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Infineon Technologies CY7C1480BV25-167AXC

Part No.:
CY7C1480BV25-167AXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
100-LQFP
Datasheet:
AetrixCY7C1480BV25-167AXC.pdf
Description:
IC SRAM 72MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,213

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Product details

Overview

CY7C1480BV25-167AXC from Cypress Semiconductor is a 72-Mbit (2M × 36) pipelined synchronous SRAM with 2.5 V core/I/O, 167 MHz maximum clock frequency, 3.4 ns clock-to-output delay, JEDEC-compliant TQFP-100 package, and support for Intel Pentium®-compatible interleaved or linear burst sequences - deployed in high-speed CPU cache subsystems requiring deterministic timing and byte-selectable writes.

For engineers reviewing the CY7C1480BV25-167AXC datasheet, CY7C1480BV25-167AXC pinout, CY7C1480BV25-167AXC application, or CY7C1480BV25-167AXC equivalent, key selection criteria include synchronous burst address generation via ADV/ADSP/ADSC, registered I/O timing, ZZ sleep mode retention, IEEE 1149.1 JTAG boundary scan, and dual chip-enable architecture for multi-bank memory systems.

Technical Context

The device implements a two-bit synchronous wraparound burst counter controlled by ADV, ADSP, and ADSC inputs to generate sequential addresses during burst reads/writes. All synchronous inputs - including A[1:0], CE1/CE2/CE3, BWA–BWD, BWE, GW, OE, and CLK - are registered on the rising edge of CLK, enabling precise pipelined timing control.

It supports byte-write operations via eight synchronous BWX inputs qualified by BWE, plus global write override via GW. Output enable (OE) operates asynchronously, while ZZ provides asynchronous sleep entry with data retention - both independent of clock domain. The memory array uses 2.5 V CMOS core logic with separate VDDQ/VSSQ I/O supply rails for noise isolation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 bits), enabling 9 MB of high-speed cache storage per device
Max Clock Frequency 167 MHz - defines maximum sustained burst throughput of 600 MB/s (36-bit bus)
Access Time (tCO) 3.4 ns - guaranteed clock-to-output delay for timing-critical synchronous read paths
Supply Voltages VDD = 2.5 V ± 0.2 V (core); VDDQ = 2.5 V ± 0.2 V (I/O) - enables direct interface with 2.5 V logic families
Burst Mode Control MODE pin selects Intel Pentium®-interleaved or linear burst sequence - ensures compatibility with legacy x86 cache controllers
Write Architecture Synchronous self-timed writes with BWE + BWX qualification - eliminates external write pulse generation logic
Power Consumption 400 mA max operating current, 120 mA CMOS standby - supports low-power cache subsystems

Pinout & Package

Package: 100-pin thin quad flat pack (TQFP), 14 × 20 × 1.4 mm, JEDEC-standard Pb-free, with separate VDDQ/VSSQ I/O power/ground pins and internal ZZ pull-down.

Pin/Terminal Circuit Role Design Meaning
CLK Synchronous clock input Rising-edge-triggered master timing reference for all registered inputs/outputs
ADSP / ADSC Address strobe inputs Processor- or controller-initiated address capture; ADSP takes precedence when both asserted
ADV Burst address advance Triggers internal two-bit counter increment on next CLK edge for burst sequencing
BWA–BWD, BWE Byte write controls Enable selective 8-bit writes to DQA–DQD banks; BWE must be active LOW to qualify BWX
GW Global write enable Overrides all BWX signals when LOW - writes full 36-bit word regardless of byte select state
OE Asynchronous output enable Controls I/O direction: LOW = output drive, HIGH = tristate - independent of CLK
ZZ Asynchronous sleep input HIGH activates low-power retention mode; internal pull-down ensures safe default LOW state
DQA–DQD, DQPA–DQPD Bidirectional data I/O 36-bit data bus (32 data + 4 parity); registered on CLK rise, direction controlled by OE

Key Features

Feature Design Value
Registered pipelined I/O Eliminates setup/hold timing violations at 167 MHz by synchronizing all address/data/control signals to CLK
User-selectable burst mode MODE pin configures interleaved (Pentium®) or linear addressing - no firmware or external logic required
Synchronous self-timed writes On-chip write sequencer automates write pulse width and timing - removes need for external write controller
IEEE 1149.1 JTAG boundary scan Enables board-level testability and interconnect verification without dedicated test pads or probes
Dual chip-enable architecture CE1 (active LOW), CE2 (active HIGH), CE3 (active LOW) allow flexible bank decoding in multi-SRAM systems

Applications

High-Performance CPU Cache Network Packet Buffering

Use Scenario: Secondary cache for embedded x86-compatible processors operating at 167 MHz bus speed.

IC Role / Device Role / Timing Role: Pipelined synchronous SRAM providing deterministic 3.4 ns tCO read latency and burst-aligned data delivery.

Use Value: Enables zero-wait-state cache operation with Intel Pentium®-compatible interleaved burst addressing, reducing average memory access time by >40% vs. asynchronous SRAM.

Use Scenario: Line-rate packet buffering in Layer 2/3 switching ASICs requiring 36-bit wide, low-latency memory access.

IC Role / Device Role / Timing Role: High-bandwidth buffer memory supporting concurrent ingress/egress packet staging with byte-selectable writes.

Use Value: 600 MB/s sustained throughput and synchronous self-timed writes eliminate external write arbitration logic, reducing PCB area and signal count.

Industrial Motion Controller Memory Avionics Data Acquisition Buffer

Use Scenario: Real-time position interpolation buffer in servo drive controllers with deterministic 10 µs cycle time requirements.

IC Role / Device Role / Timing Role: Deterministic-access SRAM storing interpolated trajectory points with guaranteed 3.4 ns read response.

Use Value: Registered I/O and ZZ sleep mode ensure jitter-free operation during motion phases and low-power hold between cycles.

Use Scenario: Radiation-tolerant data acquisition buffer in flight control computers capturing sensor telemetry at 100 kHz sample rate.

IC Role / Device Role / Timing Role: High-reliability SRAM with neutron soft error immunity and JTAG testability for DO-254 compliance.

Use Value: IEEE 1149.1 boundary scan enables in-system verification of memory interconnect integrity without physical probe access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous pipelined SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72V2115L16PF 36-bit, 167 MHz, 3.4 ns tCO, but uses 3.3 V I/O and lacks ZZ sleep mode Requires level-shifting for 2.5 V systems; no low-power retention capability Select only if 3.3 V I/O compatibility is mandatory and sleep mode is unused
ISSI IS61WV102436B 36-bit, 166 MHz, 3.5 ns tCO, 2.5 V core/I/O, but no JTAG or MODE-selectable burst Lacks Pentium® burst compatibility and boundary-scan testability Choose for cost-sensitive designs where burst mode flexibility and test coverage are secondary

Compared with IDT72V2115L16PF and IS61WV102436B, CY7C1480BV25-167AXC uniquely combines 2.5 V operation, ZZ sleep retention, JTAG testability, and selectable burst modes - making it optimal for space-constrained, high-reliability, and legacy-compatible cache subsystems.

Availability

CY7C1480BV25-167AXC is available at Aetrix Electronics and suitable for high-speed CPU cache subsystems, network packet buffers, industrial motion controllers, and avionics data acquisition systems requiring stable component supply across extended product lifecycles.

Supply support for CY7C1480BV25-167AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.

CY7C1480BV25 belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for deterministic-latency cache and buffer applications in x86-compatible and real-time embedded systems requiring burst-mode efficiency and JTAG testability.

FAQ

What is the function of the MODE pin on CY7C1480BV25-167AXC?

The MODE pin selects between Intel Pentium®-compatible interleaved burst addressing (MODE = LOW) and linear burst addressing (MODE = HIGH). This configuration is sampled at power-up or reset and determines how the internal two-bit burst counter increments addresses during burst cycles - critical for matching legacy processor cache controller protocols without external logic.

Can CY7C1480BV25-167AXC operate with mixed voltage supplies?

No. The device requires strictly 2.5 V ± 0.2 V on both VDD (core) and VDDQ (I/O) rails. VSSQ is the dedicated I/O ground for TQFP packages. Applying 3.3 V to any supply pin exceeds absolute maximum ratings and risks permanent damage. The FBGA variant shares VSS for core and I/O, but still mandates 2.5 V supplies.

How does the ZZ sleep mode affect data retention and wake-up timing?

When ZZ is driven HIGH, the device enters non-time-critical sleep mode with full data retention and reduced current draw (≤120 mA standby). Wake-up occurs synchronously on the first valid CLK edge after ZZ returns LOW - no additional stabilization delay is required, and the next access proceeds normally within standard tCO timing.

Is JTAG boundary scan functional during normal SRAM operation?

Yes. IEEE 1149.1 JTAG is fully operational during active memory use. The TAP controller runs independently of the SRAM core, allowing real-time interconnect testing without halting data transfers. Boundary scan cells monitor all I/O pins, including CLK, ADSP, and DQ lines, and support INTEST and EXTEST instructions per JTAG specification.

CY7C1480BV25-167AXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
2.375V ~ 2.625V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

CY7C1480BV25-167AXC FAQ

1.How can I place an order for CY7C1480BV25-167AXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1480BV25-167AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1480BV25-167AXC reliable?

The price and inventory of CY7C1480BV25-167AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1480BV25-167AXC is usually 5 days.

3.What payment methods are accepted for CY7C1480BV25-167AXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1480BV25-167AXC transactions.

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CY7C1480BV25-167AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1480BV25-167AXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1480BV25-167AXC?

For technical support, including CY7C1480BV25-167AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1480BV25-167AXC requirements.

6.How does Aetrix verify that CY7C1480BV25-167AXC is sourced from the original manufacturer or authorized distributors?

All CY7C1480BV25-167AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1480BV25-167AXC meets industry standards.

7.What is the process for return or replacement of CY7C1480BV25-167AXC?

All CY7C1480BV25-167AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1480BV25-167AXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1480BV25-167AXC part is unused and in its original packaging.

Return procedure for CY7C1480BV25-167AXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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