Infineon Technologies CY7C1474V33-200BGC
- Part No.:
- CY7C1474V33-200BGC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 209-BGA
- Datasheet:
-
CY7C1474V33-200BGC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 209FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1474V33 from Infineon Technologies (formerly Cypress) is a 72-Mbit synchronous pipelined SRAM with NoBL™ architecture, configured as 1M × 72, supporting 200 MHz zero-wait-state bus operation. It features fully registered I/O, byte-write capability across eight 9-bit groups (BWSa–BWSh), 3.3 V core supply with 3.3 V/2.5 V I/O support, and JTAG boundary scan compliance. Used in high-throughput network packet buffers and telecom line card data staging.
For engineers reviewing the CY7C1474V33 datasheet, CY7C1474V33 pinout, CY7C1474V33 application, or CY7C1474V33 equivalent, key selection criteria include burst mode compatibility (linear/interleaved), ZZ sleep mode implementation, 209-ball FBGA mechanical fit, and synchronous self-timed write timing at 200 MHz.
Technical Context
This SRAM implements a true pipelined read/write architecture with No Bus Latency™ logic, enabling back-to-back operations without wait states. All inputs and outputs are edge-triggered by the rising clock edge, and output enable is asynchronous while output drivers are synchronously tristated during writes to prevent bus contention.
The device supports three chip enables (CE1–CE3) for bank selection, clock enable (CEN) for cycle suspension, and eight independent byte write selects (BWSa–BWSh) for granular 9-bit writes. Burst addressing follows either linear or interleaved order, controlled by the MODE pin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (1M × 72 configuration) |
| Max Clock Frequency | 200 MHz - enables 200 MT/s sustained throughput with zero wait states |
| Access Time | 3.0 ns - clock-to-output delay at 200 MHz, critical for timing closure in high-speed interfaces |
| Supply Voltage | Core: 3.3 V ±0.3 V; I/O: 3.3 V or 2.5 V - supports mixed-voltage system interfacing |
| Byte Write Groups | 8 × 9-bit (BWSa–BWSh) - allows independent write masking of each 9-bit DQ group |
| Package | 209-ball FBGA (14 × 22 × 1.76 mm) - non-Pb-free, JEDEC-compliant footprint |
| Sleep Mode | ZZ pin-controlled - reduces standby current to ≤120 mA while preserving data |
Pinout & Package
Package: 209-ball Fine-Pitch Ball Grid Array (FBGA), 14 mm × 22 mm × 1.76 mm body, non-RoHS-compliant (non Pb-free), ball pitch 0.8 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Primary clock input | Rising-edge synchronized register control for all inputs/outputs; qualified by CEN |
| CEN | Clock enable | Deassertion suspends clock domain operation, extending previous cycle without reset |
| CE1–CE3 | Chip enable inputs | Three-level synchronous enable hierarchy for multi-bank memory mapping and power gating |
| BWSa–BWSh | Byte write select inputs | Eight independent 9-bit write masks; active-low, synchronous with CLK |
| ZZ | Deep sleep control | Asynchronous active-low input; requires external tie to GND per errata (Ball P6) |
| OE | Output enable | Asynchronous control; output drivers tristated synchronously during write cycles to avoid bus conflict |
| DQa–DQh / DQPa–DQPh | Data I/O terminals | 72-bit bidirectional data bus + 8 parity bits; grouped into eight 9-bit lanes for byte write |
| ADV/LD | Address valid/load | Indicates valid address on A0–A19; used for burst address generation and latency control |
Key Features
| Feature | Design Value |
|---|---|
| NoBL™ Architecture | Enables unlimited consecutive read/write transitions with no bus latency - eliminates pipeline stalls in burst-intensive systems |
| Synchronous Self-Timed Writes | On-chip write timing control ensures reliable setup/hold margins without external write pulse generation |
| JTAG Boundary Scan (IEEE 1149.1) | Full scan chain support for board-level testability and interconnect verification in dense FBGA layouts |
| Flexible Burst Ordering | MODE pin selects linear or interleaved burst sequence - matches legacy ZBT or modern processor cache line patterns |
| Zero-Wait-State 200 MHz Operation | Guaranteed timing at full speed without wait insertion - simplifies controller logic and maximizes bandwidth utilization |
Applications
| Network Packet Buffering | Telecom Line Card Staging |
|---|---|
Use Scenario: Temporary storage of variable-length Ethernet/IP packets in switch fabric ASIC interfaces. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level buffering between MAC and switching engine. Use Value: 200 MHz zero-wait operation sustains 1.44 GB/s peak throughput (72-bit × 200 MHz), matching 10G+ line rates. | Use Scenario: Holding frame headers and payload fragments during SONET/SDH overhead processing in optical transport modules. IC Role / Device Role / Timing Role: Synchronous burst-access memory for deterministic header parsing and reassembly pipelines. Use Value: Fully registered I/O and pipelined architecture ensure jitter-free timing alignment with 155.52 MHz–2.488 GHz reference clocks. |
| High-Speed Test Equipment Memory | Radar Signal Processing Buffer |
Use Scenario: Capturing and replaying high-fidelity digital waveforms in automated test systems with real-time pattern generation. IC Role / Device Role / Timing Role: Dual-port-capable buffer supporting simultaneous capture (write) and playback (read) via CE partitioning. Use Value: Eight independent byte-write enables allow selective update of waveform segments without full-line overwrite. | Use Scenario: Storing intermediate FFT results and range-Doppler maps in airborne phased-array radar front ends. IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory for time-critical signal chain buffering between ADCs and DSP cores. Use Value: ZZ sleep mode reduces idle power by >80% while retaining data integrity during inter-pulse intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2135L10PF | 10 ns access at 100 MHz; 4M × 36 config; 165-ball FBGA; no ZZ sleep mode | Lacks deep-sleep capability and 200 MHz performance; suited for cost-sensitive lower-speed designs | Select when 100 MHz bandwidth suffices and JTAG test is not required |
| ISSI IS61WV102472BLL-15BLI | 15 ns access at 66 MHz; 1M × 72; 209-ball FBGA; no NoBL™ or burst modes | Asynchronous interface; no pipelining or burst support; simpler controller integration | Choose for legacy system upgrades where synchronous timing constraints are absent |
Compared with IDT72V2135L10PF and IS61WV102472BLL-15BLI, the CY7C1474V33 delivers 2× higher bandwidth, integrated burst control, and power-aware ZZ mode - essential for next-generation packet-processing and radar subsystems requiring deterministic latency.
Availability
CY7C1474V33 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card staging, high-speed test equipment memory, and radar signal processing buffer applications requiring stable component supply and long-term industrial availability.
Supply support for CY7C1474V33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and high-performance memory solutions.
This device belongs to Infineon's legacy Cypress synchronous SRAM product line, engineered specifically for zero-latency, high-throughput data buffering in telecom infrastructure, test instrumentation, and defense electronics.
FAQ
What is the correct handling for the ZZ pin on CY7C1474V33?
The ZZ pin (Ball P6) must be externally tied to ground per documented errata on page 35 of the datasheet. Leaving it floating or pulling high may cause undefined sleep behavior or increased standby current. This requirement is mandatory for functional reliability and is not optional - it applies regardless of whether sleep mode is actively used in the design.
Does CY7C1474V33 support both linear and interleaved burst orders?
Yes. The MODE pin selects burst order: logic high enables linear burst, logic low enables interleaved burst. This matches standard ZBT SRAM behavior and allows seamless integration with processors or FPGAs that require either addressing scheme for cache line or DMA transfers without software modification.
Can CY7C1474V33 operate with 2.5 V I/O while using 3.3 V core supply?
Yes. The device supports independent 3.3 V core (VDD) and 2.5 V I/O (VDDQ) supplies. VDDQ pins must be supplied at 2.5 V ±0.2 V, and all DQ/DQP pins become 2.5 V tolerant. This enables direct interfacing with 2.5 V FPGA I/O banks while maintaining full 200 MHz timing performance.
Is JTAG boundary scan supported in all operating modes?
Yes. IEEE 1149.1 boundary scan remains fully functional during active memory operation, standby (CEN deasserted), and ZZ sleep mode. TAP signals (TCK, TMS, TDI, TDO) operate independently of memory control pins, allowing in-system test access without halting system operation.
CY7C1474V33-200BGC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- NoBL™
- Package/Case:
- 209-BGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 1M x 72
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 209-FBGA (14x22)
CY7C1474V33-200BGC FAQ
1.How can I place an order for CY7C1474V33-200BGC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1474V33-200BGC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1474V33-200BGC reliable?
The price and inventory of CY7C1474V33-200BGC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1474V33-200BGC is usually 5 days.
3.What payment methods are accepted for CY7C1474V33-200BGC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1474V33-200BGC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1474V33-200BGC?
CY7C1474V33-200BGC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1474V33-200BGC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1474V33-200BGC?
For technical support, including CY7C1474V33-200BGC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1474V33-200BGC requirements.
6.How does Aetrix verify that CY7C1474V33-200BGC is sourced from the original manufacturer or authorized distributors?
All CY7C1474V33-200BGC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1474V33-200BGC meets industry standards.
7.What is the process for return or replacement of CY7C1474V33-200BGC?
All CY7C1474V33-200BGC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1474V33-200BGC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1474V33-200BGC part is unused and in its original packaging.
Return procedure for CY7C1474V33-200BGC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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