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Infineon Technologies CY7C1480BV33-167BZXC

Part No.:
CY7C1480BV33-167BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1480BV33-167BZXC.pdf
Description:
IC SRAM 72MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,465

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Product details

Overview

CY7C1480BV33-167BZXC from Cypress Semiconductor is a 72-Mbit pipelined synchronous SRAM with 2M × 36 organization, supporting 167 MHz bus operation (tCO = 3.4 ns), 3.3 V core supply, and 2.5/3.3 V I/O compatibility. It implements registered address/data paths, synchronous self-timed writes, and user-selectable Intel Pentium®-compatible interleaved or linear burst sequences for high-speed cache applications in networking line cards and telecom baseband processors.

For engineers reviewing the CY7C1480BV33-167BZXC datasheet, CY7C1480BV33-167BZXC pinout, CY7C1480BV33-167BZXC application, or CY7C1480BV33-167BZXC equivalent, key selection criteria include burst counter mode control (MODE pin), byte-write granularity (BWA–BWD + BWE), dual-address-strobe support (ADSP/ADSC), ZZ sleep mode behavior, and JEDEC-compliant TQFP-100 package mechanical and thermal specifications.

Technical Context

This SRAM uses a positive-edge-triggered clock (CLK) to register all synchronous inputs-including addresses (A[1:0]), chip enables (CE1/CE2/CE3), burst controls (ADSC/ADSP/ADV), and write enables (BWX/GW)-enabling deterministic pipelined access timing. The on-chip 2-bit wraparound burst counter generates sequential addresses during burst reads/writes when ADV is asserted.

It supports asynchronous OE-controlled output tri-state and ZZ-controlled low-power sleep mode with data retention. Byte write operations are enabled only when BWE is LOW and one or more BWX pins are LOW; GW overrides all BWX signals to enable full-word writes. All I/Os meet JESD8-5 voltage thresholds for 2.5 V and 3.3 V operation.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 72 Mbit (2M × 36 organization)
Max Clock Frequency 167 MHz - defines maximum sustained burst throughput and system timing margin
Access Time (tCO) 3.4 ns - clock-to-output delay under 167 MHz conditions; determines read pipeline latency
Core Supply Voltage 3.3 V ± 0.3 V - powers internal logic and memory array; requires dedicated regulation
I/O Supply Range 2.5 V or 3.3 V - supports mixed-voltage system interfacing without level shifters
Burst Mode Control MODE pin - selects Intel Pentium® interleaved vs. linear burst address sequence
Sleep Mode ZZ pin (active HIGH) - reduces standby current to ≤120 mA while preserving data

Pinout & Package

Package: JEDEC-standard Pb-free 100-pin thin quad flat pack (TQFP), 14 × 20 × 1.4 mm body, 0.5 mm pitch.

Pin/Terminal Circuit Role Design Meaning
A[1:0] Synchronous Address Input Sampled at CLK rising edge when ADSP/ADSC active; loaded into 2-bit burst counter
ADSP / ADSC Synchronous Address Strobe Processor- or controller-initiated address capture; ADSP takes priority if both asserted
ADV Synchronous Address Advance Triggers automatic increment of burst counter on CLK rising edge
BWA–BWD Synchronous Byte Write Select Active-LOW per-byte enable; qualified by BWE to select 1–4 bytes for write
GW Synchronous Global Write Active-LOW override that forces full 36-bit write regardless of BWX states
OE Asynchronous Output Enable Active-LOW; controls I/O direction and tri-state; masked during first read clock after deselect
ZZ Asynchronous Sleep Control Active-HIGH; places device in low-power state with data retention; internal pull-down
VDDQ / VSSQ I/O Power / Ground Dedicated 2.5/3.3 V I/O rail and return path-separate from core VDD/VSS in TQFP

Key Features

Feature Design Value
Pipelined synchronous interface Registered inputs/outputs eliminate external latch timing constraints and simplify PCB layout
User-selectable burst sequence MODE pin configures either Pentium®-interleaved or linear addressing-no firmware change required
Byte-write granularity Four independent byte-enable lines (BWA–BWD) + BWE allow precise 8-bit, 16-bit, or 32-bit writes
Synchronous self-timed writes On-chip write timing eliminates need for external write pulse generation or wait-state insertion
JTAG boundary scan (IEEE 1149.1) Enables in-system test and debug without additional test fixtures or board-level probing

Applications

Network Packet Buffering Baseband Signal Processing

Use Scenario: High-throughput packet buffering in 10G/25G Ethernet switch ASICs requiring low-latency, burst-capable memory for ingress/egress queues.

IC Role / Device Role / Timing Role: Secondary cache SRAM providing pipelined 3-1-1-1 burst read/write access synchronized to switch fabric clock domain.

Use Value: 3.4 ns tCO and 167 MHz clock rate enable sub-6 ns effective read latency across four consecutive words, matching SERDES-aligned data streams.

Use Scenario: Real-time FFT and channel estimation buffers in LTE/5G massive MIMO baseband units where deterministic burst access minimizes DMA overhead.

IC Role / Device Role / Timing Role: Burst-mode SRAM interfaced directly to DSP DMA controllers using ADSP/ADV handshake protocol.

Use Value: Interleaved burst mode matches Pentium-style processor burst patterns used in legacy DSP co-processors, eliminating address calculation logic.

Industrial PLC Data Logging Avionics Display Frame Buffer

Use Scenario: Cyclic data acquisition and timestamped logging in ruggedized programmable logic controllers operating in extended temperature environments.

IC Role / Device Role / Timing Role: Nonvolatile-backed SRAM buffer holding sensor history before flash commit; powered by isolated 3.3 V rail.

Use Value: ZZ sleep mode reduces standby current to ≤120 mA during idle cycles while preserving logged data integrity without backup battery.

Use Scenario: Dual-port frame buffer for mission-critical cockpit display systems requiring guaranteed pixel update timing and EMI resilience.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as write port for graphics engine and read port for display controller via separate CE1/CE2 bank selection.

Use Value: Separate ADSP (graphics write) and ADSC (display read) strobes prevent bus contention and ensure deterministic 167 MHz pixel fetch timing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar pipelined sync SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61WV102436BLL-167BLI 1024K × 36 organization, same 167 MHz speed grade, but uses 3.3 V-only I/O (no 2.5 V support) Lacks MODE-selectable burst sequence; fixed linear burst only Preferred when system uses uniform 3.3 V I/O and does not require Pentium®-interleaved addressing
MT55LSD25636DZ-167:J 256K × 36 density, lower power (320 mA max operating current), no ZZ sleep mode Supports JTAG but lacks ADV/ADSC dual-strobe architecture; simpler address control Selected for space-constrained designs where full 72 Mbit density is unnecessary and ultra-low power dominates

Compared with IS61WV102436BLL-167BLI and MT55LSD25636DZ-167:J, the CY7C1480BV33-167BZXC uniquely combines 2M × 36 depth, dual-strobe (ADSP/ADSC) flexibility, and MODE-configurable burst sequencing-critical for legacy processor coherency and multi-master bus arbitration.

Availability

CY7C1480BV33-167BZXC is available at Aetrix Electronics and suitable for network packet buffering, baseband signal processing, and industrial PLC data logging requiring stable component supply, long-lifecycle support, and Pb-free TQFP packaging.

Supply support for CY7C1480BV33-167BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

The CY7C1480BV33 belongs to Cypress's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-capable cache and buffer applications in telecom infrastructure and real-time embedded systems.

FAQ

What is the function of the MODE pin on CY7C1480BV33-167BZXC?

The MODE pin selects the burst address sequence: logic HIGH configures Intel Pentium®-compatible interleaved addressing (e.g., 0, 2, 4, 6), while logic LOW enables linear addressing (e.g., 0, 1, 2, 3). It is sampled at power-up and latched; changing it mid-operation has no effect until the next burst initiation.

Can CY7C1480BV33-167BZXC operate with 2.5 V I/O while using 3.3 V core supply?

Yes. The device supports independent 3.3 V core (VDD) and 2.5 V or 3.3 V I/O (VDDQ) supplies. In TQFP packages, VDDQ and VSSQ are dedicated pins; proper decoupling (0.1 µF ceramic per VDDQ/VSSQ pair) is required to maintain signal integrity and meet JESD8-5 thresholds.

How does the ZZ sleep mode affect data retention and wake-up timing?

When ZZ is driven HIGH, the device enters non-time-critical sleep mode with data retained and core current reduced to ≤120 mA. Wake-up occurs synchronously on the next CLK rising edge after ZZ returns LOW; no additional stabilization delay is required before issuing ADSP/ADSC.

Is the CY7C1480BV33-167BZXC pin-compatible with CY7C1482BV33-167BZXC?

No. Although both share the same speed grade and FBGA option, CY7C1480BV33 is 2M × 36 (72 Mbit) in TQFP-100 or FBGA-165, while CY7C1482BV33 is 4M × 18 (72 Mbit) with different pin mapping-especially for address bits and DQP lines-and lacks certain TQFP-specific pins like VDDQ/VSSQ.

CY7C1480BV33-167BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
72Mbit
Memory Organization:
2M x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
3.135V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1480BV33-167BZXC FAQ

1.How can I place an order for CY7C1480BV33-167BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1480BV33-167BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1480BV33-167BZXC reliable?

The price and inventory of CY7C1480BV33-167BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1480BV33-167BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1480BV33-167BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1480BV33-167BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1480BV33-167BZXC?

CY7C1480BV33-167BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1480BV33-167BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1480BV33-167BZXC?

For technical support, including CY7C1480BV33-167BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1480BV33-167BZXC requirements.

6.How does Aetrix verify that CY7C1480BV33-167BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1480BV33-167BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1480BV33-167BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1480BV33-167BZXC?

All CY7C1480BV33-167BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1480BV33-167BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1480BV33-167BZXC part is unused and in its original packaging.

Return procedure for CY7C1480BV33-167BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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