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Infineon Technologies CY7C1480BV33-200AXC
- Part No.:
- CY7C1480BV33-200AXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1480BV33-200AXC.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,215
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Product details
Overview
CY7C1480BV33-200AXC from Cypress Semiconductor is a 72-Mbit pipelined synchronous SRAM configured as 2M × 36 or 4M × 18, operating at 200 MHz with 3.3 V core and 2.5/3.3 V I/O support, registered inputs/outputs for deterministic timing, and IEEE 1149.1 JTAG boundary scan - deployed in high-speed CPU cache subsystems requiring burst-mode memory access.
For engineers reviewing the CY7C1480BV33-200AXC datasheet, CY7C1480BV33-200AXC pinout, CY7C1480BV33-200AXC application, or CY7C1480BV33-200AXC equivalent, key selection criteria include pipelined clock-to-output timing (3.0 ns), dual-burst mode (Intel Pentium® interleaved/linear), synchronous self-timed write control, byte-selectable or global write capability, and JEDEC-compliant TQFP/FBGA packaging options.
Technical Context
This SRAM implements a positive-edge-triggered synchronous architecture where all address, data, and control inputs are registered on CLK rise, enabling precise pipeline staging. The internal 2-bit burst counter, driven by ADV and initialized via ADSP/ADSC, supports wraparound linear or interleaved sequences determined by the MODE pin state.
Write operations are fully synchronous and self-timed: BWE and BWx qualify byte writes per cycle, while GW forces full-word writes regardless of byte enables. OE operates asynchronously to tri-state outputs, and ZZ provides non-time-critical sleep mode with data retention - all compliant with JESD8-5 I/O voltage standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 72 Mbit (2M × 36 or 4M × 18 organization) |
| Max clock frequency | 200 MHz - defines maximum sustained burst throughput |
| CLK-to-output delay (tCO) | 3.0 ns - guarantees deterministic read data valid window after clock edge |
| Core supply voltage | 3.3 V ± 0.3 V - powers internal logic and memory array |
| I/O supply voltage | 2.5 V or 3.3 V - selectable interface voltage for mixed-voltage system integration |
| Burst access rate | 3-1-1-1 - delivers first word in 3 clocks, subsequent words in 1 clock each |
| Power dissipation (active) | 500 mA max @ 200 MHz - sets thermal design margin for continuous operation |
Pinout & Package
The CY7C1480BV33-200AXC is available in JEDEC-standard Pb-free 100-pin thin quad flat pack (TQFP) and 165-ball fine-pitch ball grid array (FBGA) packages. This entry corresponds to the TQFP variant (suffix "AXC").
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Positive-edge-triggered master timing reference for all registered inputs/outputs |
| ADSP / ADSC | Address strobe inputs | Processor- or controller-initiated address capture; ADSP takes precedence when both asserted |
| ADV | Burst advance control | Triggers internal 2-bit counter increment during burst sequences |
| CE1, CE2, CE3 | Chip enable inputs | Three-level synchronous chip select hierarchy for bank decoding and depth expansion |
| BWA–BWD, BWE, GW | Byte write controls | Per-byte write masking (BWX + BWE) or unconditional full-word write (GW) |
| OE | Asynchronous output enable | Tri-states DQ/DQP pins immediately on deassertion; masked only during first read clock |
| ZZ | Asynchronous sleep control | Enters low-power retention mode when HIGH; internal pull-down ensures safe default LOW state |
| DQ A–D, DQP A–D | Bidirectional data I/O | 36-bit data bus (4 × 8-bit bytes + 4 parity bits); direction controlled by OE |
| VDD, VSS, VDDQ, VSSQ | Power and ground terminals | VDD/VSS power core logic; VDDQ/VSSQ isolate I/O drivers for noise immunity and voltage flexibility |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined synchronous interface | Registers all inputs and outputs on CLK rise - eliminates setup/hold timing violations in high-frequency buses |
| User-selectable burst mode | MODE pin selects Intel Pentium®-compatible interleaved or linear addressing - matches host processor protocol |
| Synchronous self-timed writes | On-chip write sequencing eliminates external write pulse generation - simplifies controller logic |
| Flexible I/O voltage support | 2.5 V or 3.3 V I/O operation - enables direct interfacing with legacy and modern SoCs without level shifters |
| JTAG boundary scan | IEEE 1149.1 compliance - enables in-system testability and interconnect verification on dense PCBs |
Applications
| High-Performance CPU Cache | Network Packet Buffer |
|---|---|
|
Use Scenario: Secondary cache for x86-compatible processors requiring low-latency, burst-mode memory access. IC Role / Device Role / Timing Role: Pipelined SRAM providing deterministic 3-1-1-1 burst reads aligned to processor clock domain. Use Value: Eliminates wait states during cache line fills by delivering consecutive 36-bit words within one clock cycle after initial latency. |
Use Scenario: Temporary storage for variable-length Ethernet frames in switch fabric ASICs. IC Role / Device Role / Timing Role: Synchronous buffer supporting concurrent ingress/egress burst transfers with byte-selectable writes. Use Value: Enables partial frame updates via BWA–BWD without disturbing adjacent packet data - critical for cut-through forwarding. |
| Industrial Motion Controller | Medical Imaging Frame Store |
|
Use Scenario: Real-time trajectory buffer in servo drive systems with deterministic jitter requirements. IC Role / Device Role / Timing Role: Deterministic-access memory holding interpolated motion profiles synchronized to PWM update clock. Use Value: Registered inputs/outputs guarantee sub-ns timing repeatability - essential for <1 µs position loop jitter budgets. |
Use Scenario: Line-buffer storage in ultrasound beamformer FPGAs processing multi-channel RF echo streams. IC Role / Device Role / Timing Role: High-bandwidth, low-latency frame store feeding parallel DSP pipelines with burst-aligned pixel data. Use Value: 200 MHz clock rate sustains >7 Gbps aggregate bandwidth across 36-bit bus - meets real-time 4K@60fps imaging throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pipelined synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-200BLI | 200 MHz, 36-bit bus, but uses asynchronous OE and lacks JTAG; no ZZ sleep mode | Lower-cost industrial control where boundary scan and power management are not required | Select when JTAG testability and low-power sleep are non-critical and cost sensitivity outweighs feature set |
| MT55LSD256H36A200A | 200 MHz, 36-bit, supports DDR interface and differential clocks; higher power consumption (650 mA active) | Systems migrating toward DDR-capable memory controllers or requiring differential clocking for EMI reduction | Select when future-proofing for DDR migration or stringent EMI environments justify added complexity and power |
Compared with IS61WV102436BLL-200BLI and MT55LSD256H36A200A, the CY7C1480BV33-200AXC uniquely combines JTAG testability, ZZ sleep mode, and flexible 2.5/3.3 V I/O in a single 200 MHz pipelined SRAM - making it optimal for high-reliability, test-intensive embedded designs where debug access and power-aware operation are mandatory.
Availability
CY7C1480BV33-200AXC is available at Aetrix Electronics and suitable for high-speed CPU cache subsystems, network packet buffering, industrial motion control, and medical imaging frame stores requiring stable component supply across extended production lifecycles.
Supply support for CY7C1480BV33-200AXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable solutions for industrial, automotive, and communications markets.
The CY7C1480BV33 belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic, low-latency memory subsystems in performance-critical computing and real-time control applications.
FAQ
What is the function of the MODE pin on CY7C1480BV33-200AXC?
The MODE pin selects between Intel Pentium®-compatible interleaved burst addressing and linear burst addressing. It is sampled at power-up or reset and latched internally; changing MODE mid-operation has no effect until the next burst sequence begins. This allows hardware-level compatibility with different processor families without firmware modification.
Can CY7C1480BV33-200AXC operate with only 2.5 V I/O supply?
Yes - the device supports 2.5 V I/O operation while maintaining 3.3 V core supply. VDDQ must be set to 2.5 V, and all I/O signals (DQ/DQP, OE, ADV, etc.) comply with JESD8-5 2.5 V logic levels. Core logic remains powered by 3.3 V on VDD, ensuring full-speed operation independent of I/O voltage.
How does the ZZ sleep mode affect timing and power consumption?
In ZZ mode (pin HIGH), the device enters a non-time-critical retention state: core clocks halt, I/O drivers disable, and active current drops to CMOS standby level (120 mA max). Data is retained, but all synchronous operations suspend until ZZ returns LOW and a valid clock edge occurs - no reinitialization is required.
Is the CY7C1480BV33-200AXC pin-compatible with CY7C1482BV33-200AXC?
No - although both share identical speed grade and package options, CY7C1480BV33 is organized as 2M × 36 (72 Mbit), while CY7C1482BV33 is 4M × 18 (also 72 Mbit) with different address pin mapping and burst counter behavior. Their FBGA pinouts differ in address and control signal assignments, making them functionally incompatible drop-in replacements.
CY7C1480BV33-200AXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1480BV33-200AXC FAQ
1.How can I place an order for CY7C1480BV33-200AXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1480BV33-200AXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1480BV33-200AXC reliable?
The price and inventory of CY7C1480BV33-200AXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1480BV33-200AXC is usually 5 days.
3.What payment methods are accepted for CY7C1480BV33-200AXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1480BV33-200AXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1480BV33-200AXC?
CY7C1480BV33-200AXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1480BV33-200AXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1480BV33-200AXC?
For technical support, including CY7C1480BV33-200AXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1480BV33-200AXC requirements.
6.How does Aetrix verify that CY7C1480BV33-200AXC is sourced from the original manufacturer or authorized distributors?
All CY7C1480BV33-200AXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1480BV33-200AXC meets industry standards.
7.What is the process for return or replacement of CY7C1480BV33-200AXC?
All CY7C1480BV33-200AXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1480BV33-200AXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1480BV33-200AXC part is unused and in its original packaging.
Return procedure for CY7C1480BV33-200AXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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