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Infineon Technologies CY7C1474BV33-200BGXC

Part No.:
CY7C1474BV33-200BGXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
209-BGA
Datasheet:
AetrixCY7C1474BV33-200BGXC.pdf
Description:
IC SRAM 72MBIT PARALLEL 209FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,810

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Product details

Overview

CY7C1474BV33-200BGXC from Cypress Semiconductor is a 72-Mbit (1M × 72) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 200 MHz with zero wait states, supports 3.3 V core and 3.3 V/2.5 V I/O supplies, and delivers 3.0 ns clock-to-output time. Its 209-ball FBGA package enables dense PCB layouts in bandwidth-constrained systems.

For engineers reviewing the CY7C1474BV33-200BGXC datasheet, CY7C1474BV33-200BGXC pinout, CY7C1474BV33-200BGXC application, or CY7C1474BV33-200BGXC equivalent, key selection criteria include burst mode support (linear/interleaved), byte-write granularity across eight 9-bit groups, JTAG boundary scan compliance, and synchronous self-timed write control - all critical for deterministic latency in packet buffering and header processing.

Technical Context

This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven through output registers synchronized to the same edge. The internal NoBL™ logic eliminates bus latency by enabling true back-to-back read/write operations without wait states.

It supports three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for flexible bank decoding, asynchronous OE for output tri-state control, and Clock Enable (CEN) to suspend clock recognition without deselecting the device. Byte write select pins BWa–BWh independently control eight 9-bit data groups, enabling precise partial writes without read-modify-write cycles.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (1M × 72 bits), enabling single-chip storage for full 72-bit wide data paths in switch fabric buffers.
Max Clock Frequency 200 MHz - supports sustained 200 MT/s throughput with no cycle penalty between consecutive accesses.
Access Time 3.0 ns clock-to-output - guarantees deterministic timing for real-time packet forwarding pipelines.
Supply Voltages 3.3 V core (VDD), 3.3 V or 2.5 V I/O (VDDQ) - allows interoperability with both LVTTL and SSTL-2 interfaces.
Byte Write Groups 8 independent 9-bit groups (BWa–BWh) - permits granular 1–9 byte writes without disturbing adjacent data.
Burst Capability Linear or interleaved burst order - matches standard memory controller addressing patterns for cache line fills.
JTAG Support IEEE 1149.1 compliant - enables in-system test and boundary scan verification without additional test fixtures.

Pinout & Package

Package: 209-ball FBGA (14 mm × 22 mm × 1.76 mm), RoHS-compliant, ball pitch 1.0 mm.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Synchronous Address Input 18-bit address bus sampled on rising CLK edge; selects one of 1M locations in 72-bit memory array.
BWa–BWh Synchronous Byte Write Select Eight active-low signals controlling 9-bit data groups (DQa/DQPa through DQh/DQPh); qualified with WE.
CLK Synchronous Clock Input Rising-edge-triggered master clock; gated by CEN; drives all input/output registers and internal timing.
CEN Clock Enable Active-low signal that masks CLK without deselecting device - extends previous cycle for timing margin.
CE1, CE2, CE3 Chip Enable Inputs Three-level decode (CE1/L, CE2/H, CE3/L) enables hierarchical memory banking and low-power deselection.
OE Asynchronous Output Enable Active-low; tri-states outputs during write sequences and deselected states to prevent bus contention.
DQa–DQh, DQPa–DQPh Bidirectional Data I/O 72-bit data bus (8 × 9-bit groups); direction controlled by OE and internal read/write state machine.
ZZ Deep Sleep Control Active-low input that places device in ultra-low-power sleep mode (<120 µA standby current).

Key Features

Feature Design Value
No Bus Latency™ Architecture Enables unlimited back-to-back reads/writes with zero wait states - eliminates pipeline stalls in high-speed packet processors.
Synchronous Self-Timed Writes On-chip write timing control ensures reliable data capture without external write pulse width constraints.
8-Group Byte Write Independent BWa–BWh control over eight 9-bit segments allows precise partial writes - avoids read-modify-write overhead.
Interleaved & Linear Burst Modes Hardware-selectable burst order matches industry-standard memory controller protocols for seamless integration.
JTAG Boundary Scan (IEEE 1149.1) Full pin-level test access without requiring dedicated test pads - reduces board test development time and cost.

Applications

Network Packet Buffering Telecom Line Card Memory

Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer memory interfacing directly with MAC and switching fabric logic.

Use Value: 200 MHz operation and zero-wait-state pipelining sustain 1.44 GB/s aggregate bandwidth across 72-bit bus - matching 10Gbps+ line rates.

Use Scenario: Frame assembly/disassembly and header modification in OC-192/STM-64 SONET/SDH line cards.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as shared memory between ingress/egress processing engines.

Use Value: Synchronous self-timed writes and burst modes reduce CPU overhead and enable deterministic jitter-free frame handling.

High-Speed Test Equipment Memory Industrial Real-Time Controller Cache

Use Scenario: Capturing high-frequency digital waveform samples in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: Primary acquisition memory with precise clock-aligned sampling and burst readout to host processor.

Use Value: 3.0 ns clock-to-output and fully registered interface ensure sub-nanosecond timing correlation between sample clock and data availability.

Use Scenario: Storing motion control trajectory tables and I/O status snapshots in CNC and robotics controllers.

IC Role / Device Role / Timing Role: Deterministic-access scratchpad memory for real-time firmware executing on dual-core industrial MCUs.

Use Value: ZZ sleep mode (<120 µA) and CEN-gated clocking enable rapid power-state transitions while preserving data integrity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1472BV33-200BAXI 4M × 18 organization (72 Mbit), 165-ball FBGA, only four byte-write groups (BWa–BWb). Optimized for 18-bit-wide data paths (e.g., legacy DSP buses); lower pin count but reduced write granularity. Select when system bus width is 18-bit and board space is constrained by 165-ball footprint.
AS7C3256B-20JC 32 Mbit (2M × 16), 55 ns async access, no pipelining or burst capability, SOJ-44 package. Suitable for non-real-time control memory where deterministic latency is not required. Choose only for cost-sensitive, low-bandwidth applications where 200 MHz throughput and zero-wait-state operation are unnecessary.

Compared with CY7C1472BV33-200BAXI, the CY7C1474BV33-200BGXC provides native 72-bit width and finer 9-bit byte-write control, eliminating external data masking logic. Against AS7C3256B-20JC, it delivers >10× higher effective bandwidth and deterministic timing - essential for packet-processing and real-time control.

Availability

CY7C1474BV33-200BGXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and industrial real-time controller cache requiring stable component supply across extended production lifecycles.

Supply support for CY7C1474BV33-200BGXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with emphasis on signal integrity and timing predictability.

CY7C1474BV33 belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput memory subsystems in packet-switched infrastructure and deterministic real-time control applications.

FAQ

What is the function of the ADV/LD pin in CY7C1474BV33-200BGXC?

The ADV/LD pin controls the internal address counter behavior: when HIGH and CEN is active, it advances the burst address counter; when LOW, it loads a new base address from A0–A17. This dual-mode operation enables both sequential burst access and random-address loading without external address generation logic.

Does CY7C1474BV33-200BGXC support 2.5 V I/O operation?

Yes - the VDDQ supply accepts 2.5 V ±0.2 V, allowing direct interface with 2.5 V logic families such as SSTL-2. Core VDD remains fixed at 3.3 V ±0.3 V. I/O voltage level must be set at power-up and cannot be dynamically switched during operation.

How does the ZZ (Sleep) mode affect data retention and wake-up time?

In ZZ mode, the device enters deep sleep with standby current ≤120 µA while retaining all stored data. Wake-up is synchronous: after ZZ is deasserted, the device requires one valid CLK cycle with CEN active before accepting new commands - no additional stabilization delay is needed.

Can CY7C1474BV33-200BGXC be used in linear burst mode with a 16-bit controller?

No - the device is strictly 72-bit wide (1M × 72). A 16-bit controller would require external multiplexing or data-width conversion logic, which defeats the purpose of its zero-wait-state architecture. It is intended for native 72-bit or compatible bus widths (e.g., 36-bit with two devices).

CY7C1474BV33-200BGXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
209-BGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
1M x 72
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
209-FBGA (14x22)

CY7C1474BV33-200BGXC FAQ

1.How can I place an order for CY7C1474BV33-200BGXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1474BV33-200BGXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1474BV33-200BGXC reliable?

The price and inventory of CY7C1474BV33-200BGXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1474BV33-200BGXC is usually 5 days.

3.What payment methods are accepted for CY7C1474BV33-200BGXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1474BV33-200BGXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1474BV33-200BGXC?

CY7C1474BV33-200BGXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1474BV33-200BGXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1474BV33-200BGXC?

For technical support, including CY7C1474BV33-200BGXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1474BV33-200BGXC requirements.

6.How does Aetrix verify that CY7C1474BV33-200BGXC is sourced from the original manufacturer or authorized distributors?

All CY7C1474BV33-200BGXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1474BV33-200BGXC meets industry standards.

7.What is the process for return or replacement of CY7C1474BV33-200BGXC?

All CY7C1474BV33-200BGXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1474BV33-200BGXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1474BV33-200BGXC part is unused and in its original packaging.

Return procedure for CY7C1474BV33-200BGXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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