Infineon Technologies CY7C1512AV18-167BZI
- Part No.:
- CY7C1512AV18-167BZI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1512AV18-167BZI.pdf
- Description:
- IC SRAM 72MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1512AV18-167BZI from Cypress Semiconductor is a 4M × 18 (72-Mbit), 1.8V QDR® II SRAM with dual independent read/write ports, 167 MHz maximum operating frequency, 1.5-cycle read latency (DLL enabled), and 165-ball FBGA (15 × 17 × 1.4 mm) package. It delivers concurrent burst transfers of two 18-bit words per access for high-bandwidth packet buffering in network line cards.
For engineers reviewing the CY7C1512AV18-167BZI datasheet, CY7C1512AV18-167BZI pinout, CY7C1512AV18-167BZI application, or CY7C1512AV18-167BZI equivalent, key selection criteria include DDR read/write timing, echo clock (CQ/CQ) support for source-synchronous capture, HSTL-18 I/O compliance, DLL-enabled latency control, and depth expansion via RPS/WPS port selects.
Technical Context
This QDR II SRAM implements separate synchronous read and write data paths with fully independent address latching on K/K rising edges-eliminating bus turnaround and enabling true concurrent access. Its architecture uses dedicated input registers for D[17:0], BWS[1:0], RPS, WPS, and A[20:0], all clocked by K/K, and output registers for Q[17:0] clocked by C/C.
The device supports both dual-clock mode (K/K for inputs, C/C for outputs + echo clocks CQ/CQ) and single-clock mode (K/K only), with DLL enabled by default to achieve 1.5-cycle read latency at 167 MHz. DOFF pin disables DLL to revert to QDR I timing (1-cycle latency) and reduces max frequency to 167 MHz with relaxed setup/hold margins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 4M × 18 (72 Mbit); two internal 2M × 18 arrays enable depth expansion |
| Max Operating Frequency | 167 MHz - defines maximum sustained burst throughput of 668 MB/s (2 × 18-bit × 167 MHz) |
| Read Latency | 1.5 cycles (DLL enabled) - determines minimum time from RPS assertion to first valid Q-word at C edge |
| I/O Voltage | VDDQ = 1.4 V to 1.8 V - sets HSTL-18 compatible output drive strength and termination reference |
| Core Supply | VDD = 1.8 V ±0.1 V - powers internal logic and memory array; requires low-noise regulation |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm); 0.8 mm ball pitch; RoHS-compliant Pb-free option available |
| Output Interface | DDR on Q[17:0] - data valid on both rising edges of C/C, enabling 334 MT/s effective data rate |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, JEDEC MO-270AC compliant. Thermal pad exposed on underside for enhanced heat dissipation in high-throughput operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | Latched on rising edges of K/K; supports byte-write via BWS[1:0] to preserve unselected bytes |
| Q[17:0] | Synchronous read data output | Driven on rising edges of C/C; tristated automatically after burst completion when RPS deasserted |
| RPS / WPS | Port select controls | Active-low enables read/write port independently; enables depth expansion without external gating logic |
| C / C, CQ / CQ | Output timing & echo clocks | C/C clock Q-data; CQ/CQ are phase-aligned echoes used by controller for source-synchronous capture alignment |
| K / K | Input timing clocks | Rising edges latch all synchronous inputs (A, D, RPS, WPS, BWS); define system timing reference domain |
| DOFF | DLL enable/disable | Pulled HIGH for QDR II mode (1.5-cycle latency); tied LOW for QDR I fallback (1-cycle latency, ≤167 MHz) |
| ZQ | Output impedance calibration | Connects to external 240 Ω resistor to ground to calibrate Q/CQ output driver impedance to 48 Ω (0.2 × RQ) |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates bus turnaround overhead and contention; enables full-duplex memory access in packet-forwarding pipelines |
| 2-Word Burst Architecture | Each access delivers two sequential 18-bit words - matches typical 32-/64-bit bus widths with minimal cycle waste |
| Echo Clocks (CQ/CQ) | Phase-matched to C/C outputs; allows controller to sample Q-data using CQ as capture clock - removes flight-time skew |
| HSTL-18 Compatible I/O | VDDQ-referenced 1.4–1.8 V outputs with programmable drive strength - ensures signal integrity on high-speed backplanes |
| JTAG 1149.1 Test Access | Full boundary-scan support (TDO/TCK/TMS/TDI) - enables in-system test and debug without additional probe points |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/40G Ethernet switch ASIC interfaces. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-wait-state buffer between serializer/deserializer and traffic manager; CQ/CQ clocks synchronize read data capture at line-rate. Use Value: Concurrent read/write eliminates arbitration delay, sustaining 668 MB/s throughput required for full-duplex 10Gbps line rates. |
Use Scenario: Depth-expanded memory subsystem in OC-192 SONET framer modules handling multiple TDM channels. IC Role / Device Role / Timing Role: QDR II SRAM configured in x18 parallel banks; RPS/WPS signals manage channel-specific read/write arbitration across 16+ devices. Use Value: Independent port selects allow per-channel memory access without global bus contention, reducing jitter in timing-critical TDM recovery. |
| High-Speed Test Equipment Memory | Avionics Data Acquisition Buffer |
|
Use Scenario: Capturing real-time waveform samples from multi-GHz digitizers in automated test systems. IC Role / Device Role / Timing Role: Write port accepts sampled data at 167 MHz; read port streams bursts to FPGA-based FFT engine using C/C timing. Use Value: 1.5-cycle DLL latency ensures deterministic write-to-read turnaround, critical for coherent multi-segment capture windows. |
Use Scenario: Buffered sensor fusion data storage in flight control computers requiring DO-254 compliance. IC Role / Device Role / Timing Role: SRAM stores synchronized IMU/GPS timestamps and telemetry; DOFF pin hardwired HIGH for guaranteed QDR II timing behavior. Use Value: JTAG boundary scan and deterministic DDR timing simplify verification of memory subsystem timing closure under EMI stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10PA | 36-bit bus width, 10 ns access, 3.3 V core/I/O; no echo clocks or DLL; asynchronous reset | Targeted at legacy telecom systems with wider buses and looser timing; lacks source-synchronous capture support | Select when migrating older designs with 36-bit interfaces and no need for CQ/CQ deskew capability |
| ISSI IS61WV102418B | 1M × 18, 165 MHz, 3.3 V, single-port sync SRAM; no DDR, no echo clocks, no port separation | Suitable for cost-sensitive control-plane buffers where concurrency is not required | Choose only for non-real-time buffering where 334 MB/s peak bandwidth and concurrent access are unnecessary |
Compared with IDT72T3615L10PA and IS61WV102418B, CY7C1512AV18-167BZI uniquely provides DDR dual-port operation with echo clocks and DLL-controlled latency-enabling deterministic, skew-tolerant, full-duplex memory access essential for modern packet-processing architectures.
Availability
CY7C1512AV18-167BZI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and high-speed test equipment requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for CY7C1512AV18-167BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial and communications markets.
CY7C1512AV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent memory access in packet-switched infrastructure and high-speed instrumentation.
FAQ
What is the function of the DOFF pin on CY7C1512AV18-167BZI?
The DOFF pin disables the internal Delay Lock Loop (DLL) when pulled LOW, forcing the device into QDR I mode with 1-cycle read latency and relaxed timing margins. When pulled HIGH (typically via 10 kΩ resistor to VDDQ), DLL is active, enabling 1.5-cycle latency and tighter timing at up to 167 MHz. This pin must never be left floating.
How does the ZQ pin affect output impedance calibration?
ZQ connects to an external 240 Ω resistor to ground, allowing the device to calibrate its Q[17:0] and CQ/CQ output drivers to 48 Ω (0.2 × RQ). This ensures consistent HSTL-18 signal integrity across voltage/temperature variations. Connecting ZQ directly to VDDQ enables minimum-impedance mode; connecting to GND or leaving it open is prohibited.
Can CY7C1512AV18-167BZI operate in single-clock mode?
Yes - by using only K/K as the sole clock pair and ignoring C/C, the device operates in single-clock mode. In this configuration, Q[17:0] data is clocked out on K/K edges instead of C/C, and CQ/CQ are generated relative to K/K. All timing parameters shift accordingly, and echo clock utility for deskew is lost.
What is the role of BWS[1:0] in byte-write operations?
BWS0 controls D[8:0] and BWS1 controls D[17:9]; both are sampled on K/K rising edges during write cycles. Asserting either signal writes the corresponding 9-bit byte; deasserting preserves existing memory content in that byte lane. This enables efficient read-modify-write sequences without full-word reads or external logic.
CY7C1512AV18-167BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 72Mbit
- Memory Organization:
- 4M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1512AV18-167BZI FAQ
1.How can I place an order for CY7C1512AV18-167BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1512AV18-167BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1512AV18-167BZI reliable?
The price and inventory of CY7C1512AV18-167BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1512AV18-167BZI is usually 5 days.
3.What payment methods are accepted for CY7C1512AV18-167BZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1512AV18-167BZI transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1512AV18-167BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1512AV18-167BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1512AV18-167BZI?
For technical support, including CY7C1512AV18-167BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1512AV18-167BZI requirements.
6.How does Aetrix verify that CY7C1512AV18-167BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1512AV18-167BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1512AV18-167BZI meets industry standards.
7.What is the process for return or replacement of CY7C1512AV18-167BZI?
All CY7C1512AV18-167BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1512AV18-167BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1512AV18-167BZI part is unused and in its original packaging.
Return procedure for CY7C1512AV18-167BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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