds 200 MHz. Select when sustained 250 MHz operation is required and board-level signal integrity supports it.
AS7C3256B-20JC 256K × 16 async SRAM, 20 ns access, no pipelining or burst - fundamentally different architecture and interface. Used in legacy microcontroller address/data bus interfaces; lacks NoBL, clocking, or byte-write capability. Not a functional substitute - only considered if design abandons synchronous high-speed requirements entirely.

Compared with CY7C1474BV25-250BGCT, the -200BGCT trades 50 MHz speed headroom for relaxed timing closure and lower power; versus AS7C3256B-20JC, it provides 28× higher bandwidth and deterministic pipelined behavior but requires clock-domain integration.

Availability

CY7C1474BV25-200BGCT is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing buffers, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for CY7C1474BV25-200BGCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, PSoC, and connectivity solutions for industrial, automotive, and communications markets.

The CY7C1474BV25 belongs to Cypress's NoBL™ SRAM product line, engineered specifically for zero-wait-state, high-throughput buffering in packet-switched infrastructure where deterministic latency and burst efficiency are critical.

FAQ

What is the function of the MODE pin on CY7C1474BV25-200BGCT?

The MODE pin selects burst order: pulled HIGH (or left floating) enables interleaved burst mode; pulled LOW enables linear burst mode. It must remain static during operation because changing MODE mid-burst causes undefined address sequencing. The pin is sampled only at power-up or reset, not dynamically.

How does the ZZ (Sleep) pin reduce power consumption?

Asserting ZZ LOW places the device in deep sleep mode, reducing CMOS standby current to ≤120 mA - identical to normal standby but with additional internal clock gating. Unlike CEN suspension, ZZ disables internal oscillators and memory array biasing, making it suitable for extended idle periods in power-constrained line cards.

Can CY7C1474BV25-200BGCT be used with a 3.3V I/O interface?

No. The device requires VDDQ = 2.5 V ± 0.2 V and has no 3.3V-tolerant I/O. Connecting to a 3.3V bus without level translation risks damage or unreliable operation. External 2.5V-compatible level shifters or matching 2.5V logic families (e.g., HSTL or SSTL_2) are mandatory for interface compliance.

What is the role of ADV/LD during burst read sequences?

ADV/LD controls the internal burst counter: when LOW at clock rise, it loads the address from A[18:0]; when HIGH, it advances the counter to the next burst address. For sequential burst reads, ADV/LD is held HIGH after initial load - no external address changes are needed, reducing bus overhead and timing complexity.

CY7C1474BV25-200BGCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
209-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
1M x 72
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
209-FBGA (14x22)

CY7C1474BV25-200BGCT FAQ

1.How can I place an order for CY7C1474BV25-200BGCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1474BV25-200BGCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1474BV25-200BGCT reliable?

The price and inventory of CY7C1474BV25-200BGCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1474BV25-200BGCT is usually 5 days.

3.What payment methods are accepted for CY7C1474BV25-200BGCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1474BV25-200BGCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1474BV25-200BGCT?

CY7C1474BV25-200BGCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1474BV25-200BGCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1474BV25-200BGCT?

For technical support, including CY7C1474BV25-200BGCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1474BV25-200BGCT requirements.

6.How does Aetrix verify that CY7C1474BV25-200BGCT is sourced from the original manufacturer or authorized distributors?

All CY7C1474BV25-200BGCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1474BV25-200BGCT meets industry standards.

7.What is the process for return or replacement of CY7C1474BV25-200BGCT?

All CY7C1474BV25-200BGCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1474BV25-200BGCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1474BV25-200BGCT part is unused and in its original packaging.

Return procedure for CY7C1474BV25-200BGCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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