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Infineon Technologies CY7C1481BV33-133AXI
- Part No.:
- CY7C1481BV33-133AXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
CY7C1481BV33-133AXI.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,293
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Product details
Overview
CY7C1481BV33-133AXI from Infineon Technologies (formerly Cypress) is a 72-Mbit (2M × 36) synchronous flow-through SRAM optimized for high-speed secondary cache in Pentium®-class microprocessor systems. It supports 133 MHz bus operation with 6.5 ns clock-to-output delay, dual VDD/VDDQ supplies (3.3 V core / 2.5 V or 3.3 V I/O), and user-selectable interleaved or linear burst sequences via the MODE pin.
For engineers reviewing the CY7C1481BV33-133AXI datasheet, CY7C1481BV33-133AXI pinout, CY7C1481BV33-133AXI application, or CY7C1481BV33-133AXI equivalent, key selection criteria include burst timing compliance with Intel® Pentium® cache protocols, JEDEC-standard TQFP/BGA package compatibility, synchronous self-timed write capability, and ZZ sleep mode support for low-power standby.
Technical Context
The device implements a 2-bit on-chip wraparound burst counter that latches A[1:0] at the rising edge of CLK when ADSP or ADSC is asserted, then auto-increments address for subsequent burst cycles controlled by ADV. All synchronous inputs-including CE1/CE2/CE3, BWx, BWE, GW, and OE-are registered on CLK's rising edge, while OE and ZZ remain asynchronous.
It supports dual I/O voltage operation (VDDQ = 2.5 V or 3.3 V) with JESD8-5-compliant interfaces, IEEE 1149.1 JTAG boundary scan (BGA only), and separate processor (ADSP) and controller (ADSC) address strobes to enable flexible cache coherency architectures in multi-master systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (2M × 36 bits), enabling full 36-bit data path for Pentium-class L2 cache subsystems |
| Max Clock Frequency | 133 MHz - guarantees synchronous interface timing alignment with legacy x86 CPU front-side buses |
| Access Time (tCDV) | 6.5 ns - defines minimum clock-to-data valid window for reliable read capture in high-speed pipelines |
| VDD / VDDQ | 3.3 V core / 2.5 V or 3.3 V I/O - allows interoperability with both 2.5 V and 3.3 V logic domains without level shifters |
| Burst Mode Control | MODE pin selects interleaved (HIGH) or linear (LOW) addressing - matches Pentium® or i486™ burst protocol requirements |
| Power Consumption | 335 mA max operating current - constrains thermal design for densely packed cache modules |
| Sleep Mode | ZZ pin enables non-time-critical sleep with data retention - reduces idle power in burst-inactive periods |
Pinout & Package
Available in JEDEC-standard Pb-free 100-pin TQFP (14 × 20 × 1.4 mm) and 119-ball BGA packages. TQFP variant excludes JTAG pins (TDO/TDI/TMS/TCK); BGA includes full IEEE 1149.1 boundary scan support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Synchronous clock input | Edge-triggered master timing reference for all registered inputs and internal burst counter advancement |
| ADSP / ADSC | Address strobe inputs | Separate processor- and controller-initiated address capture - enables cache coherency arbitration in dual-bus systems |
| ADV | Burst address advance control | Drives automatic increment of internal 2-bit burst counter during multi-cycle burst reads/writes |
| MODE | Burst sequence selector | Static strap pin determining interleaved (Pentium®) vs. linear (i486™) address order - must be stable during operation |
| ZZ | Asynchronous sleep enable | High-active entry into low-power retention mode with no timing constraints - simplifies power management sequencing |
| BWA–BWD, BWE | Byte write controls | Four independent byte write enables + global write enable - supports granular 8-bit writes within 36-bit word |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through architecture | Eliminates pipeline stalls by delivering data on same clock cycle as address registration - critical for zero-wait-state cache |
| Synchronous self-timed write | Internal write completion detection ensures deterministic timing without external handshake - simplifies controller logic |
| Asynchronous OE and ZZ | Enables immediate output disable and sleep entry independent of clock phase - improves system-level power responsiveness |
| Dual VDDQ support | Allows direct interfacing with 2.5 V or 3.3 V I/O rails - avoids external voltage translation in mixed-voltage designs |
| JTAG boundary scan (BGA) | Supports IEEE 1149.1 test access for board-level interconnect verification - essential for high-reliability embedded manufacturing |
Applications
| Intel Pentium® L2 Cache Module | i486™ System Accelerator |
|---|---|
Use Scenario: High-speed secondary cache buffer between Pentium® CPU and main memory in desktop/workstation motherboards. IC Role / Device Role / Timing Role: Synchronous flow-through SRAM acting as burst-accessible cache line store with 6.5 ns tCDV timing compliance. Use Value: Enables zero-wait-state cache reads matching Pentium®'s 133 MHz FSB timing, eliminating CPU pipeline bubbles during burst fetches. | Use Scenario: Performance-boosting cache expansion for industrial i486™-based control systems requiring deterministic latency. IC Role / Device Role / Timing Role: Linear-burst SRAM configured via MODE pin to match i486™'s sequential address progression. Use Value: Delivers sub-10 ns access with linear addressing - sustains sustained throughput in real-time motion control loops. |
| Multi-Processor Cache Coherency Node | Legacy Embedded Test Equipment Memory Buffer |
Use Scenario: Shared cache resource in dual-CPU x86 systems where ADSP/ADSC separation manages address arbitration. IC Role / Device Role / Timing Role: Dual-strobe SRAM supporting independent processor and controller address initiation with synchronized burst advancement. Use Value: Allows concurrent cache access from two masters without external glue logic - reduces PCB complexity and signal routing congestion. | Use Scenario: High-reliability data buffering in automated test equipment using legacy 3.3 V logic families. IC Role / Device Role / Timing Role: Flow-through SRAM with ZZ sleep mode and JTAG testability (BGA) for field-serviceable instrumentation. Use Value: Ensures long-term data retention during idle periods and enables in-system boundary scan validation - meeting MIL-STD-883 Class B requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256B-133JCIN | 256K × 36 organization (9-Mbit), 133 MHz, 3.3 V only (no VDDQ flexibility) | Lacks dual VDDQ support and ZZ sleep mode - unsuitable for mixed-voltage or low-power standby designs | Select when lower density suffices and system uses uniform 3.3 V I/O only |
| IS61WV102436BLL-133TQLI | 1M × 36 (36-Mbit), 133 MHz, supports 2.5 V/3.3 V I/O but no JTAG or MODE-selectable burst order | Fixed linear burst only - incompatible with Pentium®-protocol systems requiring interleaved addressing | Select for cost-sensitive linear-burst applications where JTAG and burst flexibility are not required |
Compared with AS7C3256B-133JCIN and IS61WV102436BLL-133TQLI, CY7C1481BV33-133AXI uniquely combines 72-Mbit density, dual-VDDQ support, MODE-configurable burst order, and ZZ sleep - making it the only option for Pentium®-compatible L2 cache with mixed-voltage and low-power requirements.
Availability
CY7C1481BV33-133AXI is available at Aetrix Electronics and suitable for Intel Pentium® L2 cache modules, i486™ system accelerators, and multi-processor cache coherency nodes requiring stable component supply across extended product lifecycles.
Supply support for CY7C1481BV33-133AXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions derived from its acquisition of Cypress Semiconductor.
This part belongs to the legacy Cypress synchronous SRAM product line, designed specifically for high-performance x86-compatible cache subsystems requiring precise burst timing, low-latency flow-through access, and robust industrial temperature operation.
FAQ
What is the function of the MODE pin, and how must it be configured?
The MODE pin selects burst address sequence: HIGH (or floating) enables interleaved burst for Pentium® compatibility; LOW (tied to GND) enables linear burst for i486™ systems. It is a static strap pin - configuration must be fixed before operation and cannot change dynamically during burst cycles. Internal pull-up ensures default interleaved mode if left unconnected.
Does CY7C1481BV33-133AXI support JTAG boundary scan in both package types?
No. JTAG (TDO/TDI/TMS/TCK) is available only in the 119-ball BGA package per datasheet page 5 footnote. The 100-pin TQFP variant omits these pins entirely. Boundary scan functionality is therefore package-dependent and must be verified against the ordering code suffix (e.g., "AXI" denotes TQFP; "BAXI" would indicate BGA - though this specific suffix is not used for CY7C1481BV33).
How does the ZZ sleep mode interact with synchronous timing requirements?
ZZ is fully asynchronous: asserting it HIGH places the device in sleep mode immediately, with no clock dependency or timing constraints. Data integrity is preserved, and wake-up occurs synchronously on the next active CLK edge after ZZ returns LOW. This eliminates need for clock-gating logic and simplifies power state transitions in cache controllers.
Can CY7C1481BV33-133AXI operate with VDDQ = 2.5 V while VDD remains at 3.3 V?
Yes. The device is explicitly specified for 3.3 V core (VDD) and independent 2.5 V or 3.3 V I/O (VDDQ) operation per datasheet Section "Features" and Pin Definitions. This dual-supply capability allows direct interfacing with 2.5 V ASICs or FPGAs without level shifters, provided VDDQ decoupling meets recommended 0.1 µF + 4.7 µF per VDDQ rail.
CY7C1481BV33-133AXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
CY7C1481BV33-133AXI FAQ
1.How can I place an order for CY7C1481BV33-133AXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1481BV33-133AXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1481BV33-133AXI reliable?
The price and inventory of CY7C1481BV33-133AXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1481BV33-133AXI is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1481BV33-133AXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1481BV33-133AXI?
CY7C1481BV33-133AXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1481BV33-133AXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1481BV33-133AXI?
For technical support, including CY7C1481BV33-133AXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1481BV33-133AXI requirements.
6.How does Aetrix verify that CY7C1481BV33-133AXI is sourced from the original manufacturer or authorized distributors?
All CY7C1481BV33-133AXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1481BV33-133AXI meets industry standards.
7.What is the process for return or replacement of CY7C1481BV33-133AXI?
All CY7C1481BV33-133AXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1481BV33-133AXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1481BV33-133AXI part is unused and in its original packaging.
Return procedure for CY7C1481BV33-133AXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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