Infineon Technologies CY7C1480V33-200AXCT
- Part No.:
- CY7C1480V33-200AXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1480V33-200AXCT.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,483
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1480V33-200AXCT from Cypress Semiconductor is a 72-Mbit pipelined synchronous SRAM configured as 2M × 36, operating at 200 MHz with 3.3 V core supply and 2.5/3.3 V I/O compatibility. It features registered inputs/outputs, synchronous self-timed writes, user-selectable Intel Pentium®-compatible burst modes, and IEEE 1149.1 JTAG boundary scan - deployed in high-speed CPU cache subsystems and network packet buffering.
For engineers reviewing the CY7C1480V33-200AXCT datasheet, CY7C1480V33-200AXCT pinout, CY7C1480V33-200AXCT application, or CY7C1480V33-200AXCT equivalent, key selection criteria include burst timing compliance (3.0 ns tCO), byte-write granularity (BWA–BWD + BWE), dual-strobe address capture (ADSP/ADSC), ZZ sleep mode support, and JEDEC-standard TQFP-100 packaging for board-level signal integrity.
Technical Context
This SRAM implements a two-bit synchronous wraparound burst counter controlled by ADV, ADSP, and ADSC to generate sequential addresses during pipelined read/write cycles. All address, data, and control inputs (CE1/CE2/CE3, GW, BWE, BWX) are registered on the rising edge of CLK, enabling deterministic 200 MHz bus operation.
The device supports both interleaved (Pentium®) and linear burst sequences selected via the MODE pin, with asynchronous OE for output tri-state control and asynchronous ZZ for low-power sleep. I/O voltage flexibility (2.5 V or 3.3 V) and separate VDDQ/VSSQ rails ensure compatibility with mixed-voltage memory subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 organization), enabling single-chip L2 cache for 32-bit processors with 64-byte line size. |
| Max Clock Frequency | 200 MHz - guarantees 5 ns cycle time for sustained burst transfers in high-throughput memory interfaces. |
| Access Time (tCO) | 3.0 ns - clock-to-output delay measured at 200 MHz, critical for meeting setup/hold timing in synchronous bus designs. |
| Supply Voltages | VDD = 3.3 V ± 0.3 V (core); VDDQ = 2.5 V or 3.3 V (I/O) - supports interoperability with both legacy and modern logic families. |
| Burst Mode Control | MODE pin selects Intel Pentium®-interleaved or linear sequence - ensures compatibility with specific CPU address-generation logic. |
| Write Architecture | Synchronous self-timed writes with GW override and four independent byte-write enables (BWA–BWD) - enables precise 8-bit data updates without read-modify-write overhead. |
| Power Management | Asynchronous ZZ sleep mode (active HIGH) reduces standby current to ≤120 mA while preserving data integrity - suitable for power-constrained embedded systems. |
Pinout & Package
Package: JEDEC-standard Pb-free 100-pin Thin Quad Flat Pack (TQFP), 14 × 20 × 1.4 mm, with exposed thermal pad (not electrically connected). Pin pitch: 0.5 mm. Compatible with standard reflow profiles per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Positive-edge-triggered master clock synchronizing all register inputs and burst counter advancement. |
| ADSP / ADSC | Address strobe (processor/controller) | Edge-sensitive enable signals that latch A[1:0] and full address into registers; ADSP takes precedence when both asserted. |
| ADV | Burst advance control | Active-LOW signal incrementing internal 2-bit counter to generate next burst address on rising CLK edge. |
| BWA–BWD, BWE, GW | Byte write controls | Four independent byte masks + enable + global override - enables flexible 8/16/32/64-bit write granularity without external logic. |
| DQA–DQD, DQPA–DQPD | Data I/O (36-bit bus) | 32 data bits + 4 parity bits; direction controlled by OE; registered on CLK rise for synchronous output delivery. |
| OE, ZZ | Output enable / sleep | Asynchronous OE tri-states outputs; ZZ places core in low-power retention state - both bypass clock domain for immediate effect. |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined synchronous interface | Full register-to-register timing at 200 MHz eliminates external wait-state logic in CPU/memory bridges. |
| User-selectable burst order | MODE pin configures interleaved (Pentium®) or linear addressing - matches native CPU burst behavior without glue logic. |
| Independent byte-write capability | Four BWA–BWD lines + BWE allow simultaneous 8-bit updates across any subset of 36-bit data bus - avoids destructive full-word writes. |
| JTAG boundary scan (IEEE 1149.1) | Enables in-system test and debug of PCB interconnects without requiring physical probe access to high-speed memory buses. |
| Dual-voltage I/O (2.5 V / 3.3 V) | VDDQ rail decoupled from core VDD - permits direct interfacing with both older 3.3 V and newer 2.5 V ASIC/FPGA I/O banks. |
Applications
| High-Performance CPU Cache | Network Packet Buffering |
|---|---|
|
Use Scenario: Secondary cache for x86-compatible microprocessors requiring low-latency, burst-mode memory access. IC Role / Device Role / Timing Role: Pipelined SRAM acting as L2 cache controller interface, delivering 3.0 ns tCO-aligned data on every clock edge during burst reads. Use Value: Eliminates wait states in 200 MHz front-side bus designs by matching Pentium®-interleaved burst timing and supporting 4-word burst depth. |
Use Scenario: Temporary storage for variable-length Ethernet or ATM packets in switching fabric line cards. IC Role / Device Role / Timing Role: High-bandwidth buffer staging incoming/outgoing frames with synchronous write-enable granularity for partial packet updates. Use Value: Byte-write select (BWA–BWD) enables efficient header modification without rewriting entire packet payloads, reducing latency and bus contention. |
| Industrial Motion Controller Memory | Avionics Data Acquisition Buffer |
|
Use Scenario: Real-time position/velocity history storage in servo drive firmware executing deterministic motion profiles. IC Role / Device Role / Timing Role: Deterministic-access SRAM providing jitter-free data logging at fixed intervals synchronized to system clock. Use Value: ZZ sleep mode maintains data integrity during idle periods while drawing ≤120 mA, extending thermal margin in sealed enclosures. |
Use Scenario: Buffered acquisition of sensor telemetry (e.g., inertial measurement units) in DO-254-compliant flight control systems. IC Role / Device Role / Timing Role: Radiation-tolerant (qualified per industrial temp range) synchronous memory capturing time-stamped samples at 200 MHz burst rate. Use Value: JTAG boundary scan supports structural test coverage required for airborne hardware certification without adding test points. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2115L15PF | 4M × 18 organization, 15 ns access, 3.3 V only I/O, no ZZ sleep mode | Lacks burst counter and MODE-selectable interleaving; requires external address sequencing logic | Choose when lower density (36 Mbit) and simpler control interface outweigh need for burst automation. |
| ISSI IS61WV102436B | 1M × 36, 167 MHz max, no JTAG, no ADV/ADSP/ADSC strobes - asynchronous control model | Requires external clock-domain crossing and burst generation; incompatible with Pentium®-style burst protocols | Prefer for cost-sensitive, non-burst applications where pipelining and JTAG are unnecessary. |
Compared with IDT72V2115L15PF and IS61WV102436B, CY7C1480V33-200AXCT uniquely integrates burst counter logic, dual-address strobes, and IEEE 1149.1 scan - enabling drop-in replacement in Pentium®-based cache controllers without redesigning timing or test infrastructure.
Availability
CY7C1480V33-200AXCT is available at Aetrix Electronics and suitable for high-speed CPU cache subsystems, network packet buffering, industrial motion control, and avionics data acquisition requiring stable component supply and long-term lifecycle support.
Supply support for CY7C1480V33-200AXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and communications markets.
CY7C1480V33-200AXCT belongs to Cypress's high-speed synchronous SRAM product line, engineered specifically for deterministic, low-jitter memory subsystems in CPU caches and real-time networking equipment.
FAQ
What is the function of the MODE pin on CY7C1480V33-200AXCT?
The MODE pin selects between Intel Pentium®-interleaved and linear burst address sequences. When MODE = LOW, the device uses interleaved addressing (0, 2, 4, 6); when MODE = HIGH, it uses linear addressing (0, 1, 2, 3). This configuration is sampled at power-up and remains latched until reset or power cycle.
Can CY7C1480V33-200AXCT operate with 2.5 V I/O while maintaining 3.3 V core supply?
Yes. The device supports independent VDDQ (2.5 V or 3.3 V) and VDD (3.3 V ±0.3 V) supplies. VDDQ powers all I/O buffers and must be stable before VDD ramps; this allows direct interfacing with 2.5 V FPGAs or ASICs while retaining full 3.3 V core performance and timing margins.
How does the ZZ sleep mode affect data retention and wake-up timing?
In ZZ mode (pin driven HIGH), the SRAM enters a low-power retention state with core current ≤120 mA. Data is preserved indefinitely as long as VDD remains within specification. Wake-up is asynchronous and complete within one CLK cycle after ZZ returns LOW - no additional stabilization delay is required.
Is JTAG boundary scan enabled by default on CY7C1480V33-200AXCT?
Yes. IEEE 1149.1 JTAG is factory-enabled and active whenever TCK, TMS, and TDI are driven per JTAG protocol. The TAP controller operates independently of memory function and supports instruction register loading, data register scan, and IDCODE read - no configuration fuse or software initialization is needed.
CY7C1480V33-200AXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1480V33-200AXCT FAQ
1.How can I place an order for CY7C1480V33-200AXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1480V33-200AXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1480V33-200AXCT reliable?
The price and inventory of CY7C1480V33-200AXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1480V33-200AXCT is usually 5 days.
3.What payment methods are accepted for CY7C1480V33-200AXCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1480V33-200AXCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1480V33-200AXCT?
CY7C1480V33-200AXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1480V33-200AXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1480V33-200AXCT?
For technical support, including CY7C1480V33-200AXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1480V33-200AXCT requirements.
6.How does Aetrix verify that CY7C1480V33-200AXCT is sourced from the original manufacturer or authorized distributors?
All CY7C1480V33-200AXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1480V33-200AXCT meets industry standards.
7.What is the process for return or replacement of CY7C1480V33-200AXCT?
All CY7C1480V33-200AXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1480V33-200AXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1480V33-200AXCT part is unused and in its original packaging.
Return procedure for CY7C1480V33-200AXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1480V33-200AXCT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

