Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1474V33-167BGC

Part No.:
CY7C1474V33-167BGC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
209-BGA
Datasheet:
AetrixCY7C1474V33-167BGC.pdf
Description:
IC SRAM 72MBIT PAR 209FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,078

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1474V33 from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 1M × 72, operating at 167 MHz with 3.4 ns clock-to-output delay, single 3.3 V core supply, and 3.3 V/2.5 V I/O support-used in high-throughput network packet buffering and telecom line card data path staging.

For engineers reviewing the CY7C1474V33 datasheet, CY7C1474V33 pinout, CY7C1474V33 application, or CY7C1474V33 equivalent, key selection criteria include burst mode compatibility (linear/interleaved), byte-write granularity (8 × 9-bit), ZZ sleep mode implementation, and FBGA-209 mechanical fit for dense PCB layouts.

Technical Context

The CY7C1474V33 implements fully registered synchronous interfaces: all address, control, and data signals are latched on the rising edge of CLK; output registers ensure deterministic timing, eliminating asynchronous OE dependency. Its NoBL™ logic enables true back-to-back read/write operations without wait states.

Burst capability supports both linear and interleaved orders; write operations use on-chip self-timed circuitry synchronized to CLK, while eight independent byte write selects (BWSa–BWSh) enable precise 9-bit sub-word writes within the 72-bit data bus.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (1M × 72 configuration)
Max Clock Frequency 167 MHz - defines maximum sustained burst throughput of 12.0 GB/s (72-bit @ 167 MHz)
Access Time 3.4 ns - guaranteed clock-to-output delay under worst-case 167 MHz operation
Supply Voltage 3.3 V core (VDD), 3.3 V/2.5 V I/O (VDDQ) - requires dual-rail power design with separate decoupling
Byte Write Pins 8 pins (BWSa–BWSh) - each controls one 9-bit byte lane, enabling partial writes without read-modify-write
Sleep Mode ZZ pin (active-low) - reduces standby current to ≤120 mA while preserving data during clock stop
Package 209-ball FBGA (14 × 22 × 1.76 mm) - non-Pb-free, JEDEC-compliant footprint with 0.8 mm ball pitch

Pinout & Package

Package: 209-ball Fine-Pitch Ball Grid Array (FBGA), 14 mm × 22 mm body, 0.8 mm ball pitch, non-RoHS-compliant (non Pb-free), thermal pad not exposed.

Pin/Terminal Circuit Role Design Meaning
CLK Primary synchronous clock input Rising-edge-triggered register control for all inputs/outputs; qualified by CEN
CEN Clock enable Deassertion suspends internal clock domain, extending previous cycle without loss of state
CE1–CE3 Chip enable inputs Three-level synchronous bank select; all must be active for device access
WE Write enable Active-high synchronous write strobe; sampled with CLK edge alongside BW pins
BWSa–BWSh Byte write selects Eight independent 9-bit lane enables; low = write enabled for corresponding DQ[8:0] group
OE Output enable Asynchronous tristate control - used only for output driver disable during write cycles
ZZ Deep sleep control Active-low; must be externally tied to GND per errata (Ball P6); disables clocks and reduces ICC
DQa–DQh / DQPa–DQPh Data I/O and parity I/O 72-bit bidirectional data bus + 8-bit parity (DQP) - each DQx group = 9-bit byte; DQPx = parity for DQx

Key Features

Feature Design Value
No Bus Latency™ (NoBL™) architecture Enables consecutive read/write operations with zero wait states - eliminates pipeline stalls in burst-intensive traffic flows
Full registration of inputs and outputs All signals synchronized to CLK rising edge - simplifies timing closure in FPGA/ASIC interface designs
Linear and interleaved burst modes Configurable via MODE pin - matches legacy ZBT protocol requirements and modern memory controller expectations
IEEE 1149.1 JTAG boundary scan Supports production test and board-level diagnostics without additional test points or fixtures
Synchronous self-timed writes Removes external write pulse timing constraints - internal logic guarantees setup/hold compliance across voltage/temp

Applications

Telecom Line Cards Network Packet Buffers

Use Scenario: Staging ingress/egress packets in multi-gigabit Ethernet or OTN switching fabric.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer between SERDES PHY and traffic manager ASIC.

Use Value: 167 MHz burst rate sustains 12 GB/s throughput; byte-write capability allows efficient small-packet handling without full-line writes.

Use Scenario: Temporary storage of fragmented IP packets prior to reassembly or classification.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as first-level packet memory with deterministic read latency.

Use Value: 3.4 ns clock-to-output ensures sub-6 ns total access; ZZ sleep mode cuts power during idle microsecond intervals.

Baseband Processing Units Radar Signal Processing

Use Scenario: Intermediate storage for channelized LTE/5G baseband samples between FFT and modulation blocks.

IC Role / Device Role / Timing Role: Pipelined memory stage synchronizing multi-lane DSP data paths.

Use Value: Fully registered interface aligns with FPGA fabric timing; 72-bit width matches 8×9-bit IQ sample grouping.

Use Scenario: Real-time buffering of ADC samples in pulsed-Doppler radar front ends.

IC Role / Device Role / Timing Role: Burst-capable SRAM capturing high-rate chirp returns before FFT processing.

Use Value: Interleaved burst mode matches radar range-bin addressing; 120 mA standby current extends system-level power budget.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2135L16PF 165-ball FBGA, 167 MHz, 72-Mbit (1M × 72), but uses 2.5 V core (VDD = 2.5 V) and lacks ZZ sleep mode Requires dual 2.5 V/3.3 V supply rails; no deep-sleep option limits low-power use cases Select when 2.5 V core compatibility is mandatory and sleep mode is unnecessary
ISSI IS61WV102472BLL-167B 209-ball FBGA, 167 MHz, 72-Mbit (1M × 72), but supports only linear burst and has 4.0 ns tCO Higher access latency impacts tight-loop real-time systems; no interleaved burst for legacy ZBT alignment Select when cost sensitivity outweighs burst flexibility and sub-4 ns timing requirements

Compared with IDT72V2135L16PF and IS61WV102472BLL-167B, the CY7C1474V33 uniquely combines ZZ sleep mode, interleaved burst support, and 3.3 V core compatibility - critical for telecom infrastructure where power-aware burst scheduling and protocol alignment are mandatory.

Availability

CY7C1474V33 is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, baseband processing units, and radar signal processing requiring stable component supply and long-term industrial lifecycle support.

Supply support for CY7C1474V33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive ICs, and high-performance memory solutions.

The CY7C1474V33 belongs to Infineon's legacy Cypress synchronous SRAM product line, designed specifically for high-throughput, low-latency data buffering in carrier-grade networking and wireless infrastructure equipment.

FAQ

Is the CY7C1474V33 pin-compatible with ZBT SRAMs?

Yes - the CY7C1474V33 is functionally equivalent and pin-compatible with standard ZBT SRAMs, supporting identical burst protocols (linear/interleaved), clocking schemes, and control signal timing. This enables drop-in replacement in existing ZBT-based designs without layout changes.

What is the required connection for the ZZ pin?

The ZZ pin (Ball P6 on the 209-ball FBGA) must be externally tied to ground per documented errata. Leaving it floating or pulling high violates specification and may cause undefined sleep behavior or increased standby current beyond the rated 120 mA.

Does the CY7C1474V33 support 2.5 V I/O operation?

Yes - the VDDQ supply accepts 2.5 V ±0.2 V, allowing direct interfacing with 2.5 V logic families. Core VDD remains fixed at 3.3 V ±0.3 V; VDDQ and VDD must be powered independently with appropriate decoupling.

How many byte write lanes does the CY7C1474V33 provide?

The CY7C1474V33 provides eight independent byte write select inputs (BWSa through BWSh), each controlling a 9-bit segment of the 72-bit data bus. This enables granular 9-bit writes without read-modify-write cycles or bus contention.

CY7C1474V33-167BGC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
NoBL™
Package/Case:
209-BGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
1M x 72
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
209-FBGA (14x22)

CY7C1474V33-167BGC FAQ

1.How can I place an order for CY7C1474V33-167BGC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1474V33-167BGC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1474V33-167BGC reliable?

The price and inventory of CY7C1474V33-167BGC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1474V33-167BGC is usually 5 days.

3.What payment methods are accepted for CY7C1474V33-167BGC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1474V33-167BGC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1474V33-167BGC?

CY7C1474V33-167BGC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1474V33-167BGC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1474V33-167BGC?

For technical support, including CY7C1474V33-167BGC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1474V33-167BGC requirements.

6.How does Aetrix verify that CY7C1474V33-167BGC is sourced from the original manufacturer or authorized distributors?

All CY7C1474V33-167BGC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1474V33-167BGC meets industry standards.

7.What is the process for return or replacement of CY7C1474V33-167BGC?

All CY7C1474V33-167BGC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1474V33-167BGC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1474V33-167BGC part is unused and in its original packaging.

Return procedure for CY7C1474V33-167BGC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1474V33-167BGC Tags

  • CY7C1474V33-167BGC
  • CY7C1474V33-167BGC PDF
  • CY7C1474V33-167BGC Datasheet
  • CY7C1474V33-167BGC Specifications
  • CY7C1474V33-167BGC Images
  • Infineon Technologies
  • Infineon Technologies CY7C1474V33-167BGC
  • Buy CY7C1474V33-167BGC
  • CY7C1474V33-167BGC Price
  • CY7C1474V33-167BGC Distributor
  • CY7C1474V33-167BGC Supplier
  • CY7C1474V33-167BGC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER