Infineon Technologies CY7C1474BV33-200BGXC
- Part No.:
- CY7C1474BV33-200BGXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 209-BGA
- Datasheet:
-
CY7C1474BV33-200BGXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 209FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1474BV33-200BGXC from Cypress Semiconductor is a 72-Mbit (1M × 72) synchronous pipelined SRAM with NoBL™ architecture, designed for high-throughput memory subsystems in networking and telecom line cards. It operates at 200 MHz with zero wait states, supports 3.3 V core and 3.3 V/2.5 V I/O supplies, and delivers 3.0 ns clock-to-output time. Its 209-ball FBGA package enables dense PCB layouts in bandwidth-constrained systems.
For engineers reviewing the CY7C1474BV33-200BGXC datasheet, CY7C1474BV33-200BGXC pinout, CY7C1474BV33-200BGXC application, or CY7C1474BV33-200BGXC equivalent, key selection criteria include burst mode support (linear/interleaved), byte-write granularity across eight 9-bit groups, JTAG boundary scan compliance, and synchronous self-timed write control - all critical for deterministic latency in packet buffering and header processing.
Technical Context
This SRAM implements fully registered synchronous interfaces: all address, control, and data inputs are latched on the rising edge of CLK, and all outputs are driven through output registers synchronized to the same edge. The internal NoBL™ logic eliminates bus latency by enabling true back-to-back read/write operations without wait states.
It supports three chip enables (CE1 active-low, CE2 active-high, CE3 active-low) for flexible bank decoding, asynchronous OE for output tri-state control, and Clock Enable (CEN) to suspend clock recognition without deselecting the device. Byte write select pins BWa–BWh independently control eight 9-bit data groups, enabling precise partial writes without read-modify-write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (1M × 72 bits), enabling single-chip storage for full 72-bit wide data paths in switch fabric buffers. |
| Max Clock Frequency | 200 MHz - supports sustained 200 MT/s throughput with no cycle penalty between consecutive accesses. |
| Access Time | 3.0 ns clock-to-output - guarantees deterministic timing for real-time packet forwarding pipelines. |
| Supply Voltages | 3.3 V core (VDD), 3.3 V or 2.5 V I/O (VDDQ) - allows interoperability with both LVTTL and SSTL-2 interfaces. |
| Byte Write Groups | 8 independent 9-bit groups (BWa–BWh) - permits granular 1–9 byte writes without disturbing adjacent data. |
| Burst Capability | Linear or interleaved burst order - matches standard memory controller addressing patterns for cache line fills. |
| JTAG Support | IEEE 1149.1 compliant - enables in-system test and boundary scan verification without additional test fixtures. |
Pinout & Package
Package: 209-ball FBGA (14 mm × 22 mm × 1.76 mm), RoHS-compliant, ball pitch 1.0 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Synchronous Address Input | 18-bit address bus sampled on rising CLK edge; selects one of 1M locations in 72-bit memory array. |
| BWa–BWh | Synchronous Byte Write Select | Eight active-low signals controlling 9-bit data groups (DQa/DQPa through DQh/DQPh); qualified with WE. |
| CLK | Synchronous Clock Input | Rising-edge-triggered master clock; gated by CEN; drives all input/output registers and internal timing. |
| CEN | Clock Enable | Active-low signal that masks CLK without deselecting device - extends previous cycle for timing margin. |
| CE1, CE2, CE3 | Chip Enable Inputs | Three-level decode (CE1/L, CE2/H, CE3/L) enables hierarchical memory banking and low-power deselection. |
| OE | Asynchronous Output Enable | Active-low; tri-states outputs during write sequences and deselected states to prevent bus contention. |
| DQa–DQh, DQPa–DQPh | Bidirectional Data I/O | 72-bit data bus (8 × 9-bit groups); direction controlled by OE and internal read/write state machine. |
| ZZ | Deep Sleep Control | Active-low input that places device in ultra-low-power sleep mode (<120 µA standby current). |
Key Features
| Feature | Design Value |
|---|---|
| No Bus Latency™ Architecture | Enables unlimited back-to-back reads/writes with zero wait states - eliminates pipeline stalls in high-speed packet processors. |
| Synchronous Self-Timed Writes | On-chip write timing control ensures reliable data capture without external write pulse width constraints. |
| 8-Group Byte Write | Independent BWa–BWh control over eight 9-bit segments allows precise partial writes - avoids read-modify-write overhead. |
| Interleaved & Linear Burst Modes | Hardware-selectable burst order matches industry-standard memory controller protocols for seamless integration. |
| JTAG Boundary Scan (IEEE 1149.1) | Full pin-level test access without requiring dedicated test pads - reduces board test development time and cost. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches before forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer memory interfacing directly with MAC and switching fabric logic. Use Value: 200 MHz operation and zero-wait-state pipelining sustain 1.44 GB/s aggregate bandwidth across 72-bit bus - matching 10Gbps+ line rates. |
Use Scenario: Frame assembly/disassembly and header modification in OC-192/STM-64 SONET/SDH line cards. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as shared memory between ingress/egress processing engines. Use Value: Synchronous self-timed writes and burst modes reduce CPU overhead and enable deterministic jitter-free frame handling. |
| High-Speed Test Equipment Memory | Industrial Real-Time Controller Cache |
|
Use Scenario: Capturing high-frequency digital waveform samples in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Primary acquisition memory with precise clock-aligned sampling and burst readout to host processor. Use Value: 3.0 ns clock-to-output and fully registered interface ensure sub-nanosecond timing correlation between sample clock and data availability. |
Use Scenario: Storing motion control trajectory tables and I/O status snapshots in CNC and robotics controllers. IC Role / Device Role / Timing Role: Deterministic-access scratchpad memory for real-time firmware executing on dual-core industrial MCUs. Use Value: ZZ sleep mode (<120 µA) and CEN-gated clocking enable rapid power-state transitions while preserving data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1472BV33-200BAXI | 4M × 18 organization (72 Mbit), 165-ball FBGA, only four byte-write groups (BWa–BWb). | Optimized for 18-bit-wide data paths (e.g., legacy DSP buses); lower pin count but reduced write granularity. | Select when system bus width is 18-bit and board space is constrained by 165-ball footprint. |
| AS7C3256B-20JC | 32 Mbit (2M × 16), 55 ns async access, no pipelining or burst capability, SOJ-44 package. | Suitable for non-real-time control memory where deterministic latency is not required. | Choose only for cost-sensitive, low-bandwidth applications where 200 MHz throughput and zero-wait-state operation are unnecessary. |
Compared with CY7C1472BV33-200BAXI, the CY7C1474BV33-200BGXC provides native 72-bit width and finer 9-bit byte-write control, eliminating external data masking logic. Against AS7C3256B-20JC, it delivers >10× higher effective bandwidth and deterministic timing - essential for packet-processing and real-time control.
Availability
CY7C1474BV33-200BGXC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, high-speed test equipment memory, and industrial real-time controller cache requiring stable component supply across extended production lifecycles.
Supply support for CY7C1474BV33-200BGXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with emphasis on signal integrity and timing predictability.
CY7C1474BV33 belongs to the NoBL™ SRAM product line, engineered specifically for zero-latency, high-throughput memory subsystems in packet-switched infrastructure and deterministic real-time control applications.
FAQ
What is the function of the ADV/LD pin in CY7C1474BV33-200BGXC?
The ADV/LD pin controls the internal address counter behavior: when HIGH and CEN is active, it advances the burst address counter; when LOW, it loads a new base address from A0–A17. This dual-mode operation enables both sequential burst access and random-address loading without external address generation logic.
Does CY7C1474BV33-200BGXC support 2.5 V I/O operation?
Yes - the VDDQ supply accepts 2.5 V ±0.2 V, allowing direct interface with 2.5 V logic families such as SSTL-2. Core VDD remains fixed at 3.3 V ±0.3 V. I/O voltage level must be set at power-up and cannot be dynamically switched during operation.
How does the ZZ (Sleep) mode affect data retention and wake-up time?
In ZZ mode, the device enters deep sleep with standby current ≤120 µA while retaining all stored data. Wake-up is synchronous: after ZZ is deasserted, the device requires one valid CLK cycle with CEN active before accepting new commands - no additional stabilization delay is needed.
Can CY7C1474BV33-200BGXC be used in linear burst mode with a 16-bit controller?
No - the device is strictly 72-bit wide (1M × 72). A 16-bit controller would require external multiplexing or data-width conversion logic, which defeats the purpose of its zero-wait-state architecture. It is intended for native 72-bit or compatible bus widths (e.g., 36-bit with two devices).
CY7C1474BV33-200BGXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 209-BGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 1M x 72
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 209-FBGA (14x22)
CY7C1474BV33-200BGXC FAQ
1.How can I place an order for CY7C1474BV33-200BGXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1474BV33-200BGXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1474BV33-200BGXC reliable?
The price and inventory of CY7C1474BV33-200BGXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1474BV33-200BGXC is usually 5 days.
3.What payment methods are accepted for CY7C1474BV33-200BGXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1474BV33-200BGXC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1474BV33-200BGXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1474BV33-200BGXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1474BV33-200BGXC?
For technical support, including CY7C1474BV33-200BGXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1474BV33-200BGXC requirements.
6.How does Aetrix verify that CY7C1474BV33-200BGXC is sourced from the original manufacturer or authorized distributors?
All CY7C1474BV33-200BGXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1474BV33-200BGXC meets industry standards.
7.What is the process for return or replacement of CY7C1474BV33-200BGXC?
All CY7C1474BV33-200BGXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1474BV33-200BGXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1474BV33-200BGXC part is unused and in its original packaging.
Return procedure for CY7C1474BV33-200BGXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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