Infineon Technologies CY7C1474V25-200BGI

Overview

CY7C1474V25-200BGI from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 1M × 72, 2M × 36, or 4M × 18. It operates at 200 MHz with zero wait states, delivers 3.0 ns clock-to-output time, uses single 2.5 V core supply and separate 2.5 V I/O supply (VDDQ), and supports linear/interleaved burst modes. It is deployed in high-throughput network packet buffers and telecom line-card data path memory.

For engineers reviewing the CY7C1474V25-200BGI datasheet, CY7C1474V25-200BGI pinout, CY7C1474V25-200BGI application, or CY7C1474V25-200BGI equivalent, key selection criteria include 209-ball FBGA package compatibility, synchronous self-timed write timing, byte-write select granularity (BWa–BWh), JTAG boundary-scan support, and ZZ sleep mode implementation per Errata on page 36.

Technical Context

This SRAM implements fully registered pipelined operation: all address, control, and data inputs pass through rising-edge-triggered input registers; all outputs are driven through rising-edge-triggered output registers. The internal NoBL™ logic eliminates bus latency by enabling true back-to-back read/write cycles without wait states.

It features synchronous self-timed writes controlled by WE and eight byte-write enables (BWa–BWh), three chip enables (CE1–CE3), clock enable (CEN) for cycle suspension, and IEEE 1149.1 JTAG boundary scan. The ZZ pin (Ball H11) must be externally tied to ground per documented erratum.

Key Specifications

Pinout & Package

The CY7C1474V25-200BGI is packaged in a Pb-free/non-Pb-free 209-ball FBGA (15 mm × 17 mm × 1.4 mm, ball pitch 1.0 mm). Pinout conforms to JEDEC MO-270AB standard; Ball H11 (ZZ) must be externally grounded per documented erratum.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Compared with AS7C362000B-200BIN and IS61WV102472B-200BQI, CY7C1474V25-200BGI uniquely delivers guaranteed zero-wait-state back-to-back operation, integrated ZZ sleep with documented grounding requirement, and full byte-write granularity - making it optimal for latency-sensitive telecom and real-time control designs.

Availability

CY7C1474V25-200BGI is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, baseband processing units, and industrial real-time controllers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1474V25-200BGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains the former Cypress SRAM portfolio under its Industrial & Multimarket division, with global manufacturing and quality infrastructure.

CY7C1474V25 belongs to the NoBL™ Pipelined SRAM product line, designed specifically for high-throughput, low-latency data buffering in networking, telecommunications, and real-time embedded systems where deterministic timing and burst efficiency are critical.

FAQ

What is the required connection for the ZZ pin on CY7C1474V25-200BGI?

The ZZ pin (Ball H11) must be externally connected to ground to enable functional deep-sleep mode. This is a documented hardware requirement per Errata on page 36 of the official datasheet (Document Number: 38-05290 Rev. *V). Leaving ZZ floating or pulling high disables sleep functionality and may cause undefined behavior.

Does CY7C1474V25-200BGI support both linear and interleaved burst orders?

Yes - burst order is selected via the MODE pin (Ball A1). MODE = LOW configures linear burst; MODE = HIGH configures interleaved burst. Both modes are fully supported at 200 MHz and align with JEDEC-standard burst addressing for seamless integration with industry-standard memory controllers.

How many byte-write enable signals does CY7C1474V25-200BGI provide?

CY7C1474V25-200BGI provides eight byte-write enable signals: BWa through BWh. Each controls a 9-bit segment of the 72-bit data bus (DQa–DQh), enabling granular 1–72 bit writes without read-modify-write cycles - essential for efficient packet header updates and partial buffer writes.

Is JTAG boundary scan supported, and what is its compliance status?

Yes - CY7C1474V25-200BGI implements full IEEE 1149.1 JTAG boundary scan. TAP signals (TCK, TMS, TDI, TDO) are assigned to dedicated balls (A10, B10, A9, B9), and the instruction set supports SAMPLE/PRELOAD, EXTEST, and BYPASS. Compliance is verified per JEDEC J-STD-011 and included in production test flow.